Metal particle-containing composition and electrically conductive adhesive film

Patent metadata

Field	Value
Publication number	US-11466181-B2
Application number	US-202117359372-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Mar 15, 2019
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

First claim

What is claimed is:

1. A metal particle-containing composition comprising:
at least one thermosetting resin (R);
a hardening agent (H); and
at least three types of metal particles (P) different from one another, wherein
the metal particles (P) contain:
a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower;
at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1);
at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with the metal (A) contained in the solder alloy particle (P1);
the thermosetting resin (R) is a maleic acid imide resin;
the hardening agent (H) is a radical generating agent;
the metal (C) is nickel; and
a particle diameter (d50) of primary particles of the metal particle (P3) is 1 μm or less.

2. The metal particle-containing composition according to claim 1 , wherein the metal (A) is at least any one of bismuth, silver, zinc, and indium.

3. The metal particle-containing composition according to claim 1 , wherein the metal (B) is at least any one of copper, silver, and gold.

4. The metal particle-containing composition according to claim 1 wherein a particle diameter (d50) of primary particles of the solder alloy particle (P1) is more than 500 nm and 50 μm or less.

5. The metal particle-containing composition according to claim 1 , wherein a particle diameter (d50) of primary particles of the metal particle (P2) is more than 1 nm and 50 μm or less.

6. The metal particle-containing composition according to claim 1 , wherein a particle diameter (d50) of primary particles of the metal particle (P3) is more than 10 nm.

7. The metal particle-containing composition according to claim 1 , wherein a content of the solder alloy particle (P1) contained in the metal particle-containing composition is 50 to 95% by mass based on a total content of the metal particles (P).

8. The metal particle-containing composition according to claim 1 , wherein a content of the metal particle (P2) contained in the metal particle-containing composition is 2.5 to 30% by mass based on a total content of the metal particles (P).

9. The metal particle-containing composition according to claim 1 , wherein a content of the metal particle (P3) contained in the metal particle-containing composition is 2.5 to 20% by mass based on a total content of the metal particles (P).

10. The metal particle-containing composition according to claim 1 , further comprising a flux having one or more phosphor or sulfur atoms in a molecular structure, the phosphor or sulfur atoms being capable of bonding to an oxygen atom without generation of water.

11. The metal particle-containing composition according to claim 10 , wherein the flux contains at least one of an organic phosphine represented by the following formula (6), a sulfide-based compound represented by the following formula (7), and a thiol-based compound represented by the following (8);
provided that R in the following formulas (6), (7), and (8) each independently represent an organic group and are optionally the same with or different from one another,

12. The metal particle-containing composition according to claim 11 , wherein the organic phosphine contains 4-(diphenylphosphino)styrene.

13. The metal particle-containing composition according to claim 11 , wherein the sulfide-based compound contains at least one of bis(hydroxyphenyl)sulfide, bis(4-acryloylthiophenyl)sulfide, 2-methylthiophenothiazine, bis(2-methacry oylthioethyl)sulfide, and bis(4-methacloylthiopheny 1)sulfide.

14. The metal particle-containing composition according to claim 11 , wherein the thiol-based compound contains at least one of 2-dibutylamino-4,6-dimercapto-s-triazine, 2,4,6-trimercapto-s-triazine, 2-pyridinethiol, 2-pyridinemethanethiol, and 3-pyridinemethanethiol.

15. An electrically conductive adhesive film formed by the metal particle-containing composition according to claim 1 .

Assignees

• Furukawa Electric Co Ltd

Inventors

• Nitta Norzafriza
• Ishii Tomohiro
• Fujiwara Hidemichi

Classifications

• C08K5/372

  Sulfides {, e.g. R-(S)x-R'} · CPC title

• C08K2003/0837

  Bismuth · CPC title

• C08K2003/0856

  Iron · CPC title

• C09J11/06

  organic · CPC title

• C08K2003/0862

  Nickel · CPC title