Electronic device including display module including sensor and method for manufacturing the display module

Patent metadata

Field	Value
Publication number	US-11468700-B2
Application number	US-202016791404-A
Country	US
Kind code	B2
Filing date	Feb 14, 2020
Priority date	Feb 15, 2019
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

Disclosed is an electronic device that includes a housing, a display module that includes a first panel including a first surface, a second surface opposite to the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer that is disposed on the first surface of the first panel and that forms one surface of the housing, and a second panel disposed on the second surface of the first panel, and a sensor that is coupled to the display module and that forms a sensing area on the one surface of the housing. The display module includes an opening that is formed through the second panel and in which the sensor is disposed, and the sensor includes an active area and an inactive area formed around the active area. A first adhesive material is formed between the active area and the first panel. The first adhesive material includes a mechanical or thermal characteristic that a glass transition temperature Tg ranges from 0° C. to 25° C. in a frequency condition of 0.01 Hz to 0.1 Hz, a modulus of elasticity at 35° C. or more is 0.2 GPa or less, and a modulus of elasticity at −10° C. or less is 1 GPa or more.

First claim

What is claimed is:

1. An electronic device comprising:
a housing;
a display module that includes a first panel including a first surface, a second surface opposite to the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer disposed on the first surface of the first panel and configured to form one surface of the housing, and a second panel disposed on the second surface of the first panel; and
a sensor coupled to the display module and configured to form a sensing area on the one surface of the housing,
wherein the display module includes an opening that is formed through the second panel and in which the sensor is disposed,
wherein the sensor includes an active area and an inactive area formed around the active area,
wherein a first adhesive material is formed between the active area and the first panel, and
wherein a second adhesive material different from the first adhesive material is formed between at least a portion of the inactive area and the first panel.

2. The electronic device of claim 1 , wherein the first adhesive material includes a mechanical or thermal characteristic that a glass transition temperature Tg ranges from 0° C. to 25° C. in a frequency condition of 0.01 Hz to 0.1 Hz, a modulus of elasticity at 35° C. or more is 0.2 GPa or less, and a modulus of elasticity at −10° C. or less is 1 GPa or more.

3. The electronic device of claim 1 , wherein the first adhesive material includes a material with a thermosetting property.

4. The electronic device of claim 1 , wherein the second adhesive material includes a material with a UV curing property.

5. The electronic device of claim 1 , wherein the sensor includes an ultrasonic sensor.

6. The electronic device of claim 1 , wherein a portion of the first adhesive material is formed between the inactive area and the first panel.

7. The electronic device of claim 1 , wherein a portion of the first adhesive material is formed outside an area of the first panel on which the sensor is disposed.

8. The electronic device of claim 1 , wherein the sensor includes a first surface configured to face the first panel, a second surface opposite to the first surface, and third surfaces formed between the first surface and the second surface, and
wherein the first adhesive material is formed on the first surface and at least a portion of each of the third surfaces.

9. The electronic device of claim 1 , wherein the first panel forms a screen display area on the one surface of the housing, and
wherein the screen display area includes the sensing area.

10. The electronic device of claim 1 , wherein the second panel includes:
a shielding layer containing a metallic material; and
a cushion layer configured to absorb an impact applied to the first panel.

11. The electronic device of claim 10 , wherein the cushion layer includes an embossing pattern formed thereon.

12. An electronic device comprising:
a housing including a surface that includes a screen display area and a sensing area configured to overlap the screen display area;
a first panel disposed on the housing, the first panel including a first surface configured to face the surface of the housing and a second surface opposite to the first surface, wherein the first panel includes a plurality of pixels configured to form the screen display area;
a second panel disposed on the second surface of the first panel;
an opening formed through the second panel; and
a sensor disposed in the opening and coupled to the first panel, the sensor being configured to form the sensing area,
wherein the sensor includes an ultrasonic sensor configured to sense biometric information of a user, based on ultrasonic waves passing through the sensing area, and
wherein the sensor attached to the first panel by a first adhesive material and a second adhesive material that is different from the first adhesive material and that is spaced apart from the first adhesive material.

13. The electronic device of claim 12 , wherein the first adhesive material includes a thermosetting material and the second adhesive material includes a UV curable material.

14. The electronic device of claim 13 , wherein the sensor includes an active area configured to form the sensing area and an inactive area formed around the active area,
wherein at least a portion of the thermosetting material is formed between the active area and the first panel, and
wherein the UV curable material is formed between the inactive area and the first panel.

15. The electronic device of claim 13 , wherein the sensor includes a first surface attached to the first panel, a second surface opposite to the first surface, and a plurality of side surfaces formed between the first surface and the second surface, and
wherein the UV curable material is formed on a corner formed by at least two of the plurality of side surfaces of the sensor.

16. The electronic device of claim 12 , wherein the second panel includes:
a shielding layer containing a metallic material;
a pattern layer having an embossing pattern formed thereon; and
a cushion layer containing a cushioning material.

17. A method for manufacturing a display module including a screen display area and a sensing area configured to overlap the screen display area, the method comprising:
providing a display including an opening, wherein the display includes a front panel that includes a first surface including the screen display area and a second surface opposite to the first surface, and a rear panel disposed on the second surface, and the opening is formed through the rear panel to expose a first portion of the second surface;
applying a thermosetting resin to at least part of the first portion in the opening;
attaching a sensor of an ultrasonic type to the thermosetting resin;
injecting a UV curable adhesive between inner walls of the opening and the sensor, when the second surface is viewed from above;
curing the UV curable adhesive by irradiating UV light to the UV curable adhesive;
loading the display having the sensor attached thereto into a chamber and raising pressure in the chamber to remove bubbles from the thermosetting resin; and
unloading the display from the chamber and thermally curing the thermosetting resin.

18. The method of claim 17 , wherein the thermosetting resin includes an epoxy resin.

19. The method of claim 17 , wherein the thermosetting resin includes a resin that is cured at 70° C. or less and that has an elastic modulus of 1 GPa or less and a shrinkage of 6% or less.

20. The method of claim 17 , wherein injecting the UV curable adhesive between the inner walls of the opening and the sensor includes:
applying the UV curable adhesive such that the UV curable adhesive does not make contact with the thermosetting resin when the second surface of the front panel is viewed from above.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Yongwon
• Kim Il
• Kang Dareum
• Park Chohee
• Bae Dohyun
• Jeong Hyeoncheol
• Jo Jeonggyu
• Choi Seongwoo
• Rhee Bongjae

Classifications

• G06V40/1306 Primary

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• H04M1/0266

  for a display module assembly · CPC title

• H04M1/026 Primary

  Details of the structure or mounting of specific components · CPC title

• H04M2250/12

  including a sensor for measuring a physical value, e.g. temperature or motion · CPC title