Flexible circuit board on bus bars

Patent metadata

Field	Value
Publication number	US-11445602-B2
Application number	US-201917260874-A
Country	US
Kind code	B2
Filing date	Jul 12, 2019
Priority date	Jul 18, 2018
Publication date	Sep 13, 2022
Grant date	Sep 13, 2022

Abstract

A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar.

First claim

The invention claimed is:

1. A circuit board including a plurality of conductive pieces that are connected to terminals of a semiconductor element and are provided flush with each other, and an insulation region arranged between the conductive pieces, the circuit board comprising:
a first conductive piece to which the semiconductor element is fixed;
a conductive sheet that is connected to a second conductive piece via a first connection portion and electrically connects a first terminal of the semiconductor element to the second conductive piece; and
a second connection portion that is provided in the conductive sheet and electrically connects the first terminal and the second conductive piece.

2. The circuit board according to claim 1 ,
wherein the conductive sheet includes:
a conductive portion that electrically connects the first terminal and the second conductive piece, and an insulation sheet that insulates the conductive portion from at least the first conductive piece; and

wherein the second connection portion includes:
a recession portion formed such that the conductive portion is exposed therein, and an inner conductive portion that is provided inside the recession portion and electrically connects the conductive portion and the second conductive piece.

3. The circuit board according to claim 1 , wherein the second connection portion is provided in a vicinity of the insulation region.

4. The circuit board according to claim 2 , wherein the inner conductive portion is an annular portion formed on an inward surface of the recession portion.

5. The circuit board according to claim 2 , wherein the inner conductive portion is solder that has been welded to the conductive portion and the second conductive piece.

6. The circuit board according to claim 4 , wherein the conductive portion is plate-shaped.

7. The circuit board according to claim 1 , wherein the conductive sheet is an FPC (Flexible Printed Circuit).

8. The circuit board according to claim 2 , wherein the second connection portion is provided in a vicinity of the insulation region.

9. The circuit board according to claim 5 , wherein the conductive portion is plate-shaped.

10. The circuit board according to claim 2 , wherein the conductive sheet is an FPC (Flexible Printed Circuit).

11. The circuit board according to claim 3 , wherein the conductive sheet is an FPC (Flexible Printed Circuit).

12. The circuit board according to claim 4 , wherein the conductive sheet is an FPC (Flexible Printed Circuit).

13. The circuit board according to claim 5 , wherein the conductive sheet is an FPC (Flexible Printed Circuit).

14. The circuit board according to claim 6 , wherein the conductive sheet is an FPC (Flexible Printed Circuit).

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Hiratani Shungo
• Okumi Shinsuke
• Nakamura Arinobu
• Haraguchi Akira
• Cao Heng

Classifications

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K1/0265 Primary

  characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections · CPC title

• H05K2201/10272

  Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title