Apparatus and method for processing substrate

Patent metadata

Field	Value
Publication number	US-11495474-B2
Application number	US-202017026389-A
Country	US
Kind code	B2
Filing date	Sep 21, 2020
Priority date	Nov 30, 2017
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

First claim

What is claimed is:

1. A method for processing a substrate, the method comprising:
a liquid processing step for performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber;
a transfer step for transferring the substrate from the liquid processing chamber to a drying chamber; and
a drying step for drying the substrate in the drying chamber,
wherein the liquid processing step comprises: a liquid supply step for rotating the substrate and supplying the processing liquid onto the substrate, and a liquid level adjustment step for stopping supplying the processing liquid and rotating the substrate after the liquid supply step,
wherein the substrate is transferred from the liquid processing chamber to the drying chamber right after the liquid level adjustment step such that in the transfer step, a height of the processing liquid remaining on an edge region of the substrate is higher than a height of the processing liquid remaining on a central region of the substrate.

2. The method of claim 1 , wherein in the liquid level adjustment step, a liquid level of the processing liquid on the substrate is controlled such that a height of the processing liquid on the edge region of the substrate is higher than a height of the processing liquid on the central region of the substrate.

3. The method of claim 1 , wherein a rotation speed of the substrate in the liquid supply step is different from a rotation speed of the substrate in the liquid level adjustment step.

4. The method of claim 1 , wherein a rotation speed of the substrate in the liquid supply step is higher than a rotation speed of the substrate in the liquid level adjustment step.

5. The method of claim 1 , wherein the liquid supply step comprises:
a first supply step for rotating the substrate and supplying the processing liquid onto a surface of the substrate; and
a second supply step for rotating the substrate and supplying the processing liquid onto the edge region of the substrate.

6. The method of claim 5 , wherein the second supply step is performed after the first supply step.

7. The method of claim 6 , wherein a rotation speed of the substrate in the first supply step is different from a rotation speed of the substrate in the second supply step.

8. The method of claim 6 , wherein a rotation speed of the substrate in the first supply step is higher than a rotation speed of the substrate in the second supply step.

9. The method of claim 6 , wherein the processing liquid in the first supply step and the second supply step is supplied from a same nozzle, and a position of the nozzle in the first supply step is different from a position of the nozzle in the second supply step.

10. The method of claim 6 , wherein the liquid level adjustment step is performed after the second supply step.

11. The method of claim 1 , wherein the processing liquid comprises an organic solvent.

12. The method of claim 1 , wherein the processing liquid comprises isopropyl alcohol.

13. The method of claim 1 , wherein in the drying step, the substrate is dried while the edge region of the substrate excluding the central region of the substrate is supported by a support unit.

14. The method of claim 1 , wherein in the drying step, the substrate is dried using a supercritical fluid.

Assignees

• Semes Co Ltd

Inventors

• Lee Yong Hee
• Lee Young Hun
• Jung Jinwoo
• Lim Eui Sang

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0408

  for drying · CPC title