Systems and methods for die transfer

Patent metadata

Field	Value
Publication number	US-11459190-B2
Application number	US-202017087216-A
Country	US
Kind code	B2
Filing date	Nov 2, 2020
Priority date	Oct 30, 2018
Publication date	Oct 4, 2022
Grant date	Oct 4, 2022

Abstract

In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

First claim

What is claimed is:

1. A system, comprising:
a source lane configured to move a first die to a source lane staging area;
an inspection sensor configured to produce a sensor result based on a die;
a fail target lane configured to move the die between a fail target lane out port and a fail target lane staging area;
a conveyor configured to move the die from the source lane staging area to the fail target lane staging area based on the sensor result; and
a first die container configured to hold the first die during transport by the source lane, wherein the first die container comprises a bar code and the inspection sensor is configured to read the bar code.

2. The system of claim 1 , wherein the source lane comprises a conveyor belt and the source lane staging area is a part of the source lane within a work envelope of the conveyor.

3. The system of claim 1 , wherein the conveyor is configured to provide movement of the first die container along two axes.

4. The system of claim 3 , wherein the first die container comprises multiple receptacles configured to each house a respective die.

5. The system of claim 4 , wherein each receptacles comprises:
a concavity configured to contact the respective die on a bottom surface.

6. The system of claim 1 , wherein the conveyor comprises a vacuum head configured to be moved between the source lane and a pass target lane.

7. A system, comprising:
a source lane configured to move a first die container to a source lane staging area;
a fail target lane configured to move a second die container between a fail target lane out port and a fail target lane staging area; and
a conveyor configured to move a die from the first die container at the source lane staging area to the second die container at the fail target lane staging area; and
an inspection sensor configured to produce a sensor result based on the die on the first die container.

8. The system of claim 7 , wherein the conveyor is configured to provide movement of the first die container along two axes.

9. The system of claim 8 , wherein the inspection sensor is located between a load port and a conveyor work envelope.

10. The system of claim 8 , wherein the inspection sensor is located on the conveyor.

11. The system of claim 8 , wherein the inspection sensor is configured to read an identifier on the first die container.

12. The system of claim 8 , wherein the inspection sensor is configured to determine whether the die contains a defect.

13. The system of claim 7 , wherein the source lane is configured to move the first die container in a first direction and the conveyor is configured to move the die in a second direction orthogonal to the first direction.

14. The system of claim 7 , wherein the conveyor comprises a robotic arm configured to secure the die via vacuum forces.

15. A method, comprising:
moving a first die container to a staging area via a source lane;
producing a sensor result based on a die on the first die container; and
moving the die from the first die container on the source lane to a second die container at at least one target lane based on the sensor result.

16. The method of claim 15 , further comprising:
moving the die from the first die container to the second die container at the at least one target lane in response to the sensor result indicating that the die is defect free.

17. The method of claim 15 , wherein the at least one target lane comprises a pass target lane and a fail target lane, the method further comprising:
moving the die from the first die container to the second die container at the fail target lane in response to the sensor result indicating that the die includes a defect.

18. The method of claim 17 , further comprising:
moving the die along the pass target lane to a pass target lane out port.

19. The method of claim 17 , further comprising:
moving the die from the first die container at the source lane to either the second die container at the pass target lane or the fail target lane using a conveyor.

20. The method of claim 19 , further comprising:
loading the second die container on an out port of the pass target lane; and
moving the second die container from the out port to the staging area via the pass target lane under the conveyor.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Kuo Tsung-Sheng
• Huang Chih-Hung
• Shiu Yi-Fam
• Wang Chueng-Jen
• Lee Hsuan
• Pai Jiun-Rong

Classifications

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P72/3222

  Loading to or unloading from a conveyor · CPC title

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title

• H10P72/0618

  using identification means, e.g. labels on substrates or labels on containers · CPC title

• H10P72/0611

  Sorting devices · CPC title