AOM system with interface board and signal vias and related methods

Patent metadata

Field	Value
Publication number	US-11454837-B2
Application number	US-201916691709-A
Country	US
Kind code	B2
Filing date	Nov 22, 2019
Priority date	Nov 22, 2019
Publication date	Sep 27, 2022
Grant date	Sep 27, 2022

Abstract

A system may include a laser source, and an AOM coupled to the laser source. The AOM may include an acousto-optic medium, and transducer electrodes carried by the acousto-optic medium. The system may also include an interface board having a dielectric layer, and vertically extending signal vias within the dielectric layer. Each vertically extending signal via may have a lower end in contact with a respective transducer electrode. The interface board may have laterally extending signal traces carried by the dielectric layer. Each laterally extending signal trace may be in contact with an upper end of a respective vertically extending signal via.

First claim

That which is claimed is:

1. A system comprising:
a laser source;
an acousto-optic modulator (AOM) coupled to said laser source and comprising an acousto-optic medium, and a plurality of transducer electrodes carried by said acousto-optic medium; and
an interface board comprising
a dielectric layer,
a plurality of vertically extending signal vias within said dielectric layer, each vertically extending signal via having a lower end in contact with a respective transducer electrode, and
a plurality of laterally extending signal traces carried by said dielectric layer, each laterally extending signal trace in contact with an upper end of a respective vertically extending signal via.

2. The system of claim 1 wherein said AOM comprises a reference voltage contact pad carried by said acousto-optic medium; and wherein said interface board comprises a plurality of vertically extending shield vias within said dielectric layer coupled to said reference voltage contact pad and defining respective reference voltage shields between adjacent laterally extending signal traces.

3. The system of claim 2 wherein said plurality of vertically extending shield vias also defines respective reference voltage shields for distal ends of said plurality of transducer electrodes.

4. The system of claim 2 wherein said plurality of vertically extending shield vias is coupled to a reference voltage on said interface board.

5. The system of claim 1 comprising modulator drive circuitry coupled to said plurality of laterally extending signal traces.

6. The system of claim 1 wherein said plurality of transducer electrodes comprises first and second sets of transducer electrodes.

7. The system of claim 6 wherein said plurality of vertically extending signal vias comprises first and second sets of vertically extending signal vias in contact with respective ones of said first and second sets of transducer electrodes on opposite sides of said acousto-optic medium.

8. The system of claim 1 wherein said acousto-optic medium has a plurality of trenches therein, each trench between adjacent ones of said plurality of transducer electrodes.

9. The system of claim 1 wherein said acousto-optic medium comprises at least one of fused silica and quartz.

10. The system of claim 1 comprising an atom trap downstream from said AOM so that the system defines a quantum computer.

11. A system comprising:
a laser source;
an acousto-optic modulator (AOM) coupled to said laser source and comprising an acousto-optic medium, a plurality of transducer electrodes carried by said acousto-optic medium, and a reference voltage contact pad carried by said acousto-optic medium;
an interface board comprising
a dielectric layer,
a plurality of vertically extending signal vias within said dielectric layer, each vertically extending signal via having a lower end in contact with a respective transducer electrode,
a plurality of laterally extending signal traces carried by said dielectric layer, each laterally extending signal trace in contact with an upper end of a respective vertically extending signal via, and
a plurality of vertically extending shield vias within said dielectric layer coupled to said reference voltage contact pad and defining respective reference voltage shields between adjacent laterally extending signal traces; and

modulator drive circuitry coupled to said plurality of laterally extending signal traces.

12. The system of claim 11 wherein said plurality of vertically extending shield vias also defines respective reference voltage shields for distal ends of said plurality of transducer electrodes.

13. The system of claim 11 wherein said plurality of vertically extending shield vias is coupled to a reference voltage on said interface board.

14. The system of claim 11 wherein said plurality of transducer electrodes comprises first and second sets of transducer electrodes.

15. The system of claim 14 wherein said plurality of vertically extending signal vias comprises first and second sets of vertically extending signal vias in contact with respective ones of said first and second sets of transducer electrodes on opposite sides of said acousto-optic medium.

16. The system of claim 11 wherein said acousto-optic medium has a plurality of trenches therein, each trench between adjacent ones of said plurality of transducer electrodes.

17. An interface board for a system comprising a laser source, and an acousto-optic modulator (AOM) coupled to the laser source and comprising an acousto-optic medium, and a plurality of transducer electrodes carried by the acousto-optic medium, the interface board comprising:
a dielectric layer;
a plurality of vertically extending signal vias within said dielectric layer, each vertically extending signal via having a lower end in contact with a respective transducer electrode; and
a plurality of laterally extending signal traces carried by said dielectric layer, each laterally extending signal trace in contact with an upper end of a respective vertically extending signal via.

18. The interface board of claim 17 further comprising a plurality of vertically extending shield vias within said dielectric layer coupled to a reference voltage contact pad of the AOM and defining respective reference voltage shields between adjacent laterally extending signal traces.

19. The interface board of claim 18 wherein said plurality of vertically extending shield vias also defines respective reference voltage shields for distal ends of said plurality of transducer electrodes.

20. The interface board of claim 18 wherein said plurality of vertically extending shield vias is coupled to a reference voltage of the interface board.

21. A method of making a system comprising:
forming an interface board comprising
a dielectric layer,
a plurality of vertically extending signal vias within the dielectric layer, each vertically extending signal via having a lower end in contact with a respective transducer electrode carried by an acousto-optic medium of an acousto-optic modulator (AOM), and
a plurality of laterally extending signal traces carried by the dielectric layer, each laterally extending signal trace in contact with an upper end of a respective vertically extending signal via; and

coupling the interface board to the AOM.

22. The method of claim 21 wherein the AOM comprises a reference voltage contact pad carried by the acousto-optic medium; and wherein the interface board comprises a plurality of vertically extending shield vias within the dielectric layer coupled to the reference voltage contact pad and defining respective reference voltage shields between adjacent laterally extending signal traces.

23. The method of claim 22 wherein the plurality of vertically extending shield vias also defines respective reference voltage shields for distal ends of a plurality of transducer electrodes.

24. The method of claim 22 wherein the plurality of vertically extending shield vias is coupled to a reference voltage on the interface board.

Assignees

• Eagle Tech Llc

Inventors

• Wasilousky Peter A
• Erhinyo John
• Lange Michael R
• Logan Catheryn D
• Morse Randall K
• Corey Christopher A

Classifications

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• G02F1/113 Primary

  Circuit or control arrangements · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K2201/09227

  Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting · CPC title

• G02F1/11 Primary

  based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves (acousto-optical deflection G02F1/33) · CPC title