Membrane circuit board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11482387-B2
Application number	US-202017031662-A
Country	US
Kind code	B2
Filing date	Sep 24, 2020
Priority date	Aug 27, 2020
Publication date	Oct 25, 2022
Grant date	Oct 25, 2022

Abstract

A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.

First claim

What is claimed is:

1. A membrane circuit board, comprising:
a first film substrate, wherein a first circuit layer is installed on the first film substrate;
a second film substrate opposed to the first film substrate, wherein a second circuit layer is installed on the second film substrate;
an insulating spacer substrate arranged between the first film substrate and the second film substrate, wherein the first circuit layer is arranged between the first film substrate and the insulating spacer substrate, and the second circuit layer is arranged between the second film substrate and the insulating spacer substrate; and
a waterproof structure comprising a first welding layer and a second welding layer, wherein the first welding layer is arranged between the first film substrate and the insulating spacer substrate, and the first welding layer is arranged around the first circuit layer, wherein the second welding layer is arranged between the second film substrate and the insulating spacer substrate, and the second welding layer is arranged around the second circuit layer,
wherein the first film substrate has a first positioning opening, the insulating spacer substrate has a second positioning opening, and the second film substrate has a third positioning opening, wherein the first positioning opening, the second positioning opening and the third positioning opening are aligned with each other,
wherein the first welding layer comprises a first welding part and a second welding part, and the second welding layer comprises a third welding part and a fourth welding part, wherein the first welding part is arranged around the first circuit layer and the second welding part, and the second welding part is arranged around a region between the first positioning opening and the second positioning opening, wherein the third welding part is arranged around the second circuit layer and the fourth welding part, and the fourth welding part is arranged around a region between the second positioning opening and the third positioning opening,
wherein the first welding layer further comprises a fifth welding part, and the second welding layer further comprises a sixth welding part, wherein the fifth welding part is arranged between the first circuit layer and the first welding part, the fifth welding part is arranged around the first circuit layer and the second welding part, the sixth welding part is arranged between the second circuit layer and the third welding part, and the sixth welding part is arranged around the second circuit layer and the fourth welding part.

2. The membrane circuit board according to claim 1 , wherein after the first film substrate, the insulating spacer substrate and the second film substrate are subjected to an ultrasonic heat melting treatment by an ultrasonic heat melting device, the first welding layer is formed between the first film substrate and the insulating spacer substrate, and the second welding layer is formed between the second film substrate and the insulating spacer substrate.

3. The membrane circuit board according to claim 1 , further comprising an anti-slip structure, wherein the anti-slip structure is installed on a surface of the first film substrate away from the insulating spacer substrate, or the anti-slip structure is installed on a surface of the second film substrate away from the insulating spacer substrate.

Assignees

• Primax Electronics Ltd

Inventors

• Cai Liu-Bing
• Deng Li-Xiong
• Wei Fu-Zhou
• Chen Li-Qiang
• Wang Xiao-Ping

Classifications

• H01H13/703

  characterised by spacers between contact carrying layers · CPC title

• H01H13/88

  Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards · CPC title

• H01H13/06 Primary

  Dustproof, splashproof, drip-proof, waterproof or flameproof casings · CPC title

• H01H13/86

  characterised by the casing, e.g. sealed casings or casings reducible in size · CPC title

• H01H2223/002

  sealed · CPC title