Camera module and electronic device

US11463568B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11463568-B2
Application numberUS-202017069281-A
CountryUS
Kind codeB2
Filing dateOct 13, 2020
Priority dateJun 14, 2018
Publication dateOct 4, 2022
Grant dateOct 4, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are a camera module and an electronic device. The camera module comprises at least two cameras. Two cameras of the at least two cameras are disposed in parallel; incident optical axes of the two cameras are parallel to each other; each camera includes a reflecting element, an optical lens assembly and a photosensitive element; and reflecting optical axes of the two cameras are consistent or parallel to each other. The incident light is reflected by the reflecting element and passes through the optical lens assembly and is then imaged on the photosensitive element.

First claim

Opening claim text (preview).

What is claimed is: 1. A camera module, comprising a first camera and a second camera, wherein the first camera and the second camera are arranged next to each other, each of the first camera and the second camera comprises a reflective element, an optical lens group, a photosensitive element, and a package shell; wherein: an incident optical axis of the first camera is substantially parallel to an incident optical axis of the second camera; a reflective optical axis of the first camera is substantially coincident with or parallel to a reflective optical axis of the second camera; light is incident into the first camera and the second camera, reflected by the reflective element of each of the first camera and the second camera, passes through the optical lens group of the corresponding one of the first camera and the second camera, and is further incident in the photosensitive element of the corresponding one of the first camera and the second camera to form an image; the reflective element, the optical lens group, and the photosensitive element are all packaged in the corresponding package shell; each package shell comprises a package substrate, a package sidewall, and a package top, the package sidewall is connected between the package substrate and the package top, a light-incident window is defined on the package top, and the light-incident window is located correspondingly to the reflective element; and each package sidewall comprises an abutting surface and a non-abutting surface, the abutting surface of the first camera abuts against the abutting surface of the second camera, and the abutting surface of the first camera and the abutting surface of the second camera are substantially parallel to the reflective optical axes of the first camera and the second camera. 2. The camera module as claimed in claim 1 , wherein each of the first camera and the second camera further comprises a receiving element configured to receive the optical lens group, wherein the reflective element, the receiving element, and the photosensitive element are all packaged in the corresponding package shell. 3. The camera module as claimed in claim 2 , wherein each of the first camera and the second camera further comprises a supporting element, and the supporting element abuts against the reflective element and the package shell, respectively. 4. The camera module as claimed in claim 1 , wherein the light-incident window of the first camera is flush with the light-incident window of the second camera, and the package substrate of the first camera is flush with the package substrate of the second camera. 5. The camera module as claimed in claim 1 , wherein each package sidewall defines a notch, each of the first camera and the second camera further comprises a circuit board assembly, the circuit board assembly is electrically connected to the photosensitive element and exposed from the corresponding notch. 6. The camera module as claimed in claim 5 , wherein the package sidewall comprises: a first sidewall; a second sidewall, disposed oppositely to the first sidewall; wherein the first sidewall comprises a first surface disposed oppositely to the second sidewall, the second sidewall comprises a second surface disposed oppositely to the first sidewall, and the first surface and the second surface are substantially perpendicular to the reflective optical axis of the corresponding one of the first camera and the second camera; a third sidewall; and a fourth sidewall, disposed oppositely to the third sidewall; and wherein the third sidewall comprises one of the abutting surface and the non-abutting surface, the fourth sidewall comprises the other of the abutting surface and the non-abutting surface, and the notch is defined in the non-abutting surface. 7. The camera module as claimed in claim 6 , wherein the third sidewall of the first camera comprises the non-abutting surface, and the circuit board assembly of the first camera is disposed on the first sidewall of the first camera and exposed out from the notch; and wherein the fourth sidewall of the second camera comprises the non-abutting surface, and the circuit board assembly of the second camera is disposed on the first sidewall of the second camera and exposed out from the notch. 8. The camera module as claimed in claim 1 , wherein the reflective element is a prism, and the reflective element comprises a light-incident surface, a light-exiting surface, and a reflective surface; wherein the light-incident surface is substantially perpendicular to the light-exiting surface and disposed correspondingly to the light-incident window, the reflective surface is connected to the light-incident surface and the light-exiting surface and configured to reflect the light entering the first camera and the second camera through the corresponding light-incident window. 9. The camera module as claimed in claim 1 , wherein the reflective element of the first camera is disposed away from the reflective element of the second camera, and the photosensitive element of the first camera is disposed oppositely to the photosensitive element of the second camera. 10. An electronic device, comprising: a housing; and a camera module, disposed on the housing and comprising a first camera and a second camera, wherein the first camera and the second camera are arranged next to each other, each of the first camera and the second camera comprises a reflective element, an optical lens group, a photosensitive element, and a package shell; wherein: an incident optical axis of the first camera is substantially parallel to an incident optical axis of the second camera; a reflective optical axis of the first camera is substantially coincident with or parallel to a reflective optical axis of the second camera; light is incident into the first camera and the second camera, reflected by the reflective element of each of the first camera and the second camera, passes through the optical lens group of the corresponding one of the first camera and the second camera, and is further incident in the photosensitive element of the corresponding one of the first camera and the second camera to form an image; the reflective element, the optical lens group, and the photosensitive element are all packaged in the corresponding package shell; each package shell comprises a package substrate, a package sidewall, and a package top, the package sidewall is connected between the package substrate and the package top, a light-incident window is defined on the package top, and the light-incident window is located correspondingly to the reflective element; and each package sidewall comprises an abutting surface and a non-abutting surface, the abutting surface of the first camera abuts against the abutting surface of the second camera, and the abutting surface of the first camera and the abutting surface of the second camera are substantially parallel to the reflective optical axes of the first camera and the second camera. 11. The electronic device as claimed in claim 10 , wherein each of the first camera and the second camera further comprises a receiving element configured to receive the optical lens group; the reflective element, the receiving element, and the photosensitive element are all packaged in the corresponding package shell. 12. The electronic device as claimed in claim 11 , wherein each of the first camera and the second camera further comprises a supporting element, and the supporting element abuts against the reflective element and the package shell, respectively. 13. The electronic device as claimed in claim 10 , wherein the light-incident window of the f

Assignees

Inventors

Classifications

  • Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

  • Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

  • Housings · CPC title

  • for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

  • H04M1/0264Primary

    for a camera module assembly · CPC title

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Frequently asked questions

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What does patent US11463568B2 cover?
Disclosed are a camera module and an electronic device. The camera module comprises at least two cameras. Two cameras of the at least two cameras are disposed in parallel; incident optical axes of the two cameras are parallel to each other; each camera includes a reflecting element, an optical lens assembly and a photosensitive element; and reflecting optical axes of the two cameras are consist…
Who is the assignee on this patent?
Guangdong Oppo Mobile Telecommunications Corp Ltd
What technology area does this patent fall under?
Primary CPC classification H04M1/0264. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).