Resin composition for modeling material, resin composition for supporting material, photofabrication product, and process for producing photofabrication product

US11485067B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11485067-B2
Application numberUS-201615748082-A
CountryUS
Kind codeB2
Filing dateJul 27, 2016
Priority dateJul 29, 2015
Publication dateNov 1, 2022
Grant dateNov 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin composition for a modeling material for use in shaping a modeling material (4) by an ink-jet photofabrication method, the resin composition comprising, based on 100 parts by weight of the whole resin composition, 19 to 49 parts by weight of a water-insoluble monofunctional ethylenically unsaturated monomer (A), 15 to 50 parts by weight of a di- or more-functional polyfunctional ethylenically unsaturated monomer (B), 10 to 45 parts by weight of an oligomer (C), and a photopolymerization initiator (D). By this resin composition for a modeling material, a photofabrication product having good dimensional accuracy can be obtained.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition for a modeling material for use in shaping a modeling material by an ink-jet photofabrication method, the resin composition comprising, based on 100 parts by weight of the whole resin composition: 19 to 49 parts by weight of a water-insoluble monofunctional ethylenically unsaturated monomer (A), wherein the water-insoluble monofunctional ethylenically unsaturated monomer (A) comprises isobornyl (meth)acrylate; 15 to 50 parts by weight of a di- or more-functional polyfunctional ethylenically unsaturated monomer (B); 10 to 45 parts by weight of an oligomer (C), wherein the oligomer (C) is one or more selected from the group consisting of a urethane (meth)acrylate oligomer, an epoxy (meth)acrylate oligomer, and a polyester (meth)acrylate oligomer; and 5 to 15 parts by weight of a photopolymerization initiator (D). 2. The resin composition for a modeling material according to claim 1 , wherein the content of the (A) ingredient is 25 to 47 parts by weight, based on 100 parts by weight of the whole resin composition. 3. The resin composition for a modeling material according to claim 1 , wherein the content of the (B) ingredient is 20 to 45 parts by weight, based on 100 parts by weight of the whole resin composition. 4. The resin composition for a modeling material according to claim 1 , wherein the content of the (C) ingredient is 15 to 30 parts by weight, based on 100 parts by weight of the whole resin composition. 5. The resin composition for a modeling material according to claim 1 , wherein the resin composition further comprises a preservation stabilizer (F) at 0.05 to 3.0 parts by weight, based on 100 parts by weight of the whole resin composition. 6. A resin composition for a supporting material for use in shaping a supporting material by an ink-jet photofabrication method, the resin composition comprising, based on 100 parts by weight of the whole resin composition: 20 to 50 parts by weight of a water-soluble monofunctional ethylenically unsaturated monomer (G); 20 to 49 parts by weight of polyalkylene glycol (H) comprising an oxyethylene group and/or an oxypropylene group; 35 parts by weight or less of a water-soluble organic solvent (I); and a photopolymerization initiator (D). 7. The resin composition for a supporting material according to claim 6 , wherein the content of the (G) ingredient is 25 to 45 parts by weight, based on 100 parts by weight of the whole resin composition. 8. The resin composition for a supporting material according to claim 6 , wherein the content of the (H) ingredient is 25 to 45 parts by weight, based on 100 parts by weight of the whole resin composition. 9. The resin composition for a supporting material according to claim 6 , wherein the content of the (D) ingredient is 5 to 20 parts by weight, based on 100 parts by weight of the whole resin composition. 10. The resin composition for a supporting material according to claim 6 , wherein the content of the (I) ingredient is 5 parts by weight or more, based on 100 parts by weight of the whole resin composition. 11. The resin composition for a supporting material according to claim 6 , wherein the resin composition further comprises a preservation stabilizer (F) at 0.05 to 3.0 parts by weight, based on 100 parts by weight of the whole resin composition. 12. A photofabrication product comprising a modeling material which is obtained by photocuring a resin composition for a modeling material according to claim 1 , by an ink-jet photofabrication method. 13. The resin composition for a modeling material according to claim 1 , wherein the resin composition has a viscosity of 70 mPa·s or less at 25° C. 14. The resin composition for a modeling material according to claim 1 , wherein the content of the (C) ingredient is 10 to 30 parts by weight, based on 100 parts by weight of the whole resin composition.

Assignees

Inventors

Classifications

  • Homopolymers or copolymers of acrylic acid esters · CPC title

  • Arrangements for irradiation · CPC title

  • Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

  • Polymers provided for in subclass C08G · CPC title

  • containing three or more polymers in a blend · CPC title

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What does patent US11485067B2 cover?
A resin composition for a modeling material for use in shaping a modeling material (4) by an ink-jet photofabrication method, the resin composition comprising, based on 100 parts by weight of the whole resin composition, 19 to 49 parts by weight of a water-insoluble monofunctional ethylenically unsaturated monomer (A), 15 to 50 parts by weight of a di- or more-functional polyfunctional ethyleni…
Who is the assignee on this patent?
Maxell Ltd, Mimaki Eng Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C64/112. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).