Method of forming a porous multilayer material

Patent metadata

Field	Value
Publication number	US-11466358-B2
Application number	US-202017120576-A
Country	US
Kind code	B2
Filing date	Dec 14, 2020
Priority date	Dec 13, 2019
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

Forming a porous multilayer material includes forming a multilayer material on a substrate. Forming the multilayer material includes alternately forming a sacrificial layer and a semi-sacrificial layer, where the sacrificial layer includes a first metal and the semi-sacrificial layer includes the first metal and a second metal or metallic alloy. Forming the porous multilayer material further includes removing at least a portion of the first metal from each of the sacrificial and semi-sacrificial layers to yield the porous multilayer material. The porous multilayer material includes a multiplicity of metal-containing layers, each layer having a thickness in a range between about 5 nm and about 100 nm and bonded to an adjacent layer. Each layer includes chromium, niobium, tantalum, vanadium, molybdenum, tungsten, or a combination thereof. A void is defined between each pair of layers, and a density of porous the multilayer material is <1% bulk density.

First claim

What is claimed is:

1. A method of forming a porous multilayer material, the method comprising:
forming a multilayer material on a substrate, wherein forming the multilayer material comprises alternately forming a sacrificial layer and a semi-sacrificial layer, wherein the sacrificial layer comprises a first metal and the semi-sacrificial layer comprises the first metal and a second metal or metallic alloy;
separating the multilayer material from the substrate; and
removing at least a portion of the first metal from each of the sacrificial and semi-sacrificial layers to yield the porous multilayer material.

2. The method of claim 1 , further comprising sintering the porous multilayer material to bond each semi-sacrificial layer to an adjacent semi-sacrificial layer.

3. The method of claim 1 , further comprising, after removing at least the portion of the first metal, sintering the porous multilayer material to bond each semi-sacrificial layer to an adjacent semi-sacrificial layer.

4. The method of claim 3 , further comprising crushing the porous multilayer material.

5. The method of claim 1 , wherein forming the sacrificial layer comprises electron beam evaporation of the first metal.

6. The method of claim 1 , wherein forming the semi-sacrificial layer comprises sputtering.

7. The method of claim 1 , wherein removing at least the portion of the first metal comprises dissolving at least the portion of the first metal.

8. The method of claim 1 , wherein removing at least the portion of the first metal comprises boiling off at least the portion of the first metal.

9. The method of claim 1 , wherein removing at least the portion of the first metal comprises removing substantially all of the first metal.

10. The method of claim 1 , wherein removing at least the portion of the first metal defines voids between the semi-sacrificial layers.

11. The method of claim 1 , wherein a thickness of each sacrificial layer is in a range of about 0.2 μm to about 2 μm.

12. The method of claim 1 , wherein a thickness of each semi-sacrificial layer is in range of about 5 nm to about 100 nm.

13. The method of claim 1 , wherein a thickness of the porous multilayer material is in a range of about 100 μm to about 500 μm.

14. The method of claim 1 , wherein the first metal comprises one or both of copper and magnesium.

15. The method of claim 1 , wherein the second metal or metallic alloy comprises one or more of chromium, niobium, tantalum, vanadium, molybdenum, and tungsten.

16. The method of claim 1 , wherein each semi-sacrificial layer comprises 70-85 atomic percent of the first metal.

Assignees

• Rajagopalan Jagannathan
• Univ Arizona State

Inventors

• Rajagopalan Jagannathan

Classifications

• C23C28/02

  only coatings {only including layers} of metallic material · CPC title

• C23C14/5873

  Removal of material · CPC title

• C23C14/14 Primary

  Metallic material, boron or silicon · CPC title

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• C23C28/44

  characterized by a measurable physical property of the alternating layer or system, e.g. thickness, density, hardness · CPC title