Multilayer ceramic electronic component including external electrode having surface roughness

US11495408B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11495408-B2
Application numberUS-202016842455-A
CountryUS
Kind codeB2
Filing dateApr 7, 2020
Priority dateSep 19, 2019
Publication dateNov 8, 2022
Grant dateNov 8, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively. The first and second external electrodes comprise first and second base electrodes disposed to be in contact with the ceramic body and having a first conductive metal, and first and second conductive layers disposed on the first and second base electrodes and having a second conductive metal, and the first and second conductive layers have an average surface roughness (Ra) of 10.0 μm or more.

First claim

Opening claim text (preview).

What is claimed is: 1. A multilayer ceramic electronic component, comprising: a ceramic body including a dielectric layer and first and second internal electrodes stacked in a third direction with the dielectric layer interposed therebetween, and having a third surface and a fourth surface opposed in a first direction, a fifth surface and a sixth surface opposed in a second direction, and a first surface and a second surface opposed in the third direction; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively, wherein the first external electrode comprises a first base electrode disposed to be in contact with the ceramic body and having a first conductive metal, a first conductive layer disposed on the first base electrode and having a second conductive metal, and a first terminal electrode covering the first conductive layer, the second external electrode comprises a second base electrode disposed to be in contact with the ceramic body and having the first conductive metal, a second conductive layer disposed on the second base electrode and having the second conductive metal, and a second terminal electrode covering the second conductive layer, and the first and second conductive layers have an average surface roughness (Ra) of 10.0 μm or more. 2. The multilayer ceramic electronic component of claim 1 , wherein the first and second base electrodes and the first and second conductive layers comprise conductive metals different from each other. 3. The multilayer ceramic electronic component of claim 1 , wherein the first and second base electrodes comprise the first conductive metal and glass. 4. The multilayer ceramic electronic component of claim 3 , wherein a region in which the first conductive metal and the second conductive metal are in contact with an interface between the first base electrode and the first second conductive layer or an interface between the second base electrode and the second conductive layer, and a region in which the glass and the second conductive metal are in contact, are randomly disposed. 5. The multilayer ceramic electronic component of claim 1 , wherein the first and second base electrodes comprise copper (Cu). 6. The multilayer ceramic electronic component of claim 1 , wherein the first and second base electrodes have an average surface roughness (Ra) of 1.0 μm or more. 7. The multilayer ceramic electronic component of claim 1 , wherein a standard reduction potential of the second conductive metal is higher than a standard reduction potential of the first conductive metal. 8. The multilayer ceramic electronic component of claim 1 , wherein the second conductive metal has a standard reduction potential of 0.1V or more. 9. The multilayer ceramic electronic component of claim 1 , wherein each of the first and second conductive layers is a single composition layer of the second conductive metal. 10. The multilayer ceramic electronic component of claim 1 , wherein each of the first and second conductive layers includes a reduced layer of the second conductive metal. 11. The multilayer ceramic electronic component of claim 1 , wherein the first and second conductive layers comprise one or more structures selected from a group consisting of nanoparticles, nanowires, nanorods, nanobars, nanobelts, nanodisks, nanotubes, and nanotetrapods. 12. A multilayer ceramic electronic component, comprising: a ceramic body including first and second internal electrodes and a dielectric layer disposed between the first and second internal electrodes; and an external electrode disposed on the ceramic body and connected to one of the first and second internal electrodes, wherein the external electrode comprises a base electrode in contact with the ceramic body and having a first conductive metal, and a conductive layer disposed on the base electrode and having a second conductive metal, an average surface roughness of an inner surface of the conductive layer in contact with the base electrode, and an average surface roughness of an outer surface of the conductive layer opposing the inner surface, are greater than an average surface roughness of a surface of the base electrode in contact with the ceramic body, a standard reduction potential of the second conductive metal is higher than a standard reduction potential of the first conductive metal, and the first conductive metal is copper (Cu). 13. The multilayer ceramic electronic component of claim 12 , wherein the base electrode and the conductive layer comprise conductive metals different from each other. 14. The multilayer ceramic electronic component of claim 12 , wherein the base electrode comprises the first conductive metal and glass. 15. The multilayer ceramic electronic component of claim 12 , wherein the conductive layer comprises one or more structures selected from a group consisting of nanoparticles, nanowires, nanorods, nanobars, nanobelts, nanodisks, nanotubes, and nanotetrapods. 16. The multilayer ceramic electronic component of claim 12 , further comprising a terminal electrode covering the conductive layer.

Assignees

Inventors

Classifications

  • based on alkaline earth titanates · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • H01G4/005Primary

    Electrodes · CPC title

  • electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11495408B2 cover?
A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively. The first and second external electrodes compris…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).