Surface smoothing of copper by electropolishing

US11447887B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11447887-B2
Application numberUS-202017118115-A
CountryUS
Kind codeB2
Filing dateDec 10, 2020
Priority dateDec 10, 2020
Publication dateSep 20, 2022
Grant dateSep 20, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for forming an atomically smooth surface on a copper electrode through electropolishing and the atomically smooth surface are provided. An exemplary method for forming an atomically smooth surface by electropolishing includes placing a copper foil in an electrolyte solution including ethylene glycol and phosphoric acid. The copper foil is coupled to a current source. Current is applied to the copper foil to electropolish the copper foil. The electropolishing is stopped when the electropolishing is completed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming an atomically smooth surface by electropolishing, comprising: placing a copper foil in an electrolyte solution consisting of about 0.2 molar (M) ethylene glycol and about 3 M phosphoric acid; coupling the copper foil to a current source; applying current to the copper foil to electropolish the copper foil; and stopping the electropolishing when the electropolishing is completed, wherein the electropolished copper foil has a surface roughness of about 3 nm. 2. The method of claim 1 , comprising forming the electrolyte solution by mixing an 85% phosphoric acid solution into water and then adding the ethylene glycol to the electrolyte solution. 3. The method of claim 1 , comprising applying the current at about 380 mA per 2 cm 2 to the copper foil. 4. The method of claim 1 , comprising determining that the electropolishing is completed when the electrolyte solution changes color to blue. 5. The method of claim 1 , comprising determining that the electropolishing is completed after about 11.5 minutes. 6. The method of claim 1 , comprising using a counter electrode comprising a second copper foil. 7. The method of claim 1 , comprising controlling a temperature during the electropolishing at about 65° C. 8. The method of claim 1 , comprising using the copper foil as a working electrode in an electrochemical cell. 9. The method of claim 1 , comprising coupling two copper foils to the current source as working electrodes. 10. The method of claim 1 , comprising using a sense lead to monitor the current of a working electrode. 11. The method of claim 1 , comprising using a Ag/AgCl electrode as a reference electrode.

Assignees

Inventors

Classifications

  • Electrodes formed of a single material · CPC title

  • Pretreatment of metallic surfaces to be electroplated · CPC title

  • Metal or alloy · CPC title

  • C25F3/22Primary

    of heavy metals · CPC title

  • of metals or alloys not provided for in groups C25D11/04 - C25D11/32 · CPC title

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What does patent US11447887B2 cover?
A method for forming an atomically smooth surface on a copper electrode through electropolishing and the atomically smooth surface are provided. An exemplary method for forming an atomically smooth surface by electropolishing includes placing a copper foil in an electrolyte solution including ethylene glycol and phosphoric acid. The copper foil is coupled to a current source. Current is applied…
Who is the assignee on this patent?
Saudi Arabian Oil Co, Univ King Fahd Pet & Minerals
What technology area does this patent fall under?
Primary CPC classification C25F3/22. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 20 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).