Image collection chip, object imaging recognition device and object imaging recognition method

Patent metadata

Field	Value
Publication number	US-11489596-B2
Application number	US-201916978137-A
Country	US
Kind code	B2
Filing date	Aug 21, 2019
Priority date	Jul 31, 2019
Publication date	Nov 1, 2022
Grant date	Nov 1, 2022

Abstract

An image collection chip, an object imaging recognition device and an object imaging recognition method are provided. In each set of the pixel confirmation modules of the chip, each modulation unit and each sensing unit are correspondingly provided up and down on the optical modulation layer and the image sensing layer respectively; each modulation unit is provided with at least one modulation subunit, and each of the modulation subunits is provided with several modulation holes penetrating into the optical modulation layer; and the respective modulation holes in a same modulation subunit are arranged into a two-dimensional graphic structure having a specific pattern.

First claim

The invention claimed is:

1. An image collection chip, comprising an optical modulation layer, an image sensing layer, at least two sets of pixel confirmation modules, and a signal processing circuit layer;
wherein, the optical modulation layer is located on the image sensing layer, and each set of the at least two sets of pixel confirmation modules comprises modulation units and sensing units; and each of the modulation units and each of the sensing units are correspondingly provided up and down on the optical modulation layer and the image sensing layer, respectively;
wherein each of the modulation units is provided with at least one modulation subunit, and each of the modulation subunits is provided with several modulation holes penetrating into the optical modulation layer; respective modulation holes inside a same modulation subunit are arranged into a two-dimensional graphic structure having a specific pattern; and
wherein the signal processing circuit layer is connected below the image sensing layer and configured to electrically connect respective sensing units.

2. The image collection chip of claim 1 , wherein the specific pattern of the two-dimensional graphic structure comprises:
all of the modulation holes inside a same two-dimensional graphic structure have a same specific cross-sectional shape and the respective modulation holes are arranged in an array in an order that sizes of structural parameters are gradually varied; and/or
the respective modulation holes inside a same two-dimensional graphic structure respectively have a specific cross-sectional shape and the respective modulation holes are combined and arranged according to the specific cross-sectional shape.

3. The image collection chip of claim 2 , wherein the respective modulation holes are arranged row by row or column by column according to a preset period order when the respective modulation holes are arranged and combined according to the specific cross-sectional shape.

4. The image collection chip of claim 3 , further comprising a light-transmitting medium layer between the optical modulation layer and the image sensing layer.

5. The image collection chip of claim 2 , wherein when the respective modulation holes are combined and arranged according to the specific cross-sectional shape, the modulation holes are arranged at random positions.

6. The image collection chip of claim 2 , further comprising a light-transmitting medium layer between the optical modulation layer and the image sensing layer.

7. The image collection chip of claim 1 , wherein no modulation hole is provided inside a modulation subunit at a same position in each of the modulation units.

8. The image collection chip of claim 7 , further comprising a light-transmitting medium layer between the optical modulation layer and the image sensing layer.

9. The image collection chip of claim 1 , wherein one of the modulation holes penetrates through the optical modulation layer or does not penetrate through the optical modulation layer.

10. The image collection chip of claim 9 , further comprising a light-transmitting medium layer between the optical modulation layer and the image sensing layer.

11. The image collection chip of claim 1 , wherein each of the sensing units comprises at least one sensing subunit; the at least one sensing subunit is arranged in an array, and each of the at least one sensing subunit is provided with at least one image sensor; and all of the sensing subunits are electrically connected through the signal processing circuit layer.

12. The image collection chip of claim 1 , further comprising a light-transmitting medium layer between the optical modulation layer and the image sensing layer.

13. The image collection chip of claim 1 , wherein cross-sectional shapes of the modulation holes of a same modulation subunit are different.

14. An object imaging recognition device, comprising:
a light source configured to emit spectra to an object to be imaged; and
the image collection chip of claim 1 , provided on a same side of the object to be imaged along with the light source, so that the spectra are incident on the image collection chip as incident light after the spectra pass through the object to be imaged;
wherein, the image collection chip is configured to respectively perform light modulation on the incident light by using each set of the at least two sets of pixel confirmation modules to obtain at least two modulated spectra, and to respectively sense and detect light intensity of each of the modulated spectra to determine pixel data of respective pixel points.

15. An object imaging recognition method based on the object imaging recognition device of claim 14 , comprising:
emitting spectra to the object to be imaged using the light source, so that the spectra are incident on the image collection chip as incident light after the spectra pass through the object to be imaged;
respectively performing light modulation on the incident light using each set of the at least two sets of pixel confirmation modules of the image collection chip to obtain the at least two modulated spectra, and respectively sensing and detecting the light intensity of each of the modulated spectra to determine each set of pixel data; and
integrating all sets of pixel data to form an output image.

Assignees

• Univ Tsinghua

Inventors

• Cui Kaiyu
• Cai Xusheng
• Zhu Hongbo
• Huang Yidong
• Zhang Wei
• Feng Xue
• Liu Fang

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04B10/516 Primary

  Details of coding or modulation · CPC title

• H04B10/54

  Intensity modulation · CPC title

• H01L27/14625

  Electricity · mapped topic