Saw blade
US-2017120357-A1 · May 4, 2017 · US
Method of manufacturing cutting tool
US11440147B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11440147-B2 |
| Application number | US-202016800261-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2020 |
| Priority date | Feb 25, 2019 |
| Publication date | Sep 13, 2022 |
| Grant date | Sep 13, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a cutting tool having a plurality of cutting edges arranged in line by machining a workpiece, the method comprising: a process of scanning a cylindrical irradiation region including a focused spot of laser light that has been emitted in an irradiation direction to machine a flank face side of the workpiece, wherein in the process, the cylindrical irradiation region is scanned along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges, and the scanning path having periodicity results from alternately connecting a first path on which the cylindrical irradiation region is moved relative to the workpiece in a direction in which the machining depth increases and a second path on which the cylindrical irradiation region is moved relative to the workpiece in a direction in which the machining depth decreases, the irradiation direction of the laser light being different between the first path and the second path. 2. The method of manufacturing a cutting tool according to claim 1 , wherein in the process, the plurality of cutting edges are formed to have cutting edge tips arranged at equal intervals. 3. The method of manufacturing a cutting tool according to claim 1 , wherein the scanning path is a periodic wavy path. 4. The method of manufacturing a cutting tool according to claim 1 , wherein the workpiece is a material that results from diamond-coating a tool base material.
Assignees
Inventors
Classifications
Working by transmitting the laser beam through or within the workpiece · CPC title
Tools · CPC title
Inorganic materials other than metals or composite materials · CPC title
Laser etching · CPC title
cutting tools (sawing tools B23D63/00, B23D65/00; files or rasps B23D73/00) · CPC title
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- What does patent US11440147B2 cover?
- A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has pe…
- Who is the assignee on this patent?
- National Univ Corporation Tokai National Higher Education And Research System, Nagoya Inst Tech
- What technology area does this patent fall under?
- Primary CPC classification B23K26/402. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Sep 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).