Endless belt, fixing device, and image forming apparatus

US11487232B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-11487232-B1
Application numberUS-202117465268-A
CountryUS
Kind codeB1
Filing dateSep 2, 2021
Priority dateMay 19, 2021
Publication dateNov 1, 2022
Grant dateNov 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An endless belt includes a metal substrate, and a heat-resistant resin layer that is disposed as an innermost layer on an inner peripheral surface of the metal substrate and that contains a resin and a thermally conductive filler having an aspect ratio of 20 or more. In the heat-resistant resin layer, an orientation ratio of the thermally conductive filler with respect to a circumferential direction of the endless belt is 20% or more.

First claim

Opening claim text (preview).

What is claimed is: 1. An endless belt comprising: a metal substrate; and a heat-resistant resin layer that is disposed as an innermost layer on an inner peripheral surface of the metal substrate and that contains a resin and a thermally conductive filler having an aspect ratio of 20 or more, wherein an orientation ratio of the thermally conductive filler with respect to a circumferential direction of the endless belt is 20% or more. 2. An endless belt comprising: a metal substrate; and a heat-resistant resin layer that is disposed as an innermost layer on an inner peripheral surface of the metal substrate and that contains a resin and a thermally conductive filler having an aspect ratio of 20 or more, wherein, on an inner peripheral surface of the heat-resistant resin layer, an arithmetical mean roughness Ra is 0.01 μm or more and 1.2 μm or less, and a mean spacing Sm of irregularities is 10 μm or more and 500 μm or less in a width direction of the endless belt. 3. The endless belt according to claim 1 , wherein the thermally conductive filler is a carbon-based filler. 4. The endless belt according to claim 2 , wherein the thermally conductive filler is a carbon-based filler. 5. The endless belt according to claim 3 , wherein the carbon-based filler is a carbon nanotube. 6. The endless belt according to claim 4 , wherein the carbon-based filler is a carbon nanotube. 7. The endless belt according to claim 1 , wherein a thermal conductivity ratio (metal substrate/thermally conductive filler) of a thermal conductivity of the metal substrate to a thermal conductivity of the thermally conductive filler is 1/100 or more and 1/3 or less. 8. The endless belt according to claim 2 , wherein a thermal conductivity ratio (metal substrate/thermally conductive filler) of a thermal conductivity of the metal substrate to a thermal conductivity of the thermally conductive filler is 1/100 or more and 1/3 or less. 9. The endless belt according to claim 3 , wherein a thermal conductivity ratio (metal substrate/thermally conductive filler) of a thermal conductivity of the metal substrate to a thermal conductivity of the thermally conductive filler is 1/100 or more and 1/3 or less. 10. The endless belt according to claim 4 , wherein a thermal conductivity ratio (metal substrate/thermally conductive filler) of a thermal conductivity of the metal substrate to a thermal conductivity of the thermally conductive filler is 1/100 or more and 1/3 or less. 11. The endless belt according to claim 5 , wherein a thermal conductivity ratio (metal substrate/thermally conductive filler) of a thermal conductivity of the metal substrate to a thermal conductivity of the thermally conductive filler is 1/100 or more and 1/3 or less. 12. The endless belt according to claim 6 , wherein a thermal conductivity ratio (metal substrate/thermally conductive filler) of a thermal conductivity of the metal substrate to a thermal conductivity of the thermally conductive filler is 1/100 or more and 1/3 or less. 13. The endless belt according to claim 7 , wherein the thermal conductivity of the thermally conductive filler is 200 W/mK or more and 1,500 W/mK or less. 14. The endless belt according to claim 8 , wherein the thermal conductivity of the thermally conductive filler is 200 W/mK or more and 1,500 W/mK or less. 15. The endless belt according to claim 9 , wherein the thermal conductivity of the thermally conductive filler is 200 W/mK or more and 1,500 W/mK or less. 16. The endless belt according to claim 10 , wherein the thermal conductivity of the thermally conductive filler is 200 W/mK or more and 1,500 W/mK or less. 17. The endless belt according to claim 1 , wherein an orientation ratio of the thermally conductive filler with respect to a width direction of the endless belt is 20% or more and 80% or less. 18. The endless belt according to claim 1 , wherein a thickness of the heat-resistant resin layer is gradually increased from a central portion toward an end in a width direction of the endless belt. 19. A fixing device comprising: a first rotatable body formed of the endless belt according to claim 1 ; a second rotatable body disposed in contact with an outer peripheral surface of the first rotatable body; and a pressing member that is disposed inside the first rotatable body and that presses the first rotatable body from an inner peripheral surface of the first rotatable body against the second rotatable body. 20. An image forming apparatus comprising: an image carrier; a charging device that charges a surface of the image carrier; a latent image forming device that forms a latent image on the charged surface of the image carrier; a developing device that develops the latent image with toner to form a toner image; a transfer device that transfers the toner image to a recording medium; and the fixing device according to claim 19 , wherein the fixing device fixes the toner image to the recording medium.

Assignees

Inventors

Classifications

  • the fixing nip having a stationary belt support member opposing a pressure member · CPC title

  • the fixing nip having both a stationary and a rotating belt support member opposing a pressure member · CPC title

  • relating to the chemical composition of the heat element and layers thereof · CPC title

  • Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating · CPC title

  • Heating belt · CPC title

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What does patent US11487232B1 cover?
An endless belt includes a metal substrate, and a heat-resistant resin layer that is disposed as an innermost layer on an inner peripheral surface of the metal substrate and that contains a resin and a thermally conductive filler having an aspect ratio of 20 or more. In the heat-resistant resin layer, an orientation ratio of the thermally conductive filler with respect to a circumferential dire…
Who is the assignee on this patent?
Fujifilm Business Innovation Corp
What technology area does this patent fall under?
Primary CPC classification G03G15/2057. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).