Hollow fiber membrane module and production method therefor, and epoxy resin used in hollow fiber membrane and production method

Patent metadata

Field	Value
Publication number	US-11478753-B2
Application number	US-201716313842-A
Country	US
Kind code	B2
Filing date	Jun 27, 2017
Priority date	Jun 29, 2016
Publication date	Oct 25, 2022
Grant date	Oct 25, 2022

Abstract

Provided is a hollow fiber membrane module that exhibits excellent durability even when a chemical such as a radical polymerizable compound is used for a separation or mixing process. Also provided is a method for producing the hollow fiber membrane module in a highly productive manner. More specifically, there is provided a hollow fiber membrane module at least including a tubular body, a cap, a hollow fiber membrane, and an end seal portion, wherein at least a liquid contacting portion of the end seal portion is sealed with a cured product of a curable resin composition including an epoxy resin, and wherein the epoxy resin includes a polyglycidyl ether of a polycondensate of an aromatic compound containing a phenolic hydroxyl group and an aromatic compound containing a formyl group and a phenolic hydroxyl group, and there is provided a method for producing the module.

First claim

The invention claimed is:

1. A hollow fiber membrane module at least comprising:
a tubular body;
a cap;
a hollow fiber membrane; and
an end seal portion,
wherein at least a liquid contacting portion of the end seal portion is sealed with a cured product of a curable resin composition including an epoxy resin, and
wherein the epoxy resin includes a polyglycidyl ether of a polycondensate of a first aromatic compound containing a phenolic hydroxyl group and a second aromatic compound containing a formyl group and a phenolic hydroxyl group.

2. The hollow fiber membrane module according to claim 1 , wherein the epoxy resin has an ICI viscosity at 150° C. ranging from 1 to 500 mPa·s.

3. The hollow fiber membrane module according to claim 1 , wherein the epoxy resin has an epoxy equivalent weight within a range of 230 g/eq or less.

4. The hollow fiber membrane module according to claim 1 , wherein the curable resin composition comprises a curing agent.

5. The hollow fiber membrane module according to claim 1 , wherein the hollow fiber membrane is configured to degas an ink-jet ink including an organic solvent.

6. A method for producing a hollow fiber membrane module at least including a tubular body, caps, a hollow fiber membrane, and end seal portions, the method comprising:
loading the hollow fiber membrane into the tubular body;
sealing end portions of the hollow fiber membrane to the tubular body by curing a curable resin composition including an epoxy resin; and
attaching the caps to both ends of the tubular body,
wherein the epoxy resin includes a polyglycidyl ether of a polycondensate of phenol and hydroxybenzaldehyde.

7. The method for production according to claim 6 , wherein the curable resin composition is cured at room temperature and is thereafter subjected to post curing at 50° C. or higher.

8. The hollow fiber membrane module according to claim 1 , wherein the hollow fiber membrane is configured to degas an ink-jet ink including a radical polymerizable compound.

9. The hollow fiber membrane module according to claim 8 , wherein the radical polymerizable compound comprises a (meth)acrylate compound or an N-vinyl compound.

10. The hollow fiber membrane module according to claim 1 , wherein the first aromatic compound and the second aromatic compound are represented, respectively, by general formula (1) and (2) below,

wherein, R 1 and R 2 are each independently a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom, m is an integer from 1 to 3, and n is an integer from 1 to 4.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Suganuma Youhei
• Oi Kazumi
• Tomura Tsugio
• Kimura Makoto

Classifications

• B41J2/19 Primary

  for removing air bubbles · CPC title

• B01D19/00 Primary

  Degasification of liquids · CPC title

• B01D63/023

  Encapsulating materials · CPC title

• C08G59/08

  from phenol-aldehyde condensates · CPC title

• B41J2/175

  Ink supply systems {; Circuit parts therefor} · CPC title