Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional object

US11440249B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11440249-B2
Application numberUS-202117141389-A
CountryUS
Kind codeB2
Filing dateJan 5, 2021
Priority dateOct 8, 2018
Publication dateSep 13, 2022
Grant dateSep 13, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

First claim

Opening claim text (preview).

What is claimed is: 1. A three-dimensional, additive manufacturing system comprising: a carrier substrate configured to be displaced along a direction of travel while the three-dimensional, additive manufacturing system is in operation; a printer module over the carrier substrate, the printer module comprising a plurality of material storage devices and a plurality of dispensing devices configured to dispense fluidized material onto the carrier substrate, each of the dispensing devices being connected to one of the plurality of material storage devices; a binder printer located downstream along the carrier substrate from the plurality of dispensing devices according to the direction of travel of the carrier substrate, the binder printer being configured to deposit a liquid binding material on the fluidized material dispensed onto the carrier substrate by the printer module to fix a predetermined pattern in the fluidized material; a compaction device located downstream from the plurality of dispensing devices and upstream from the binder printer according to the direction of travel of the carrier substrate, the compaction device being configured to apply a controlled pressure orthogonal to the carrier substrate to increase a compaction of the fluidized material to a predetermined compaction range prior to the binder printer depositing the liquid binding material on the fluidized material; and a fusion device downstream from the binder printer according to the direction of travel of the carrier substrate and configured to solidify the liquid binding material deposited by the binder printer. 2. The system of claim 1 , wherein the printer module comprises a jetted binder printer. 3. The system of claim 1 , wherein materials in the plurality of material storage devices are different than one another. 4. The system of claim 1 , wherein each of the plurality of dispensing devices comprises a roller to spread fluidized particles on the carrier substrate. 5. The system of claim 1 , wherein each of the plurality of material storage devices comprises a fluidized powder. 6. The system of claim 1 , wherein the compaction device is configured to control the predetermined compaction range of each material layer. 7. The system of claim 1 , wherein the compaction device comprises a pressure plate assembly. 8. The system of claim 1 , wherein the compaction device is configured to compact the material to a density of at least 40% of a theoretical density. 9. The system of claim 1 , wherein the fusion device is configured to solidify the liquid binding material using radiant energy.

Assignees

Inventors

Classifications

  • Serial processing with multiple devices grouped · CPC title

  • Parallel processing within single device · CPC title

  • Metering means · CPC title

  • Two or more means for feeding material · CPC title

  • Processes of additive manufacturing · CPC title

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Frequently asked questions

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What does patent US11440249B2 cover?
A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller…
Who is the assignee on this patent?
Sakuu Corp
What technology area does this patent fall under?
Primary CPC classification B29C64/165. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).