Powder overlay nozzle
US-2015196975-A1 · Jul 16, 2015 · US
US11446765B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11446765-B2 |
| Application number | US-201815924453-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2018 |
| Priority date | Mar 22, 2017 |
| Publication date | Sep 20, 2022 |
| Grant date | Sep 20, 2022 |
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A first metal powder is supplied to a substrate to form a beginning part of a clad layer. After the beginning part is formed, the second metal powder is supplied to the substrate. A concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration thereof in the second metal powder.
Opening claim text (preview).
What is claimed is: 1. A method of producing a clad layer comprising: supplying metal powder that is copper-based metal powder to a surface of a substrate made of aluminum or aluminum alloy, emitting a laser beam to the metal powder, and melting the metal powder, the metal powder including a first metal powder and a second metal powder; and moving a supply position of the metal powder and an emission position of the laser beam in a predetermined direction along the surface of the substrate and forming the clad layer on the surface of the substrate in the predetermined direction, wherein the first metal powder is supplied from a first feeder to the substrate to form a beginning part of the clad layer, and after the beginning part is formed, the second metal powder is supplied from a second feeder to the substrate, and a concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration of the at least one of Si, Ni, Mo, and Al in the second metal powder so that a powder alloy components of the first metal powder are different from powder alloy components of the second metal powder, and wherein the second feeder is different from the first feeder. 2. The method according to claim 1 , wherein concentrations of Si, Ni, Mo, and Al in the first metal powder are lower than concentrations of Si, Ni, Mo, and Al in the second metal powder, respectively. 3. The method according to claim 1 , wherein a Si concentration in the first metal powder is lower than a Si concentration in the second metal powder. 4. The method according to claim 1 , wherein a Mo concentration in the first metal powder is lower than a Mo concentration in the second metal powder. 5. The method according to claim 1 , wherein an Al concentration in the first metal powder is lower than an Al concentration in the second metal powder. 6. The method according to claim 1 , wherein Si and Mo concentrations in the first metal powder are lower than Si and Mo concentrations in the second metal powder, respectively. 7. The method according to claim 1 , wherein Si and Ni concentrations in the first metal powder are lower than Si and Ni concentrations in the second metal powder, respectively. 8. The method according to claim 1 , wherein Si, Ni, and Mo concentrations in the first metal powder are lower than Si, Ni, and Mo concentrations in the second metal powder, respectively. 9. The method according to claim 1 , wherein an Al solid solubility limit of the first metal powder is higher than an Al solid solubility limit of the second metal powder. 10. The method according to claim 1 , wherein a laser output to the first metal powder is set to be lower than a laser output to the second metal powder. 11. The method according to claim 1 , wherein the second metal powder is supplied on the beginning part of the clad layer to form an end part of the clad layer. 12. The method according to claim 1 , wherein, when the first metal powder is supplied, the second metal powder is not supplied. 13. The method according to claim 1 , wherein, when the second metal powder is supplied, the first metal powder is not supplied.
Process efficiency · CPC title
Laser welding for purposes other than joining · CPC title
containing copper · CPC title
Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title
Energy control of the laser beam (B23K26/0622 takes precedence) · CPC title
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