Power control solution for reducing thermal stress on an intermittently operable chipset controlling RF application for cooking

Patent metadata

Field	Value
Publication number	US-11490472-B2
Application number	US-201916705857-A
Country	US
Kind code	B2
Filing date	Dec 6, 2019
Priority date	Dec 6, 2018
Publication date	Nov 1, 2022
Grant date	Nov 1, 2022

Abstract

Control electronics may control power amplifier electronics associated with application of RF energy generated using solid state electronic components. The power amplifier electronics may be configured to control application of RF energy in an oven according to a cooking recipe at least in part based on a learning procedure that generates a power cycling between high and low powers when the learning procedure is executed. The control electronics may include processing circuitry configured to employ a thermal stress mitigation technique to control thermal stresses on the power amplifier electronics associated with the power cycling.

First claim

That which is claimed:

1. An oven comprising:
a cooking chamber configured to receive a food product; and
a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber using solid state electronic components to heat the food product,
wherein the solid state electronic components include power amplifier electronics and control electronics configured to control operation of the power amplifier electronics, the power amplifier electronics being configured to provide a signal into the cooking chamber via a launcher assembly operably coupled to the cooking chamber via a waveguide assembly,
wherein the power amplifier electronics are configured to control application of RF energy into the cooking chamber according to a cooking recipe at least in part based on a learning procedure that generates a power cycling between high and low powers when the learning procedure is executed, and
wherein the control electronics are configured to employ a thermal stress mitigation technique to control thermal stresses on the power amplifier electronics associated with the power cycling.

2. The oven of claim 1 , wherein the thermal stress mitigation technique comprises setting a direct current (DC) bias current after execution of the recipe at a level greater than about 10% of DC bias current at full power.

3. The oven of claim 1 , wherein the thermal stress mitigation technique comprises applying a minimum power level during execution of the learning procedure at greater than 15% of full power.

4. The oven of claim 1 , wherein the thermal stress mitigation technique comprises applying a minimum power level during execution of the recipe at greater than 15% of full power.

5. The oven of claim 1 , wherein the thermal stress mitigation technique comprises applying a minimum power level and a maximum power level during execution of the recipe such that a power envelope defined between the minimum and maximum power levels is less than 85% of full power.

6. The oven of claim 1 , wherein the thermal stress mitigation technique comprises applying a power change delay in response to the power cycling.

7. The oven of claim 6 , wherein the power change delay is applied responsive to power reduction from full power to a minimum power level associated with the learning procedure.

8. The oven of claim 7 , wherein the power change delay is also applied responsive to power increase from the minimum power level associated with the learning procedure to the full power.

9. The oven of claim 6 , wherein the power change delay comprises a series of ramped power changes responsive to power reduction between full power and a minimum power level associated with the learning procedure.

10. The oven of claim 9 , wherein the ramped power changes are applied about every 10 ms to 1 s during power increases and power decreases between the full power and the minimum power level associated with the learning procedure.

11. Control electronics for controlling power amplifier electronics associated with application of radio frequency (RF) energy generated using solid state electronic components, the power amplifier electronics being configured to control application of RF energy in an oven according to a cooking recipe at least in part based on a learning procedure that generates a power cycling between high and low powers when the learning procedure is executed,
wherein the control electronics comprise processing circuitry configured to employ a thermal stress mitigation technique to control thermal stresses on the power amplifier electronics associated with the power cycling.

12. The control electronics of claim 11 , wherein the thermal stress mitigation technique comprises setting a direct current (DC) bias current after execution of the recipe at a level greater than about 10% of DC bias current at full power.

13. The control electronics of claim 11 , wherein the thermal stress mitigation technique comprises applying a minimum power level during execution of the learning procedure at greater than 15% of full power.

14. The control electronics of claim 11 , wherein the thermal stress mitigation technique comprises applying a minimum power level during execution of the recipe at greater than 15% of full power.

15. The control electronics of claim 11 , wherein the thermal stress mitigation technique comprises applying a minimum power level and a maximum power level during execution of the recipe such that a power envelope defined between the minimum and maximum power levels is less than 85% of full power.

16. The control electronics of claim 11 , wherein the thermal stress mitigation technique comprises applying a power change delay in response to the power cycling.

17. The control electronics of claim 16 , wherein the power change delay is applied responsive to power reduction from full power to a minimum power level associated with the learning procedure.

18. The control electronics of claim 17 , wherein the power change delay is also applied responsive to power increase from the minimum power level associated with the learning procedure to the full power.

19. The control electronics of claim 16 , wherein the power change delay comprises a series of ramped power changes responsive to power reduction between full power and a minimum power level associated with the learning procedure.

20. The control electronics of claim 19 , wherein the ramped power changes are applied about every 10 ms to 1 s during power increases and power decreases between the full power and the minimum power level associated with the learning procedure.

Assignees

• Illinois Tool Works

Inventors

• Carcano Marco
• Sclocchi Michele
• Chirico Daniele

Classifications

• Y02B40/00

  Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers · CPC title

• H05B6/686 Primary

  Circuits comprising a signal generator and power amplifier, e.g. using solid state oscillators · CPC title

• H05B6/642

  Cooling of the microwave components and related air circulation systems (H05B6/6473 takes precedence) · CPC title

• H05B6/6473

  combined with convection heating (H05B6/6485 takes precedence) · CPC title

• H05B6/687 Primary

  for cooking · CPC title