Voltage regulator module

Patent metadata

Field	Value
Publication number	US-11439017-B2
Application number	US-202117198779-A
Country	US
Kind code	B2
Filing date	Mar 11, 2021
Priority date	Oct 9, 2018
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

A voltage regulator module includes a first circuit board assembly, a second circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board. The second circuit board assembly includes a second printed circuit board, at least one output capacitor, a plurality of ball grid arrays and at least one bonding pad. The second printed circuit board includes a first surface and a second surface. The plurality of ball grid arrays are disposed on the second surface of the second printed circuit board. The at least one bonding pad is arranged beside the first surface of the second printed circuit board. The magnetic core assembly is arranged between the first circuit board assembly and the second circuit board assembly and electrically connected with the at least one bonding pad. The at least one output capacitor is embedded within the second circuit board assembly.

First claim

What is claimed is:

1. A voltage regulator module, comprising:
a first circuit board assembly comprising a first printed circuit board and a plurality of switch elements, wherein the first printed circuit board comprises a first surface and a second surface;
a second circuit board assembly comprising a second printed circuit board, at least one output capacitor and a plurality of ball grid arrays, wherein the second printed circuit board comprises a first surface and a second surface, wherein the second surface of the first printed circuit board faces to the first surface of the second printed circuit board, and the plurality of ball grid arrays are disposed on the second surface of the second printed circuit board; and
a magnetic core assembly arranged between the first surface of the first printed circuit board and the first surface of the second printed circuit board;
wherein the magnetic core assembly comprises a magnetic core portion and at least one first copper structure, wherein the magnetic core portion comprises a plurality of openings, and each of the at least one first copper structure is penetrated through corresponding openings, wherein a first terminal of the at least one first copper structure and the corresponding switch element are electrically connected, and a second terminal of the at least one first copper structure and a part of the plurality of ball grid arrays are electrically connected;
wherein the second terminal of the at least one first copper structure and a terminal of the at least one output capacitor are electrically connected, and the other terminal of the at least one output capacitor is electrically connected with another part of the plurality of ball grid arrays.

2. The voltage regulator module according to claim 1 , wherein the second circuit board assembly comprises at least one bonding pad, wherein the magnetic core assembly is arranged between the first circuit board assembly and the second circuit board assembly, and the at least one first copper structure is electrically connected with the at least one bonding pad.

3. The voltage regulator module according to claim 2 , wherein the second circuit board assembly further comprises a plurality of copper blocks and a second molding compound layer, wherein the plurality of copper blocks are fixed on the first surface of the second printed circuit board to provide a supporting function, and the first surface of the second printed circuit board, the at least one output capacitor and the plurality of copper blocks are encapsulated by the second molding compound layer through a plastic molding process, wherein a top surface of each copper block is exposed outside the second molding compound layer to form the at least one bonding pad.

4. The voltage regulator module according to claim 2 , wherein the first circuit board assembly further comprises a first molding compound layer, the first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the plurality of switch elements, wherein the at least one first copper structure is U-shaped, and each of the at least one first copper structure is penetrated through two corresponding openings to define at least two inductors, wherein a first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

5. The voltage regulator module according to claim 4 , wherein the magnetic core assembly further comprises at least one second copper structure and a third copper structure, wherein a height of the magnetic core portion is lower than a height of the first copper structure, a height of the second copper structure and a height of the third copper structure, wherein the at least one second copper structure is U-shaped, and the at least one third copper structure is U-shaped.

6. The voltage regulator module according to claim 5 , wherein the first circuit board assembly further comprises two first bonding pads and at least one pair of second bonding pads, and the second circuit board assembly further comprises a fourth bonding pad and at least one fifth bonding pad, wherein the first bonding pads and the fourth bonding pad are electrically connected with a positive input end of the voltage regulator module, the second bonding pads and the at least one fifth bonding pad are electrically connected with a negative output terminal of the voltage regulator module, the third copper structure is fixed on and electrically connected with the two first bonding pads and the fourth bonding pad, each second copper structure is fixed on and electrically connected with the corresponding pair of second bonding pads and the corresponding fifth bonding pad, and the first circuit board assembly and the second circuit board assembly are supported by the at least one first copper structure, the at least one second copper structure and the third copper structure.

7. The voltage regulator module according to claim 4 , wherein the first circuit board assembly further comprises an even number of third bonding pads, and the second circuit board assembly further comprises at least one sixth bonding pad, wherein each third bonding pad is electrically connected with the first terminal of the corresponding inductor, the at least one sixth bonding pad is electrically connected with a positive output terminal of the voltage regulator module, and each first copper structure is fixed on and electrically connected with the corresponding two third bonding pads and the corresponding sixth bonding pad.

8. The voltage regulator module according to claim 4 , further comprising an input capacitor, wherein the input capacitor is disposed on the first surface of the first printed circuit board and encapsulated by the first molding compound layer, wherein a first terminal of the input capacitor is electrically connected with a positive input end of the voltage regulator module, and a second terminal of the input capacitor is electrically connected with a negative input end of the voltage regulator module.

9. The voltage regulator module according to claim 1 , wherein the at least one output capacitor is embedded within the second printed circuit board.

10. The voltage regulator module according to claim 1 , wherein the at least one output capacitor is disposed in the second circuit board assembly.

11. The voltage regulator module according to claim 1 , wherein a plurality of perforations and a plurality of first blind holes are formed in the first printed circuit board, and a plurality of second blind holes are formed in the second printed circuit board, wherein the voltage regulator module further comprises a signal communication part with a plurality of pins, and the plurality of pins are divided into a first pin group and a second pin group, wherein first terminals of the pins in the first pin group are fixed in the corresponding perforations of the first printed circuit board, first terminals of the pins in the second pin group are fixed in the first blind holes of the first printed circuit board, second terminals of the plurality of pins are fixed in the corresponding second blind holes of the second printed circuit board, and a control signal is transmitted between the first circuit board assembly and the second circuit board assembly through the signal communication part.

12. The voltage regulator module according to claim 1 , wherein a plurality of first conduction pads are formed on the first printed circuit board, a plurality of second conduction pads are formed on the second circuit board assembly, the voltage regulator module comprises a signal communication part with a conduction circuit board, and the conductio

Assignees

• Delta Electronics Inc

Inventors

• Xiong Yahong
• Jin Da
• Su qinghua

Classifications

• H10W90/00

  Package configurations · CPC title

• H02M1/00

  Details of apparatus for conversion · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H01F17/06 Primary

  with core substantially closed in itself, e.g. toroid · CPC title

• H05K2201/10166

  Transistor · CPC title