Injection-molded flexible cold plate
US-10712102-B2 · Jul 14, 2020 · US
US11458691B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11458691-B2 |
| Application number | US-201916532954-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 6, 2019 |
| Priority date | Aug 6, 2019 |
| Publication date | Oct 4, 2022 |
| Grant date | Oct 4, 2022 |
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A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
Opening claim text (preview).
The following is claimed: 1. A heat sink for use in induction welding, the heat sink comprising: a number of tiles each having edges, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; a joint flexibly joining the tiles together at the edges, wherein the joint is comprised of a silicone; and a fluid path defined by fluid channels disposed within the tiles and the joint for communicating a coolant through the heat sink. 2. The heat sink of claim 1 , wherein the tiles are comprised of Aluminum nitride. 3. The heat sink of claim 1 , wherein the tiles are comprised of Beryllium Oxide. 4. The heat sink of claim 1 , wherein the tiles are arranged in a single layer. 5. The heat sink of claim 1 , wherein the tiles define a gap therebetween and the joint is disposed within the gap. 6. The heat sink of claim 5 , wherein the gap is between about 0.005 inches to about 0.1 inches. 7. The heat sink of claim 1 , wherein the silicone has a long-term degradation temperature greater than about 400 degrees Fahrenheit in vacuum or air. 8. The heat sink of claim 7 , wherein the silicone has an elongation of between 12% and 670%. 9. The heat sink of claim 7 , wherein the silicone has a tear strength of between 31 lb/in and 190 lb/in. 10. The heat sink of claim 1 , wherein the tiles have a thermal conductivity of greater than about 75 W/mK. 11. The heat sink of claim 1 , wherein the tiles have a specific heat capacity of greater than about 500 J/K/kg. 12. The heat sink of claim 1 , wherein the joint is cured. 13. The heat sink of claim 1 , wherein the tiles and the joint have a thickness of less than 8 mm. 14. The heat sink of claim 13 , wherein the tiles and the joint have a thickness of 4 mm. 15. The heat sink of claim 1 , wherein the fluid channels in the tiles and the joint are connected in series. 16. The heat sink of claim 1 , further comprising multiple fluid paths, wherein the multiple fluid paths are unidirectional and parallel to one another relative to the heat sink. 17. The heat sink of claim 1 , wherein the fluid channels have a diameter of about 0.042 inches. 18. The heat sink of claim 1 , wherein the fluid channels have a diameter of about 0.082 inches. 19. The heat sink of claim 1 , further comprising a manifold connected to the fluid channels. 20. The heat sink of claim 19 , wherein the manifold includes a port that communicates with the fluid path. 21. A heat sink for use in induction welding, the heat sink comprising: a number of tiles each having edges, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; a joint flexibly joining the tiles together at the edges, wherein the tiles define a gap therebetween and the joint is disposed within the gap and the gap is between about 0.005 inches to about 0.1 inches; and a fluid path defined by fluid channels disposed within the tiles and the joint for communicating a coolant through the heat sink. 22. The heat sink of claim 21 , wherein the tiles are arranged in a single layer. 23. The heat sink of claim 21 , wherein the joint is cured. 24. The heat sink of claim 21 , wherein the fluid channels in the tiles and the joint are connected in series. 25. The heat sink of claim 21 , further comprising multiple fluid paths, wherein the multiple fluid paths are unidirectional and parallel to one another relative to the heat sink. 26. The heat sink of claim 21 , further comprising a manifold connected to the fluid channels, wherein the manifold includes a port that communicates with the fluid path.
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