Method for manufacturing an injection device with a bypass channel and tool for this purpose

US11458658B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11458658-B2
Application numberUS-201916377547-A
CountryUS
Kind codeB2
Filing dateApr 8, 2019
Priority dateApr 11, 2018
Publication dateOct 4, 2022
Grant dateOct 4, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A tool and a method for manufacturing a bypass in an injection device are disclosed. The preforms of the injection device are inserted into a tool. A partial region of the cylindrical portion is heated by a heat source. The heated partial region of the cylindrical portion is plastically deformed with a male die part of the tool, so that the bypass channel is formed.

First claim

Opening claim text (preview).

What is claimed is: 1. A tool for manufacturing an injection device with a bypass channel, wherein the tool is configured such that it supports at least one cylindrical portion of a preform, the tool comprises: a heat source arranged in the tool that heats a partial region of the cylindrical portion of the preform opposite a cylindrical outer surface of the cylindrical portion; and a male die part that is moveable into the preform in an axial direction and in the preform in a radial direction towards the heated partial region, the heated partial region corresponding to the bypass channel that is to be formed in the injection device. 2. The tool according to claim 1 , wherein the heat source is a contact and/or radiant heat source. 3. The tool according to claim 1 , wherein the tool has formed a stop for a handle of the preform, so that the preform with the partial region to be heated is reproducibly positioned opposite to the heat source of the tool. 4. The tool according to claim 1 , wherein the male die part is attached to a handle, by means of which the male die part is insertable into the preform in the axial direction, movable in the preform in the radial direction towards the heated partial region, and a pressure is exercisable on the heated partial region, so that the male die part forms the bypass channel.

Assignees

Inventors

Classifications

  • Injection needles, syringes · CPC title

  • Local deformation of formed objects · CPC title

  • Syringe barrels (A61M5/3205 and A61M5/50 take precedence) · CPC title

  • using an internal mandrel · CPC title

  • Forming by pressure difference, e.g. vacuum · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11458658B2 cover?
A tool and a method for manufacturing a bypass in an injection device are disclosed. The preforms of the injection device are inserted into a tool. A partial region of the cylindrical portion is heated by a heat source. The heated partial region of the cylindrical portion is plastically deformed with a male die part of the tool, so that the bypass channel is formed.
Who is the assignee on this patent?
Gerresheimer Regensburg Gmbh
What technology area does this patent fall under?
Primary CPC classification B29C45/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).