Narrow type inkjet print head chip

Patent metadata

Field	Value
Publication number	US-11440322-B2
Application number	US-202117206816-A
Country	US
Kind code	B2
Filing date	Mar 19, 2021
Priority date	Mar 20, 2020
Publication date	Sep 13, 2022
Grant date	Sep 13, 2022

Abstract

A narrow type inkjet print head chip is disclosed and includes a silicon substrate, an active component layer and a passive component layer. The active component layer is stacked on the silicon substrate and includes plural ESD protection units, plural encoder switches, plural discharge protection units and plural heater switches. The ESD protection units, the encoder switches, the discharge protection units and the heater switches are disposed in each of at least two high-precision regions of the active component layer. The corresponding positions and quantities of these components are the same in the at least two high-precision regions. The passive component layer is stacked on the active component layer and includes plural heaters, plural electrode pads, plural encoders and plural circuit traces. The circuit traces are electrically connected to the ESD protection units, the encoder switches, the heater switches, the heaters, the electrode pads and the encoders.

First claim

What is claimed is:

1. A narrow type inkjet print head chip, comprising:
a silicon substrate, comprising:
a first long side;
a second long side opposite to the first long side;
a first short side connected to the first long side and the second long side; and
a second short side connected to the first long side and the second long side, and opposite to the first short side;

an active component layer stacked on the silicon substrate and comprising:
a plurality of electro static discharge (ESD) protection units disposed adjacent to the first long side and arranged along the first long side;
a plurality of encoder switches disposed adjacent to the first long side and arranged along the first long side;
a plurality of discharge protection units disposed adjacent to the first long side and arranged along the first long side; and
a plurality of heater switches disposed in parallel with the plurality of electro static discharge (ESD) protection units;

wherein the plurality of electro static discharge (ESD) protection units, the plurality of encoder switches, the plurality of discharge protection units and the plurality of heater switches are disposed in each of at least two high-precision regions of the active component layer, respectively, wherein corresponding positions and quantities of the plurality of electro static discharge (ESD) protection units, the plurality of encoder switches, the plurality of discharge protection units and the plurality of heater switches are the same in the at least two high-precision regions; and
a passive component layer stacked on the active component layer and comprising:
a plurality of heaters arranged along the second long side;
a plurality of electrode pads;
a plurality of encoders arranged along the first long side and adjacently connected to the plurality of encoder switches, respectively; and
a plurality of circuit traces electrically connected to the plurality of electro static discharge (ESD) protection units, the plurality of encoder switches, the plurality of discharge protection units, the plurality of heater switches, the plurality of heaters, the plurality of electrode pads and the plurality of encoders.

2. The narrow type inkjet print head chip according to claim 1 , wherein each of the plurality of electro static discharge (ESD) protection units is a pull-down resistor protection device.

3. The narrow type inkjet print head chip according to claim 1 , wherein each of the plurality of electro static discharge (ESD) protection units, the plurality of heater switches and the plurality of the encoder switches is a n-type metal oxide semiconductor (NMOS) element.

4. The narrow type inkjet print head chip according to claim 1 , wherein the at least two high-precision regions comprise a first high-precision region and a second high-precision region, wherein the first high-precision region and the second high-precision region are in a long and narrow shape, and arranged along the first long side, wherein the corresponding positions and quantities of the plurality of electro static discharge (ESD) protection units, the plurality of encoder switches, the plurality of discharge protection units and the plurality of heater switches are the same in the first high-precision region and the second high-precision region.

5. The narrow type inkjet print head chip according to claim 1 , wherein the at least two high-precision regions comprise a first high-precision region, a second high-precision region and a third high-precision region, wherein the first high-precision region, the second high-precision region and the third high-precision region are in a long and narrow shape, and arranged along the first long side, wherein the corresponding positions and quantities of the plurality of electro static discharge (ESD) protection units, the plurality of encoder switches, the plurality of discharge protection units and the plurality of heater switches are the same in the first high-precision region, the second high-precision region and the third high-precision region.

6. The narrow type inkjet print head chip according to claim 1 , wherein the passive component layer is made of at least one material selected from the group consisting of gold, aluminum, tantalum and a combination thereof.

7. The narrow type inkjet print head chip according to claim 1 , wherein the plurality of electrode pads are arranged along the first short side and the second short side.

8. The narrow type inkjet print head chip according to claim 1 , wherein the plurality of electrode pads are arranged in an L-shape.

9. The narrow type inkjet print head chip according to claim 1 , wherein the plurality of electrode pads are arranged along the first long side.

Assignees

• Microjet Technology Co Ltd

Inventors

• Mou Hao-Jan
• Yu Rong-Ho
• Chang Cheng-Ming
• Tai Hsien-Chung
• Liao Wen-Hsiung
• Huang Chi-Feng
• Han Yung-Lung

Classifications

• B41J2/14072

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2202/13

  Heads having an integrated circuit · CPC title

• B41J2/04511

  for electrostatic discharge protection · CPC title

• B41J2/0458

  controlling heads based on heating elements forming bubbles · CPC title

• B41J2/1632

  machining · CPC title