Uninterruptible power supply having a liquid cooling device

Patent metadata

Field	Value
Publication number	US-11470740-B2
Application number	US-202117308257-A
Country	US
Kind code	B2
Filing date	May 5, 2021
Priority date	May 29, 2020
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.

First claim

What is claimed is:

1. A liquid cooling device for cooling at least one target component, the liquid cooling device comprising:
a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member defining a plurality of pockets spaced apart from one another; and
a plurality of cover members connected to the base member, each cover member of the plurality of cover members being at least partially received in a corresponding pocket of the plurality of pockets, each cover member of the plurality of cover members having a fluid inlet and a fluid outlet,
the cover members defining, together with the base member, a plurality of fluid conduits that are independent from one another, each fluid conduit being defined between a corresponding one of the cover members and the base member such that a number of the fluid conduits is equal to a number of the cover members, each fluid conduit being configured to respectively receive and discharge fluid through the fluid inlet and the fluid outlet of the corresponding one of the cover members.

2. The liquid cooling device of claim 1 , wherein each cover member is laser welded to the base member.

3. The liquid cooling device of claim 1 , wherein:
the base member defines a plurality of conduit recesses, each conduit recess being located in a corresponding one of the pockets; and
each fluid conduit of the plurality of fluid conduits is defined by a corresponding one of the conduit recesses and the cover member received in the corresponding one of the pockets.

4. The liquid cooling device of claim 1 , further comprising:
an inlet manifold fluidly connected to the fluid inlets of the cover members for feeding fluid to the fluid conduits; and
an outlet manifold fluidly connected to the fluid outlets of the cover members for discharging fluid from the fluid conduits.

5. The liquid cooling device of claim 4 , wherein a distance between the inlet manifold and the outlet manifold through each fluid conduit is approximately the same.

6. The liquid cooling device of claim 1 , wherein the pockets and the cover members are generally square.

7. The liquid cooling device of claim 1 , wherein the pockets are arranged in a rectangular array.

8. The liquid cooling device of claim 1 , wherein the plurality of pockets includes an even number of pockets.

9. The liquid cooling device of claim 1 , wherein a thickness of the base member is between 8 mm and 15 mm inclusively.

10. The liquid cooling device of claim 1 , wherein a thickness of each cover member is between 2 mm and 5 mm inclusively.

11. The liquid cooling device of claim 1 , wherein:
when the base member is mounted to the at least one target component, two fluid conduits of the plurality of fluid conduits overlap each of the at least one target component for cooling thereof; and
for each two fluid conduits overlapping one of the at least one target component, the fluid inlets of corresponding cover members defining the fluid conduits are closer to one another than the fluid outlets of the corresponding cover members.

12. A liquid cooling device comprising:
a plurality of semiconductors; and
a liquid cooling device mounted to the plurality of semiconductors for cooling thereof, the liquid cooling device comprising:
a base member in thermal contact with the plurality of semiconductors, the base member defining a plurality of pockets spaced apart from one another; and
a plurality of cover members connected to the base member, each cover member of the plurality of cover members being at least partially received in a corresponding pocket of the plurality of pockets, each cover member of the plurality of cover members having a fluid inlet and a fluid outlet,
the cover members defining, together with the base member, a plurality of fluid conduits that are independent from one another, each fluid conduit being defined between a corresponding one of the cover members and the base member such that a number of the fluid conduits is equal to a number of the cover members, each fluid conduit being configured to respectively receive and discharge fluid through the fluid inlet and the fluid outlet of the corresponding one of the cover members,

each semiconductor being aligned with at least two of the fluid conduits so as to be cooled thereby.

13. The device of claim 12 , further comprising:
an inlet manifold fluidly connected to the fluid inlets of the cover members for feeding fluid to the fluid conduits; and
an outlet manifold fluidly connected to the fluid outlets of the cover members for discharging fluid from the fluid conduits.

14. The device of claim 12 , wherein:
the base member defines a plurality of conduit recesses, each conduit recess being located in a corresponding one of the pockets; and
each fluid conduit of the plurality of fluid conduits is defined by a corresponding one of the conduit recesses and the cover member received in the corresponding one of the pockets.

Assignees

• OVH

Inventors

• Chehade Ali
• Bauduin Hadrien
• Bauchart Gregory Francis Louis

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H02J9/06

  with automatic change-over {, e.g. UPS systems} · CPC title

• H05K7/2089

  for power electronics, e.g. for inverters for controlling motor · CPC title