Substrate with electronic component embedded therein

Patent metadata

Field	Value
Publication number	US-11490503-B2
Application number	US-202117204058-A
Country	US
Kind code	B2
Filing date	Mar 17, 2021
Priority date	Jul 17, 2020
Publication date	Nov 1, 2022
Grant date	Nov 1, 2022

Abstract

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

First claim

What is claimed is:

1. A substrate with an electronic component embedded therein, comprising:
a core structure including a first insulating body, a plurality of first wiring layers respectively disposed on or in the first insulating body, and one or more first via layers disposed in the first insulating body, the core structure having a cavity penetrating through at least a portion of the first insulating body;
a first metal layer disposed on a bottom surface of the cavity;
an electronic component disposed on the first metal layer in the cavity;
a second metal layer spaced apart from an inner wall of the cavity and being in physical contact with a side surface of the electronic component; and
an insulating material disposed between the inner wall of the cavity and the second metal layer.

2. The substrate with the electronic component embedded therein of claim 1 , wherein the second metal layer surrounds four side surfaces of the electronic component.

3. The substrate with the electronic component embedded therein of claim 1 , wherein the second metal layer is physical contact with the first metal layer.

4. The substrate with the electronic component embedded therein of claim 3 , wherein the first metal layer has a groove portion, and
a portion of the second metal layer is disposed in the groove portion.

5. The substrate with the electronic component embedded therein of claim 4 , wherein the groove portion extends along four side surfaces of the electronic component.

6. The substrate with the electronic component embedded therein of claim 1 , further comprising a first passivation layer disposed below the core structure, having a plurality of first openings respectively exposing at least a portion of a first wiring layer disposed on a lowermost side of the plurality of first wiring layers and at least a portion of the first metal layer.

7. The substrate with the electronic component embedded therein of claim 1 , further comprising:
an encapsulant disposed on the core structure, and being as the insulating material disposed in at least a portion of the cavity and embedding at least a portion of the electronic component;
a second wiring layer disposed on the encapsulant; and
a second via layer penetrating through the encapsulant, and connecting the second wiring layer to each of the first wiring layer and the electronic component.

8. The substrate with the electronic component embedded therein of claim 7 , further comprising a second passivation layer disposed on the encapsulant, and having a plurality of second openings respectively exposing at least a portion of the second wiring layer.

9. The substrate with the electronic component embedded therein of claim 7 , further comprising:
a build-up structure including a second insulating body disposed on the encapsulant, one or more third wiring layers disposed on or in the second insulating body, and one or more third via layers disposed in the second insulating body; and
a second passivation layer disposed on the build-up structure, and having a plurality of second openings respectively exposing at least a portion of a third wiring layer disposed on an uppermost side of the one or more third wiring layers.

10. The substrate with the electronic component embedded therein of claim 1 , wherein the electronic component has a first surface on which a connection pad is disposed and a second surface opposite to the first surface, and the second surface is attached to the first metal layer through an adhesive film.

11. The substrate with the electronic component embedded therein of claim 1 , wherein the core structure comprises a first core insulating layer, a first core wiring layer embedded in a lower portion of the first core insulating layer, a second core wiring layer disposed on an upper surface of the first core insulating layer, and a first core via layer penetrating through the first core insulating layer, and connecting the first and second core wiring layers,
the cavity penetrates through the first core insulating layer,
the first insulating body comprises the first core insulating layer,
the first wiring layer comprises the first and second core wiring layers,
the first via layer comprises the first core via layer,
the first metal layer is located at a same level as the first core wiring layer, and
at least a portion of the first metal layer is embedded in the first core insulating layer.

12. The substrate with the electronic component embedded therein of claim 11 , wherein the core structure further comprises a second core insulating layer disposed on an upper surface of the first core insulating layer to cover the second core wiring layer, a second core wiring layer disposed on an upper surface of the second core insulating layer, and a second core via layer penetrating through the second core insulating layer and connecting the second and third core wiring layers,
the cavity further penetrates through the second core insulating layer,
the first insulating body further comprises the second core insulating layer,
the first wiring layer further comprises the third core wiring layer, and
the first via layer further comprises the second core via layer.

13. The substrate with the electronic component embedded therein of claim 11 , wherein lower surfaces of each of the first core insulating layer and the first core wiring layer have a first step, and
an upper surface of the first metal layer in a region exposed by the cavity and an upper surface of the first metal layer in a region embedded in the first core insulating layer have a second step.

14. A substrate with an electronic component embedded therein, comprising:
a core structure including a core insulating layer, a first core wiring layer embedded in a lower portion of the core insulating layer, a second core wiring layer disposed on an upper surface of the core insulating layer, and a core via layer penetrating through the core insulating layer and connecting the first and second core wiring layer, the core structure having a cavity penetrating through the core insulating layer;
a metal layer disposed on a bottom surface of the cavity, and having a pattern hole; and
an electronic component disposed on the metal layer in the cavity,
wherein the metal layer is located at a same level as the first core wiring layer, and
at least a portion of the metal layer is embedded in the core insulating layer.

15. The substrate with the electronic component embedded therein of claim 14 , wherein the metal layer comprises a plurality of metal patterns spaced apart from each other by the pattern hole,
at least a portion of the plurality of metal patterns is connected to at least one ground pattern among the first core wiring layer and the second core wiring layer, and
at least one of the remainder of the plurality of metal patterns is connected to at least one signal pattern among the first core wiring layer and the second core wiring layer.

16. A substrate, comprising:
a core structure having a cavity and including an insulating body, one or more first wiring layers disposed on or in the insulating body, and one or more via layers disposed in the insulating body and connected to the one or more first wiring layers;
a first metal layer disposed on or in the insulating layer;
an electronic component disposed on the first metal layer in the cavity; and
a second metal layer extending from the first metal layer to be in contact with a side surface of the electronic component;
wherein the first metal layer has a groove portion, and
a portion of the second metal layer is

Assignees

• Samsung Electro Mech

Inventors

• Park Chang Hwa
• Kim Chi Seong
• Lee Eun Heay
• Song Yo Han
• Hyung Gun Hwi
• Lee Jae Heun
• Kang Deok Man
• Park Jin Oh

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title