Molded wire and molded cable, and wire for molded wire and cable for molded cable

US11488744B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11488744-B2
Application numberUS-201615287835-A
CountryUS
Kind codeB2
Filing dateOct 7, 2016
Priority dateOct 7, 2015
Publication dateNov 1, 2022
Grant dateNov 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A molded cable comprises a conductor, an insulation inner layer, an insulation outer layer, and a resin molded body. The insulation inner layer comprises a crosslinked ethylene resin composition and is provided an outer circumference of the conductor. The insulation outer layer comprises a crosslinked thermoplastic polyurethane composition and is provided on an outer circumference of the insulation inner layer. Arithmetic average roughness (Ra) of a surface of the insulation outer layer is 5 μm to 100 μm. The resin molded body coats an exposed end portion of the conductor and an end portion of the insulation outer layer at a side of the exposed end portion of the conductor. The resin molded body is fused to the insulation outer layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A molded cable comprising: a conductor; an insulation inner layer that comprises a crosslinked ethylene resin composition and that is provided directly onto an outer circumference of the conductor; an insulation outer layer that consists of a crosslinked thermoplastic polyurethane formed by crosslinking a resin consisting of polyurethane, and that is provided on an outer circumference of the insulation inner layer, wherein an arithmetic average roughness (Ra) of a surface of the insulation outer layer is 5 μm to 100 μm inclusive; a resin molded body that coats an exposed end portion of the conductor and an end portion of the insulation outer layer at a side of the exposed end portion of the conductor and that is fused to the surface of the insulation outer layer, wherein the resin molded body comprises polyamide resin or polybutylene terephthalate resin; and wherein gel fraction of the crosslinked ethylene resin composition is 45% or more, and gel fraction of the crosslinked thermoplastic polyurethane is between 55% and 71% inclusive. 2. The molded cable according to claim 1 , wherein the gel fraction of the crosslinked ethylene resin composition is 50% or more. 3. The molded cable according to claim 1 , further comprising: a sheath provided on an outer circumference of the insulation outer layer; and wherein the resin molded body does not cover any portion of the sheath. 4. The molded cable of claim 1 , wherein the insulation inner layer and the insulation outer layer are co-crosslinked. 5. A molded cable comprising: a conductor, an insulation inner layer located directly on an outer surface of the conductor, an insulation outer layer located on an outer surface of the insulation inner layer, a resin molded body comprising polyamide resin or polybutylene terephthalate resin, wherein the resin molded body is fused to an outer surface of the insulation outer layer, and a sheath located on the outer surface of the insulation outer layer, wherein the insulation inner layer is substantially an ethylene based copolymer, wherein the insulation outer layer consists of a crosslinked thermoplastic polyurethane formed by crosslinking a resin consisting of polyurethane; wherein an arithmetic average roughness (Ra) for the outer surface of the insulation outer layer is: 5.1 μm≤Ra≤98.5μm, wherein a gel fraction of the insulation inner layer is: 51%≤gel fraction of insulation inner layer≤90%, and wherein a gel fraction of the insulation outer layer is between 55% and 71% inclusive. 6. The cable of claim 5 , wherein the ethylene based copolymer is an ethylene vinyl acetate copolymer, and wherein the insulation inner layer includes approximately 0.2 parts by mass of an antioxidant, and approximately 0.2 parts by mass of a copper inhibitor. 7. The cable of claim 5 , further comprising: an electrode terminal contacting an exposed end of the conductor, and the resin molded body covering the electrode terminal, the exposed end of the conductor, and a portion of the outer surface of the insulation outer layer. 8. The cable of claim 7 , wherein the resin molded body does not cover any portion of the sheath. 9. The cable of claim 5 , further comprising: an electrode terminal contacting an exposed end of the conductor; and the resin molded body covering the electrode terminal, the exposed end of the conductor, and a portion of the outer surface of the insulation outer layer, wherein the resin molded body does not cover any portion of the sheath, wherein the ethylene based copolymer is an ethylene vinyl acetate copolymer, wherein the insulation inner layer includes approximately 0.2 parts by mass of an antioxidant, and approximately 0.2 parts by mass of a copper inhibitor, wherein the arithmetic average roughness (Ra) for the outer surface of the insulation outer layer is: 24.3μm≤Ra≤66.2 μm, wherein the gel fraction of the insulation inner layer is: 80%≤gel fraction of insulation inner layer≤84%, and wherein the gel fraction of the insulation outer layer is: 58%≤gel fraction of insulation outer layer≤59%. 10. A molded cable comprising: a conductor; an insulation inner layer that comprises a crosslinked ethylene resin composition and that is provided directly onto an outer circumference of the conductor; an insulation outer layer consisting of a crosslinked thermoplastic polyurethane wherein the insulation outer layer is positioned on an outer circumference of the insulation inner layer, wherein an arithmetic average roughness (Ra) of a surface of the insulation outer layer is 5 μm to 100 μm inclusive; inclusive and a gel fraction of the insulation outer layer is between 55% and 71% inclusive, a resin molded body that coats an exposed end portion of the conductor and an end portion of the insulation outer layer at a side of the exposed end portion of the conductor and that is fused to the surface of the insulation outer layer, wherein the resin molded body comprises polyamide resin or polybutylene terephthalate resin; and wherein the crosslinked thermoplastic polyurethane is formed by crosslinking a resin consisting of polyurethane. 11. The molded cable of claim 10 , wherein the resin molded body further comprises glass fiber to reinforce the resin molded body.

Assignees

Inventors

Classifications

  • Linear aromatic polyesters · CPC title

  • from acrylic compounds · CPC title

  • Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables · CPC title

  • comprising two or more layers of insulation having different electrical properties · CPC title

  • Cable-harnesses · CPC title

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Frequently asked questions

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What does patent US11488744B2 cover?
A molded cable comprises a conductor, an insulation inner layer, an insulation outer layer, and a resin molded body. The insulation inner layer comprises a crosslinked ethylene resin composition and is provided an outer circumference of the conductor. The insulation outer layer comprises a crosslinked thermoplastic polyurethane composition and is provided on an outer circumference of the insula…
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification H01B7/0216. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).