System for cooling dual sides of power semiconductor device
US-2016126160-A1 · May 5, 2016 · US
US11448331B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11448331-B2 |
| Application number | US-201916586915-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 28, 2019 |
| Priority date | Dec 26, 2018 |
| Publication date | Sep 20, 2022 |
| Grant date | Sep 20, 2022 |
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A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open. When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach.
Opening claim text (preview).
What is claimed is: 1. A heat dissipation assembly, comprising: a case, comprising a chamber; and a partition structure, comprising a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, the partition wall comprising a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open, and when a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach, wherein the valve structure comprises two valve plates, and when the valve structure is pushed away, one of the two valve plates is opened and stretches into the first flow path or the second flow path. 2. The heat dissipation assembly according to claim 1 , wherein the first flow path comprises a first section and a second section, a flow path width of the first section of the first flow path is greater than a flow path width of the second section of the first flow path, the valve structure is located at a portion of the first section adjacent to the second section, or the valve structure is located at a boundary between the first section and the second section. 3. The heat dissipation assembly according to claim 1 , wherein when the valve structure is pushed away, the other of the two valve plates is also opened, and the two valve plates are opened in the same direction and stretch into the first flow path together or stretch into the second flow path together. 4. The heat dissipation assembly according to claim 1 , wherein the other of the two valve plates is also opened, and the heat dissipation assembly further comprises: at least one first stop structure, disposed on at least one of the first flow path and the second flow path to limit an angle at which the two valve plates are opened. 5. The heat dissipation assembly according to claim 1 , wherein the other of the two valve plates is also opened, and the heat dissipation assembly further comprises: at least one second stop structure, disposed beside the two valve plates to limit a direction in which the two valve plates are opened. 6. The heat dissipation assembly according to claim 1 , wherein the comprises two valve plates are flexible and fixed to the partition wall. 7. The heat dissipation assembly according to claim 1 , wherein the two valve plates are pivotally connected to the partition wall. 8. The heat dissipation assembly according to claim 1 , wherein a ratio of a length of each of the valve plates to a flow path width of the first flow path is between 0.2 and 0.6, and a ratio of the length of each of the valve plates to a flow path width of the second flow path is between 0.2 and 0.6. 9. The heat dissipation assembly according to claim 1 , wherein the two valve plates are adapted to be moved from a closed position to a maximum open position, each of the valve plates comprises a first side connected to the partition wall and a second side opposite to the first side, a position of the second side when the valve plate is located at the maximum open position and a position of the second side when the valve plate is located at the closed position are spaced by a distance, a ratio of the distance to a flow path width of the first flow path is between 0.2 and 0.6, and a ratio of the distance to a flow path width of the second flow path is between 0.2 and 0.6.
by flowing liquids, e.g. forced water cooling · CPC title
by varying the cross-section of the flow channels · CPC title
for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title
reacting to pressure and temperature · CPC title
for preventing overpressure · CPC title
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