Depth information camera module and base assembly, projection assembly, electronic device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11493605-B2
Application number	US-201916429309-A
Country	US
Kind code	B2
Filing date	Jun 3, 2019
Priority date	Mar 18, 2018
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.

First claim

What is claimed is:

1. A depth information camera module, comprising:
a projection assembly, the projection assembly comprising a projection assembly circuit board and a projection unit, the projection unit being electrically connected to the projection assembly circuit board to project a laser to a to-be-detected object after being conducted;
a receiving assembly, the receiving assembly comprising a photosensitive element for receiving the laser reflected from the to-be-detected object; and
a base assembly, the base assembly comprising a circuit board and a base body, the base body being supported by the circuit board, the photosensitive element of the receiving assembly being electrically connected to the circuit board, the projection assembly circuit board being supported on a top side of the base body, the base assembly further comprising a conductive element, and the conductive element being disposed between the projection assembly circuit board and the circuit board for conducting the projection assembly to the circuit board.

2. The depth information camera module according to claim 1 , wherein a size of the projection assembly circuit board is smaller than a size of the circuit board.

3. The depth information camera module according to claim 2 , wherein a projection of the projection assembly circuit board relative to the circuit board is at least partially located within the circuit board.

4. The depth information camera module according to claim 3 , wherein the base body is integrally molded on the circuit board.

5. The depth information camera module according to claim 3 , wherein the base body is a separate component relative to the circuit board, and the base body is mounted to the circuit board.

6. The depth information camera module according to claim 4 , wherein the conductive element is integrally molded with the base body and embedded in the base body, the conductive element has a first electrical connection terminal and a second electrical connection terminal, the first electrical connection terminal is exposed on the top side of the base body for electrically connecting the projection assembly, and the second electrical connection terminal is electrically connected to the circuit board.

7. The depth information camera module according to claim 4 , wherein the conductive element is implemented as a flexible board, the flexible board extends integrally and folded between the projection assembly circuit board and the circuit board for conducting the circuit board and the projection assembly.

8. The depth information camera module according to claim 6 , wherein the projection assembly has an integral structure, the projection assembly circuit board has a front side and a back side opposite to the front side, the projection unit is mounted and electrically connected to the front side of the projection assembly circuit board, the projection assembly circuit board has a set of conductive terminals, the conductive terminals are located on the back side of the projection assembly circuit board, and when the projection assembly is mounted on the top side of the base body, the conductive terminals of the projection assembly are electrically connected to the first electrical connection terminals of the conductive elements respectively, to electrically connect the projection assembly to the circuit board.

9. The depth information camera module according to claim 8 , wherein the base body further has at least one anti-overflow groove, the at least one anti-overflow groove is formed concavely on the top side of the base body, the first electrical connection terminals of the conductive elements are respectively exposed to the at least one anti-overflow groove, and when the projection assembly is mounted on the top side of the base body, the conductive terminals of the projection assembly respectively correspond to the at least one anti-overflow groove, and are respectively electrically connected to the first electrical connection terminals of the conductive elements exposed in the at least one anti-overflow groove.

10. The depth information camera module according to claim 1 , further comprising at least one electronic component, wherein the at least one electronic component is mounted and electrically connected to the circuit board, and a portion of the at least one electronic component is located below the projection assembly circuit board.

11. The depth information camera module according to claim 10 , wherein the at least one electronic component comprises part of electronic components of the projection assembly.

12. The depth information camera module according to claim 10 , wherein the projection assembly circuit board is a ceramic substrate.

13. The depth information camera module according to claim 12 , wherein the base body further has a heat conductive through-hole penetrating through the base body to expose the projection assembly circuit board by the heat conductive through-hole.

14. A manufacturing method for a depth information camera module, comprising:
providing a base assembly, wherein the base assembly comprises a circuit board and a base body, the base body is supported on the circuit board, the base body has a carrying portion, the carrying portion is located on a top side of the base body, the base body further has an opening, and the opening corresponds to a photosensitive element mounted to the circuit board;
mounting an optical filtering element and an optical lens assembly to a photosensitive path of the photosensitive element;
mounting a projection assembly having a modular structure to the carrying portion of the base body; and
electrically connecting the projection assembly to the circuit board.

15. The manufacturing method for a depth information camera module according to claim 14 , wherein the base assembly further comprises a conductive element, the conductive element is integrally molded with the base body and embedded in the base body, the conductive element has a first electrical connection terminal and a second electrical connection terminal, the first electrical connection terminal is exposed on the top side of the base body for electrically connecting the projection assembly, and the second electrical connection terminal is electrically connected to the circuit board.

16. The manufacturing method for a depth information camera module according to claim 15 , wherein the electrically connecting the projection assembly to the circuit board comprises:
aligning conductive terminals located on a back side of a projection assembly circuit board of the projection assembly with at least one anti-overflow groove disposed on the carrying portion of the base body respectively;
applying a conducting medium to the at least one anti-overflow groove; and
electrically connecting the conductive terminals to the first electrical connection terminals of the conductive elements, the conducting medium is sealed in the at least one anti-overflow groove.

17. The manufacturing method for a depth information camera module according to claim 14 , wherein the base assembly further comprises a conductive element, the conductive element is implemented as a flexible board, and the flexible board extends integrally and folded between the projection assembly circuit board and the circuit board for conducting the circuit board and the projection assembly.

18. The manufacturing method for a depth information camera module according to claim 17 , wherein the electrically connecting the projection assembly to the circuit board comprises:
folding the flexible

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Chen Feifan
• Wang Zhongwei
• Rong Qi
• Zeng Junjie
• Wei Hangang
• Dai Beibei
• Pan Minjie

Classifications

• H04N23/56

  provided with illuminating means · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• G01S17/894 Primary

  Three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver pixels, e.g. time-of-flight cameras or flash lidar · CPC title

• G01S17/08 Primary

  for measuring distance only (indirect measurement G01S17/46; active triangulation systems G01S17/48) · CPC title