Manufacturing method of honeycomb structure and transfer pallet

Patent metadata

Field	Value
Publication number	US-11478953-B2
Application number	US-201916274484-A
Country	US
Kind code	B2
Filing date	Feb 13, 2019
Priority date	Mar 8, 2018
Publication date	Oct 25, 2022
Grant date	Oct 25, 2022

Abstract

A manufacturing method of a honeycomb structure, including a vertical extrusion process, wherein the vertical extrusion process includes: an extrusion step of extruding the molding compound in the vertically downward direction from an extrusion die attached to an extruder; a honeycomb formed body receiving step in which a transfer pallet is placed at a position near the extrusion die, and a honeycomb formed body formed by continuously extruding the molding compound in the extrusion step is received and supported from below by the transfer pallet; and a pallet lowering step of lowering the transfer pallet while receiving and supporting the honeycomb formed body in synchronization with an extrusion speed of the molding compound from the extrusion die, and the transfer pallet is constituted of a laminate structure including: a pallet substrate; and a tabular mesh plate.

First claim

What is claimed is:

1. A manufacturing method of a honeycomb structure, comprising a vertical extrusion process for forming a honeycomb formed body by extruding a molding compound in a vertically downward direction, wherein the vertical extrusion process comprises:
an extrusion step of extruding the molding compound in the vertically downward direction from an extrusion die attached to an extruder;
a honeycomb formed body receiving step in which a transfer pallet is placed at a position near the extrusion die, and the honeycomb formed body formed by continuously extruding the molding compound in the extrusion step is received and supported from below by the transfer pallet; and
a pallet lowering step of lowering the transfer pallet while receiving and supporting the honeycomb formed body in synchronization with an extrusion speed of the molding compound from the extrusion die,
wherein the transfer pallet is a laminate structure including at least three layers and comprises
a pallet substrate,
a tabular mesh plate, placed on the pallet substrate in an overlapping manner, and formed of a mesh material having a plurality of mesh holes,
a tabular punched plate, inserted between the pallet substrate and the mesh plate, and having a plurality of punched holes drilled at predetermined intervals, and
a single tabular intermediate mesh plate, or a plurality of tabular intermediate mesh plates, provided under the mesh plate in an overlapping manner and which are formed of a mesh material having a plurality of mesh holes,

wherein a number of mesh holes per inch of the intermediate mesh plate at a lower stage position is smaller than those of the mesh plate and of the intermediate mesh plate at an upper stage position, and
wherein a bottom surface of the extruded honeycomb structure directly contacts the tabular mesh plate of the transfer pallet.

2. The manufacturing method of a honeycomb structure according to claim 1 , wherein the number of mesh holes per inch of the mesh plate is in a range of 30 to 100.

3. The manufacturing method of a honeycomb structure according to claim 1 , wherein the number of mesh holes per inch of the intermediate mesh plate is in a range of 16 to 80.

4. The manufacturing method of a honeycomb structure according to claim 1 , wherein each of, or at least one of, the pallet substrate, the mesh plate, the punched plate, and the intermediate mesh plate is a conductive material.

5. A transfer pallet for use in a method of manufacturing a honeycomb structure, the transfer pallet having at least a three-layer structure comprising:
a pallet substrate;
a tabular mesh plate, placed on the pallet substrate in an overlapping manner, and which is formed of a mesh material having a plurality of mesh holes;
a tabular punched plate, inserted between the pallet substrate and the mesh plate, and having a plurality of punched holes drilled at predetermined intervals; and
a single tabular intermediate mesh plate, or a plurality of tabular intermediate mesh plates, provided under the mesh plate in an overlapping manner and which are formed of a mesh material having a plurality of mesh holes,
wherein a number of mesh holes per inch of the intermediate mesh plate at a lower stage position is smaller than those of the mesh plate and of the intermediate mesh plate at an upper stage position, and
wherein a bottom surface of an extruded honeycomb structure directly contacts the tabular mesh plate of the transfer pallet.

6. The transfer pallet according to claim 5 , wherein a number of meshes per inch of the mesh plate is in a range of 30 to 100.

7. The transfer pallet according to claim 5 , wherein the number of mesh holes per inch of the intermediate mesh plates is in a range of 16 to 80.

8. The transfer pallet according to claim 5 , wherein each of, or at least one of, the pallet substrate, the mesh plate, the punched plate, and the intermediate mesh plate is a conductive material.

Assignees

• Ngk Insulators Ltd

Inventors

• Okumura Kensuke

Classifications

• B28B3/269 Primary

  For multi-channeled structures, e.g. honeycomb structures · CPC title

• B28B11/248

  Supports for drying · CPC title

• B29C48/11

  comprising two or more partially or fully enclosed cavities, e.g. honeycomb-shaped · CPC title

• B29C48/142

  using force fields, e.g. gravity or electrical fields (B29C48/9165 takes precedence) · CPC title

• B28B17/00

  Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping (moulds B28B7/00; after-treatment B28B11/00; feeding or discharging B28B13/00; arrangements for embedding elements in the material B28B23/00) · CPC title