Display substrate comprising fingerprint recognition sensors, method for manufacturing the same, and display device

Patent metadata

Field	Value
Publication number	US-11476312-B2
Application number	US-201816641754-A
Country	US
Kind code	B2
Filing date	Nov 23, 2018
Priority date	Nov 23, 2018
Publication date	Oct 18, 2022
Grant date	Oct 18, 2022

Abstract

Embodiments of the present disclosure relate to a display substrate, a method for manufacturing the same, and a display device. The display substrate includes a substrate, a pixel definition layer for defining pixels on the substrate, the pixel definition layer including a plurality of inter-pixel portions located between adjacent pixels, and a fingerprint recognition sensor located in the inter-pixel portions.

First claim

What is claimed is:

1. A method for manufacturing a display substrate comprising:
providing a substrate;
forming a pixel definition layer for defining pixels on the substrate, wherein each pixel comprises a light emitting device; and
forming the light emitting devices on the substrate and in the pixel definition layer, the pixel definition layer comprising a plurality of inter-pixel portions located between adjacent light emitting devices,
wherein forming the pixel definition layer comprises forming a fingerprint recognition sensor in at least one of the inter-pixel portions, and
wherein the fingerprint recognition sensor is an ultrasonic fingerprint recognition sensor, wherein the ultrasonic fingerprint recognition sensor comprises a generator and a receiver, wherein forming the ultrasonic fingerprint recognition sensor comprises positioning the generator and the receiver in different inter-pixel portions, the inter-pixel portion comprising a first inter-pixel portion and a second inter-pixel portion located on opposite sides of each pixel, and wherein forming the first inter-pixel portion, the second inter-pixel portion, and the ultrasonic fingerprint recognition sensor comprises:
forming a first lower electrode in a region for forming the first inter-pixel portion on the substrate, and forming a second lower electrode in a region for forming the second inter-pixel portion on the substrate;
forming a first portion of the first inter-pixel portion covering the substrate and the first lower electrode in the region for forming the first inter-pixel portion, and forming a first portion of the second inter-pixel portion covering the substrate and the second lower electrode in the region for forming the second inter-pixel portion;
forming a first hole exposing the first lower electrode in the first portion of the first inter-pixel portion, and forming a second hole exposing the second lower electrode in the first portion of the second inter-pixel portion;
forming a first piezoelectric material in the first hole, and forming a second piezoelectric material in the second hole;
forming a first upper electrode on the first portion of the first inter-pixel portion and the first piezoelectric material, and forming a second upper electrode on the first portion of the second inter-pixel portion and the second piezoelectric material; and
forming a second portion of the first inter-pixel portion on the first upper electrode and the first portion of the first inter-pixel portion, and forming a second portion of the second inter-pixel portion on the second upper electrode and the first portion of the second inter-pixel portion.

2. The method according to claim 1 , wherein forming the first lower electrode and the second lower electrode comprises:
forming a first conductive layer on the substrate; and
patterning the first conductive layer to form the first lower electrode in the region for forming the first inter-pixel portion and to form the second lower electrode in the region for forming the second inter-pixel portion,
and wherein forming the first upper electrode and the second upper electrode comprises:
forming a second conductive layer covering the first portion of the first inter-pixel portion and the first piezoelectric material and covering the first portion of the second inter-pixel portion and the second piezoelectric material; and
patterning the second conductive layer to form the first upper electrode on the first portion of the first inter-pixel portion and the first piezoelectric material and to form the second upper electrode on the first portion of the second inter-pixel portion and the second piezoelectric material.

3. The method according to claim 2 , wherein forming each light emitting device comprises:
forming an anode on the substrate, wherein the anode is formed simultaneously with the first lower electrode and the second lower electrode;
forming a light emitting layer on the anode; and
forming a cathode on the light emitting layer and the pixel definition layer.

4. The method according to claim 3 , further comprising:
forming a TFT layer on the substrate before forming the pixel definition layer and the fingerprint recognition sensor;
forming a planarization layer on the TFT layer;
forming an encapsulation layer on the cathode after forming the cathode; and
forming a touch layer on the encapsulation layer.

Assignees

• Chengdu Boe Optoelect Tech Co
• Beijing Boe Technology Dev Co Ltd

Inventors

• Qi Mingchun
• Kong Mengxia
• Hu Xuwu
• Si Donghui

Classifications

• G02F1/1333

  Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence) · CPC title

• H01L27/3225 Primary

  Electricity · mapped topic

• G06V40/1306 Primary

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• H01L27/20

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic