Implant comprising embedded conductor track and production method

Patent metadata

Field	Value
Publication number	US-11446503-B2
Application number	US-201916972072-A
Country	US
Kind code	B2
Filing date	Jun 28, 2019
Priority date	Jul 6, 2018
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

The disclosure related to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.

First claim

The invention claimed is:

1. An implant comprising:
a substrate having a heating element integrated therein;
a housing, wherein the housing is disposed on the substrate so that edges of the housing are disposed on the heating element, wherein heating the heating element forms a hermetic seal between the housing and the substrate;
an electronic circuit disposed on the substrate inside the housing;
an electronic component disposed on the substrate outside the housing;
a conductor track, wherein the conductor track connects the electronic circuit to the electronic component;
wherein the conductor track is embedded into the substrate at least in sections so that at least one section of the conductor track is completely surrounded by the substrate.

2. The implant according to claim 1 , wherein the conductor track is completely embedded into the substrate so that the conductor track is surrounded by the substrate across the entire length thereof.

3. The implant according to claim 1 , wherein the electronic component is an electrode or a sensor.

4. The implant according to claim 1 , wherein multiple electronic components are disposed on the substrate outside the housing, the multiple electronic components being connected to the electronic circuit by way of multiple conductor tracks, and the multiple conductor tracks being embedded into the substrate at least in sections so that, for each conductor track, at least one section of the respective conductor track is completely surrounded by the substrate.

5. The implant according to claim 1 , wherein the substrate is a multi-layer substrate, and at least one section of the conductor track is embedded between two layers of the multi-layer substrate.

6. The implant according to claim 1 , wherein the substrate is made of a thermoplastic.

7. The implant according to claim 1 , wherein the housing is made of a thermoplastic.

8. The implant according to claim 1 , wherein the substrate and the housing are made of the same material.

9. The implant according to claim 1 , wherein a second housing is disposed on the substrate, and a second electronic circuit is disposed on the substrate inside the second housing.

10. The implant according to claim 9 , wherein the housing comprising the electronic circuit and the second housing comprising the second electronic circuit are disposed on the same side of the substrate.

11. The implant according to claim 10 , wherein the housing and the second housing are disposed at a distance from one another, and the substrate is flexible in a region between the housing and the second housing.

12. The implant according to claim 9 , wherein the housing comprising the electronic circuit is disposed on a first side of the substrate, and the second housing comprising the second electronic circuit is disposed on a second side of the substrate, the second side being situated opposite the first side.

13. The implant according to claim 1 , wherein a coil is integrated into the housing.

14. A method for creating an implant, comprising the following steps:
providing a substrate having a heating element integrated therein defining a housing boundary;
disposing an electronic circuit on the substrate within the housing boundary;
disposing a housing on the substrate so that edges of the housing are disposed on the heating element and the electronic circuit is disposed inside the housing;
heating the heating element to hermetically seal the housing to the substrate;
disposing an electronic component on the substrate outside the housing; and
establishing a connection between the electronic circuit and the electronic component by way of a conductor track,
wherein the conductor track is embedded into the substrate at least in sections so that at least one section of the conductor track is completely surrounded by the substrate.

Assignees

• Biotronik Se & Co Kg

Inventors

• Bihler Eckardt
• Hauer Marc
• Muessig Dirk

Classifications

• A61N1/37211

  Means for communicating with stimulators · CPC title

• A61N1/375 Primary

  Constructional arrangements, e.g. casings · CPC title

• A61B5/24

  Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof · CPC title

• A61N1/36125 Primary

  Details of circuitry or electric components · CPC title

• A61N1/3754

  Feedthroughs · CPC title