Composite wood board

US11453780B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11453780-B2
Application numberUS-201916515490-A
CountryUS
Kind codeB2
Filing dateJul 18, 2019
Priority dateJan 25, 2007
Publication dateSep 27, 2022
Grant dateSep 27, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a stack of composite wood boards, the wood boards comprise wood particles and an organic binder.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a composite wood board comprising: applying an uncured, aqueous, thermosetting binder solution to non-or loosely assembled wood matter to provide resinated wood matter; and hot pressing the resinated wood matter to cure the uncured, aqueous, thermosetting, binder and form the composite wood board; wherein the uncured, aqueous, thermosetting binder solution is prepared by combining reactants including i) a reducing sugar reactant provided in the form of a reducing sugar per se or in the form of a carbohydrate which yields a reducing sugar in situ under thermal curing conditions, or a combination thereof; and ii) an amine reactant, wherein the amine reactant comprises a non-protein primary amine reactant + NH 3 R 1 , where R 1 is alkyl substituted by a group selected from at least one amino and at least one aminoalkyl and wherein R 1 does not comprise a secondary amino group; and wherein the composite wood board has one or more of the following characteristics: a modulus of elasticity (MOE) of at least 1800 N/mm 2 ; a bending strength (MOR) of at least 14 N/mm 2 ; an Internal bond strength (IB) of at least 0.28 N/mm 2 ; a thickness swelling after 24 hours in water at 20° C. of less than or equal to 12%; a water absorption after 24 hours in water at 20° C. of less than or equal to 40%. 2. The method of claim 1 , wherein the uncured, aqueous, thermosetting binder solution is substantially formaldehyde free. 3. The method of claim 1 , wherein the composite wood board has a modulus of elasticity (MOE) of at least 1800 N/mm 2 . 4. The method of claim 1 , wherein the composite wood board has a modulus of elasticity (MOE) of at least 2500 N/mm 2 . 5. The method of claim 1 , wherein the composite wood board has a bending strength (MOR) of at least 14 N/mm 2 . 6. The method of claim 1 , wherein the composite wood board has a bending strength (MOR) of at least 18 N/mm 2 . 7. The method of claim 1 , wherein the composite wood board has an Internal bond strength (IB) of at least 0.28 N/mm 2 . 8. The method of claim 1 , wherein the composite wood board has an Internal bond strength (IB) of at least 0.4 N/mm 2 . 9. The method of claim 1 , wherein the composite wood board has a Thickness swelling after 24 hours in water at 20° C. of less than or equal to 10%. 10. The method of claim 1 , wherein the composite wood board has a water absorption after 24 hours in water at 20° C. of less than or equal to 30%. 11. The method of claim 1 , wherein the composite wood board is a wood particle board. 12. The method of claim 1 , wherein the composite wood board is an orientated strand board. 13. The method of claim 1 , wherein the composite wood board is a fiber board. 14. The method of claim 1 , wherein the composite wood board has a binder content in the range of 8 to 18% by weight expressed as weight of dry binder to weight of dry wood. 15. The method of claim 1 , wherein the composite wood board comprises wax in the range 0.1 to 2% by weight. 16. The method of claim 1 , wherein preparation of the uncured, aqueous, thermosetting binder solution comprises combining the reducing sugar reactant(s) and the amine reactant such that the ratio of the number of moles of the amine reactant to the number of moles of the reducing sugar reactant(s) ranges from about 1:4 to about 1:15. 17. The method of claim 1 , wherein preparation of the uncured, aqueous, thermosetting, organic binder solution comprises combining the reducing sugar reactant(s) and the amine reactant such that the amount of reducing sugar reactant(s) is from about 73% to about 96% of the total weight of reactants. 18. The method of claim 1 , wherein preparation of the uncured, aqueous, thermosetting, organic binder solution comprises combining reactants consisting of i) the reducing sugar reactant provided in the form of a reducing sugar per se or in the form of a carbohydrate which yields a reducing sugar in situ under thermal curing conditions, or a combination thereof; and ii) the amine reactant, wherein the amine reactant consists of a non-protein primary amine reactant + NH 3 R 1 , where R 1 is alkyl substituted by a group selected from at least one amino and at least one aminoalkyl and wherein R 1 does not comprise a secondary amino group. 19. The method of claim 1 , wherein curing the uncured, aqueous, thermosetting, binder solution produces a cured binder which consists essentially of one or more reaction products of the reducing sugar reactant(s) and the amine reactant. 20. A method of manufacturing a composite wood board comprising: applying an uncured, aqueous, thermosetting binder solution to non-or loosely assembled wood matter to provide resinated wood matter; and hot pressing the resinated wood matter to cure the uncured, aqueous, thermosetting binder and form the composite wood board; wherein the uncured, aqueous, thermosetting, organic binder solution is prepared by combining reactants including i) a reducing sugar reactant provided in the form of a reducing sugar per se or in the form of a carbohydrate which yields a reducing sugar in situ under thermal curing conditions, or a combination thereof; and ii) an amine reactant, wherein the amine reactant comprises a non-protein primary amine reactant + NH 3 R 1 , where R 1 is alkyl substituted by a group selected from at least one amino and at least one aminoalkyl and wherein R 1 does not comprise a secondary amino group; and wherein preparation of the uncured, aqueous, thermosetting binder solution comprises combining the reducing sugar reactant(s) and the amine reactant such that the amount of reducing sugar reactant(s) is from about 73% to about 96% of the total weight of reactants; wherein the composite wood board has a binder content in the range of 8 to 18% by weight expressed as weight of dry binder to weight of dry wood; and wherein the composite wood board has: a modulus of elasticity (MOE) of at least 1800 N/mm 2 ; and a bending strength (MOR) of at least 14 N/mm 2 ; and an Internal bond strength (IB) of at least 0.28 N/mm 2 ; and a thickness swelling after 24 hours in water at 20° C. of less than or equal to 12%; and a water absorption after 24 hours in water at 20° C. of less than or equal to 40%.

Assignees

Inventors

Classifications

  • Compositions of polysaccharides or of their derivatives not provided for in groups C08L1/00 or C08L3/00 · CPC title

  • characterised by the type of binder (compositions of macromolecular compounds C08L) · CPC title

  • C08L97/02Primary

    Lignocellulosic material, e.g. wood, straw or bagasse {(manufacture of articles made from lignocellulosic material by dry processes B27N)} · CPC title

  • Fibres; Fibrils · CPC title

  • Organic macromolecular compounds, natural resins, waxes or and bituminous materials · CPC title

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What does patent US11453780B2 cover?
In a stack of composite wood boards, the wood boards comprise wood particles and an organic binder.
Who is the assignee on this patent?
Knauf Insulation Sprl, Knauf Insulation Inc
What technology area does this patent fall under?
Primary CPC classification C08L97/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 27 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).