Method for producing a substrate adapter and substrate adapter for connecting to an electronic component

Patent metadata

Field	Value
Publication number	US-11440310-B2
Application number	US-201916704145-A
Country	US
Kind code	B2
Filing date	Dec 5, 2019
Priority date	Dec 6, 2018
Publication date	Sep 13, 2022
Grant date	Sep 13, 2022

Abstract

One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

First claim

The invention claimed is:

1. A method for producing a substrate adapter for connecting to an electronic component, comprising:
arranging at least one contacting material layer on a surface of a substrate and between at least one side of a carrier and the surface of the substrate such that the at least one contacting material layer has at least one predetermined breaking point;
joining the carrier and the substrate to the at least one contacting material layer;
wherein the carrier comprises at least one adhesive layer with a substantially constant adhesive force over the surface of the carrier; and
wherein the at least one contacting material layer comprises at least one of a sinter material, a sinter paste, and a sinter foil;
wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer with a plurality of material recesses in the at least one contacting material layer thereby forming the at least one predetermined breaking point, wherein the plurality of material recesses are situated on a surface of the at least one contacting material layer or face toward the carrier; and
lifting off and detaching the substrate with the contacting material layer arranged thereon, the contacting material layer breaks off along the predetermined breaking point.

2. The method according to claim 1 , wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer at least for a portion in the form of three-dimensional structures in a form comprising one of pyramid-shaped, sphere-shaped, cube-shaped, torus-shaped, cylinder-shaped, and cone-shaped structures, wherein the plurality of material recesses are formed of at least one space between adjacent three-dimensional structures.

3. The method according to claim 2 , wherein the arranging of the at least one contacting material layer comprises evenly spaced arranging, of the three-dimensional structures along a first axis of extension and a second axis of extension, wherein the first and the second axis of extension are situated at an angle of substantially 90° to each other.

4. The method according to claim 1 , wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer on the carrier by pressing, comprising at least one of silk screening, spraying on, and doctor blading, or arranging the at least one contacting material layer on the carrier by embossing with a stamp or a profiled roller.

5. The method according to claim 1 , wherein the at least one contacting material layer comprises at least one of an adhesive, a solder, a silver, a silver alloy, a copper, and a copper alloy.

6. The method according to claim 1 , wherein the method comprises detaching the substrate adapter with a gripping or suctioning device, substantially along the at least one predetermined breaking point between the contacting material layer and the carrier.

7. The method according to claim 1 , comprising separating the substrate and the carrier joined to the at least one contacting material layer after the joining of the carrier and the substrate to the at least one contacting material layer, dividing, prior to the detaching of the substrate joined to the at least one contacting material layer, into at least two with separating of shaped parts of the substrate joined to the contacting material layer, into a plurality of shaped parts by means of sawing, stamping, and/or etching.

8. The method according to claim 1 , wherein the substrate comprises one of a metal element, a metal foil, and a copper foil.

9. A substrate adapter for connecting to an electronic component, comprising:
a carrier;
a substrate; and
a contacting material layer comprising at least one of a sinter material, a sinter paste, and a sinter foil;
wherein the contacting material layer is arranged on a surface of the substrate between at least one side of the carrier and the surface of the substrate;
wherein the contacting material layer has at least one predetermined breaking point;
wherein the carrier comprises at least one adhesive layer with a substantially constant adhesive force over the surface of the carrier;
wherein the carrier and the substrate are joined to the contacting material layer;
wherein the contacting material layer comprises a plurality of recesses in the contacting material layer in order to form the predetermined breaking point, the material recesses situated on a surface of the contacting material layer or facing toward the carrier; and
wherein the at least one predetermined breaking point is configured such that lifting off and detaching the substrate causes the contacting material layer to break off along the predetermined breaking point.

10. The substrate adapter according to claim 9 , wherein the contacting material layer is arranged at least for a portion in the form of three-dimensional structures comprising at least one of pyramid-shaped, sphere-shaped, cube-shaped, torus-shaped, cylinder-shaped, and cone-shaped structures, wherein the material recesses are formed of at least one space between adjacent three-dimensional structures.

11. The substrate adapter according to claim 10 , wherein the three-dimensional structures are arranged, evenly spaced, along a first axis of extension and a second axis of extension, wherein the first and the second axis of extension are situated at an angle of substantially 90° to each other.

12. The substrate adapter according to claim 9 , wherein the contacting material layer comprises an adhesive, a solder, a sinter foil comprising one of a silver, a silver alloy, a copper, and a copper alloy.

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Klein Andreas Steffen
• Hinrich Andreas
• Schaefer Michael
• Loewer Yvonne
• Schmitt Wolfgang
• Lemmer Michael

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07331

  Connecting techniques · CPC title