Ceramic and polymer composite, methods of making, and uses thereof

Patent metadata

Field	Value
Publication number	US-11490510-B2
Application number	US-202016734949-A
Country	US
Kind code	B2
Filing date	Jan 6, 2020
Priority date	Jul 27, 2016
Publication date	Nov 1, 2022
Grant date	Nov 1, 2022

Abstract

A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.

First claim

What is claimed:

1. A method of making a printed circuit board comprising a ceramic and polymer composite comprising:
contacting a surface of a porous ceramic sheet and a curable polymer,
wherein the porous ceramic sheet comprises a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity of from 50 to 15 vol %, based on the total volume of the composite,
wherein the porous ceramic sheet has a thickness of from 10 to 100 micrometers,
wherein the porous ceramic sheet has a volume percent of open pores of 15 to 50 vol % and
wherein the printed circuit board has a frequency dielectric constant of from 2.4 to 6.7 at 10 GHz.

2. The method of claim 1 further comprising:
forming the sintered porous ceramic sheet by at least one of tape casting, flame hydrolyzing, firing a green body ceramic having a pore former present in from 15 to 50 vol %, or a combination thereof.

3. The method of claim 1 , wherein the sintered porous ceramic comprises at least one of aluminum oxide, silicon oxide, or mixtures thereof.

4. The method of claim 1 , wherein a Young's modulus of the sintered porous ceramic continuous phase is from 50 to 210 GPa.

5. The method of claim 1 , wherein the sintered porous ceramic continuous phase has an overlapping sphere structure comprised of a plurality of partially fused adjacent spherical ceramic particles of at least one of aluminum oxide, silicon oxide, or mixtures thereof.

6. The method of claim 1 , wherein the sintered porous ceramic continuous phase is non-woven.

7. The method of claim 1 , wherein the curable polymer comprises a liquid or is in a liquid carrier.

8. The method of claim 1 , wherein the curable polymer comprises a mixture of: a crosslinkable polymer, a polymerizable and crosslinkable monomer, or a mixture thereof, and a crosslinker.

9. The method of claim 8 , wherein the crosslinker is selected from the group consisting of a glycidyl ether, a difunctional acrylate, a difunctional vinyl monomer, a difunctional hardener, or a mixture thereof.

10. The method of claim 1 , wherein the curable polymer comprises at least one of: an epoxy resin, an amine-epoxide resin, a phenolic resin, an isocyanate resin, an alkyd resin, an acrylate, a polystyrene, a polyimide, a polyamine, or a mixture thereof.

11. The method of claim 1 , wherein a viscosity of the curable polymer is from 0.6 cP to 2000 cP.

12. A method of making a printed circuit board comprising a ceramic and polymer composite comprising:
tape casting a ceramic slurry to form a ceramic green tape;
firing the green tape;
impregnating the fired tape with a curable polymer; and
curing the impregnated polymer to form the ceramic and polymer composite,
wherein the printed circuit board has a frequency dielectric constant of from 2.4 to 6.7 at 10 GHz.

13. The method of claim 12 , wherein the ceramic slurry comprises ceramic particles of at least one of aluminum oxide, silicon oxide, or mixtures thereof.

14. The method of claim 13 , wherein a median particle size of the ceramic particles is from 0.1 to 20 micrometers.

15. The method of claim 13 , wherein 90% of the ceramic particles have of particle size of less than 0.72 micrometers.

16. The method of claim 12 , wherein firing the green tape comprises bisque firing at from 1000 to 1600° C.

17. The method of claim 12 , wherein the curable polymer comprises a liquid or is in a liquid carrier.

18. The method of claim 12 , wherein the curable polymer comprises a mixture of: a crosslinkable polymer, a polymerizable and crosslinkable monomer, or a mixture thereof, and a crosslinker.

19. The method of claim 12 , wherein the curable polymer comprises at least one of: an epoxy resin, an amine-epoxide resin, a phenolic resin, an isocyanate resin, an alkyd resin, an acrylate, a polystyrene, a polyimide, a polyamine, or a mixture thereof.

Assignees

• Corning Inc

Inventors

• Miao Weiguo
• Ocampo Manuela
• Sorensen Michael Lesley
• Zimmermann James William

Classifications

• C04B41/83

  Macromolecular compounds · CPC title

• C04B41/483

  Polyacrylates · CPC title

• C04B41/009

  characterised by the material treated · CPC title

• H05K3/0047

  Drilling of holes · CPC title

• C04B41/4853

  Epoxides · CPC title