MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system

Patent metadata

Field	Value
Publication number	US-11492249-B2
Application number	US-201916400365-A
Country	US
Kind code	B2
Filing date	May 1, 2019
Priority date	May 16, 2018
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.

First claim

What is claimed is:

1. A MEMS sensor comprising:
a sensor package;
a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side;
a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion, and
a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.

2. The MEMS sensor as claimed in claim 1 , which is configured to be integrated into a MEMS sensor system whilst avoiding a fluidic short circuit between the first opening and the second opening.

3. The MEMS sensor as claimed in claim 1 , comprising an acoustically transparent material arranged in the first and/or second opening and having a signal damping of at most 3 dB(A).

4. The MEMS sensor as claimed in claim 3 , wherein the acoustically transparent material is acoustically coupled.

5. The MEMS sensor as claimed in claim 3 , wherein the acoustically transparent material is formed in a porous fashion.

6. The MEMS sensor as claimed in claim 3 , wherein the acoustically transparent material provides a water-tightness and/or an obstacle to the passage of particles for the first partial volume or the second partial volume.

7. The MEMS sensor as claimed in claim 3 , wherein the acoustically transparent material provides a setting of an acoustic coupling between the adjacent partial volume and the external environment.

8. The MEMS sensor as claimed in claim 1 , wherein the second partial volume is heatable by a pressure change, wherein the second opening is configured to at least partly reduce the heating.

9. The MEMS sensor as claimed in claim 1 , which is formed as a MEMS sound transducer.

10. The MEMS sensor as claimed in claim 1 , comprising an elastic element, which is arranged either in the first opening or in the second opening and is configured to alter a content of the first or second partial volume on the basis of a fluid pressure in the external environment.

11. The MEMS sensor as claimed in claim 1 , wherein the membrane has at least one membrane opening which fluidically couples the first partial volume and the second partial volume to one another, wherein a coupling by the membrane opening acts as a low-pass filter for a pressure change in the first partial volume and/or second partial volume.

12. The MEMS sensor as claimed in claim 1 , comprising an evaluation device configured to obtain a deflection signal from the membrane, said deflection signal having information about a deflection of the membrane, and to provide a processed deflection signal on the basis of a processing of the deflection signal, wherein the evaluation device is arranged within the sensor package.

13. The MEMS sensor as claimed in claim 1 , comprising a read-out circuit configured to obtain a processed deflection signal based on a deflection of the membrane and to provide a sensor signal, wherein the read-out circuit is electrically connectable to a system circuit.

14. The MEMS sensor as claimed in claim 1 , which comprises an optical emitter and is formed as a photoacoustic gas sensor.

15. A MEMS sensor comprising:
a sensor package;
a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side;
a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion;
a second opening in the sensor package, said second opening adjoining the second partial volume; and
an elastic element, which is arranged in the second opening and is configured to alter a content of the second partial volume on the basis of a fluid pressure in the external environment.

16. A MEMS sensor system comprising:
a system package having a system volume; and
a MEMS sensor comprising:
a sensor package;
a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side;
a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion;
a second opening in the sensor package, said second opening adjoining the second partial volume; and
an elastic element, which is arranged in the second opening and is configured to alter a content of the second partial volume on the basis of a fluid pressure in the external environment,

wherein the system volume is coupled to the first partial volume either via the first opening or via the second opening, wherein the MEMS sensor is fluidically coupled to an environment of the MEMS sensor system via the other opening of the first and second openings, and
wherein the system volume sets a resonant frequency of the membrane for fluid sound in the environment of the MEMS sensor system.

17. The MEMS sensor system as claimed in claim 16 , comprising a read-out circuit configured to obtain and/or to provide a processed deflection signal which correlates with a deflection of the membrane,
wherein the MEMS sensor system comprises a system circuit, which is electrically connected to the read-out circuit.

18. The MEMS sensor system as claimed in claim 16 , wherein the system package is configured to avoid a fluidic short circuit between the first opening and the second opening.

19. The MEMS sensor system as claimed in claim 16 , comprising a control unit configured to evaluate a propagation time difference of an acoustic signal between the first opening and the second opening and, using a deflection signal based on a deflection of the membrane or on the basis of a signal derived therefrom, to provide active sound suppression with respect to the deflection signal.

20. The MEMS sensor system as claimed in claim 16 , comprising a porous material, arranged in the opening between the MEMS sensor and the system volume.

21. The MEMS sensor system as claimed in claim 16 , comprising an elastic element, arranged either in the first opening or in the second opening such that the first partial volume or the second partial volume and the system volume are spaced apart from one another by the elastic element, wherein the elastic element is configured to influence a frequency response of the membrane on the basis of a fluid pressure in the system volume.

22. The MEMS sensor system as claimed in claim 21 , comprising a pressure control device for controlling the fluid pressure in the system volume on the basis of specification information which correlates with a frequency response to be set of the membrane.

23. The MEMS sensor system as claimed in claim 16 , which is embodied as a mobile device.

24. A method for producing a MEMS sensor system, t

Assignees

• Infineon Technologies Ag

Inventors

• Tumpold David
• Maier Dominic

Classifications

• B81B7/0009 Primary

  Structural features, others than packages, for protecting a device against environmental influences (B81C1/00777 takes precedence) · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• G01N2291/021

  Gases · CPC title

• B81B2201/0214

  Biosensors; Chemical sensors · CPC title