Induction welding using a heat sink and/or cooling

US11458691B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11458691-B2
Application numberUS-201916532954-A
CountryUS
Kind codeB2
Filing dateAug 6, 2019
Priority dateAug 6, 2019
Publication dateOct 4, 2022
Grant dateOct 4, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.

First claim

Opening claim text (preview).

The following is claimed: 1. A heat sink for use in induction welding, the heat sink comprising: a number of tiles each having edges, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; a joint flexibly joining the tiles together at the edges, wherein the joint is comprised of a silicone; and a fluid path defined by fluid channels disposed within the tiles and the joint for communicating a coolant through the heat sink. 2. The heat sink of claim 1 , wherein the tiles are comprised of Aluminum nitride. 3. The heat sink of claim 1 , wherein the tiles are comprised of Beryllium Oxide. 4. The heat sink of claim 1 , wherein the tiles are arranged in a single layer. 5. The heat sink of claim 1 , wherein the tiles define a gap therebetween and the joint is disposed within the gap. 6. The heat sink of claim 5 , wherein the gap is between about 0.005 inches to about 0.1 inches. 7. The heat sink of claim 1 , wherein the silicone has a long-term degradation temperature greater than about 400 degrees Fahrenheit in vacuum or air. 8. The heat sink of claim 7 , wherein the silicone has an elongation of between 12% and 670%. 9. The heat sink of claim 7 , wherein the silicone has a tear strength of between 31 lb/in and 190 lb/in. 10. The heat sink of claim 1 , wherein the tiles have a thermal conductivity of greater than about 75 W/mK. 11. The heat sink of claim 1 , wherein the tiles have a specific heat capacity of greater than about 500 J/K/kg. 12. The heat sink of claim 1 , wherein the joint is cured. 13. The heat sink of claim 1 , wherein the tiles and the joint have a thickness of less than 8 mm. 14. The heat sink of claim 13 , wherein the tiles and the joint have a thickness of 4 mm. 15. The heat sink of claim 1 , wherein the fluid channels in the tiles and the joint are connected in series. 16. The heat sink of claim 1 , further comprising multiple fluid paths, wherein the multiple fluid paths are unidirectional and parallel to one another relative to the heat sink. 17. The heat sink of claim 1 , wherein the fluid channels have a diameter of about 0.042 inches. 18. The heat sink of claim 1 , wherein the fluid channels have a diameter of about 0.082 inches. 19. The heat sink of claim 1 , further comprising a manifold connected to the fluid channels. 20. The heat sink of claim 19 , wherein the manifold includes a port that communicates with the fluid path. 21. A heat sink for use in induction welding, the heat sink comprising: a number of tiles each having edges, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; a joint flexibly joining the tiles together at the edges, wherein the tiles define a gap therebetween and the joint is disposed within the gap and the gap is between about 0.005 inches to about 0.1 inches; and a fluid path defined by fluid channels disposed within the tiles and the joint for communicating a coolant through the heat sink. 22. The heat sink of claim 21 , wherein the tiles are arranged in a single layer. 23. The heat sink of claim 21 , wherein the joint is cured. 24. The heat sink of claim 21 , wherein the fluid channels in the tiles and the joint are connected in series. 25. The heat sink of claim 21 , further comprising multiple fluid paths, wherein the multiple fluid paths are unidirectional and parallel to one another relative to the heat sink. 26. The heat sink of claim 21 , further comprising a manifold connected to the fluid channels, wherein the manifold includes a port that communicates with the fluid path.

Assignees

Inventors

Classifications

  • characterised by the cooling constructional aspects · CPC title

  • one placed behind the other in a single row in the feed direction · CPC title

  • Coatings; Surface treatments · CPC title

  • characterised by the composition of the plastics material of the parts to be joined (welding bar compositions B29C65/125) · CPC title

  • of the welding jaws · CPC title

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Frequently asked questions

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What does patent US11458691B2 cover?
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B29C66/349. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).