Power converter module

Patent metadata

Field	Value
Publication number	US-11439016-B2
Application number	US-202117147504-A
Country	US
Kind code	B2
Filing date	Jan 13, 2021
Priority date	Oct 27, 2020
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

A power converter module includes a multilayer printed circuit board, a switching device, a magnetic core element and a winding via. The multilayer printed circuit board has a first surface, a second surface and an inside layer. The multilayer printed circuit board includes a plurality of copper layers. The magnetic core element is disposed in the inside layer and includes a hole. One end of the winding via is electrically connected to the switching device, and the other end of the winding via is electrically connected to the second surface. The winding via penetrates through the hole and forms a magnetic assembly. An amount of the copper layers on a first side of the magnetic core element close to the first surface of the multilayer printed circuit board is at least two more than a second side of the magnetic core element.

First claim

What is claimed is:

1. A power converter module, comprising:
a multilayer printed circuit board, wherein the multilayer printed circuit board has a first surface, a second surface and an inside layer, the first surface and the second surface are opposite, and the multilayer printed circuit board comprises a plurality of copper layers;
at least one switching device disposed on the first surface of the multilayer printed circuit board;
at least one magnetic core element disposed in the inside layer of the multilayer printed circuit board, wherein the magnetic core element has at least one hole; and
at least one winding via, wherein a first end of the winding via is electrically connected to the switching device, and a second end of the winding via is electrically connected to the second surface of the multilayer printed circuit board, and the winding via penetrates through the hole of the magnetic core element and forms a magnetic assembly with the magnetic core element;
wherein an amount of a part of the plurality of copper layers on a first side of the magnetic core element close to the first surface of the multilayer printed circuit board is at least two more than an amount of a part of the plurality of copper layers on a second side of the magnetic core element;
wherein the plurality of copper layers are configured for circuit wiring,
wherein the power converter module further comprises a capacitor device, wherein the capacitor device is disposed on the first surface of the multilayer printed circuit board and comprises at least on capacitor, and the at least one capacitor is an input capacitor or an output capacitor,
wherein the switching device and the capacitor device are electronically connected though the part of the plurality of copper layers on the first side.

2. The power converter module according to claim 1 , wherein the amount of the part of the plurality of copper layers on the first side of the magnetic core element close to the first surface of the multilayer printed circuit board is at least three more than the amount of the part of the plurality of copper layers on the second side of the magnetic core element.

3. The power converter module according to claim 1 , further comprising at least one pad, wherein the pad is disposed on the second surface of the multilayer printed circuit board, and the second end of the winding via is electrically connected to the pad.

4. The power converter module according to claim 3 , wherein the pad is a copper block pin or a surface copper skin of the multilayer printed circuit board, and the pad is fixed on the second surface.

5. The power converter module according to claim 1 , wherein the winding via is electrically connected to all or a part of the plurality of copper layers.

6. The power converter module according to claim 1 , wherein the winding via is a straight hole or a stepped hole.

7. The power converter module according to claim 1 , wherein the magnetic assembly forms an inductor.

8. The power converter module according to claim 1 , wherein the switching device comprises at least one upper switch and at least one lower switch electrically connected to each other, wherein a node is formed between the upper switch and the lower switch, and the node is electrically connected to the first end of the winding via.

9. The power converter module according to claim 1 , wherein the plurality of copper layers comprises a plurality of positive copper layers and a plurality of negative copper layers, the plurality of positive copper layers and the plurality of negative copper layers are disposed in staggered arrangement, and a direction of a current flowing through each of the plurality of positive copper layers is opposite to a direction of a current flowing through the adjacent negative copper layer.

10. The power converter module according to claim 9 , further comprising at least one first via, at least one second via, at least one third via and at least one fourth via, wherein the first via is electrically connected to a switching positive terminal of the switching device, the second via is electrically connected to a switching negative terminal of the switching device, the third via is electrically connected to a capacitor positive terminal of the capacitor device, and the fourth via is electrically connected to a capacitor negative terminal of the capacitor device, wherein the plurality of positive copper layers are electrically connected to the first via and the third via, and the plurality of the negative copper layers are electrically connected to the second via and the fourth via.

Assignees

• Delta Electronics Inc

Inventors

• Xiong Yahong
• Cheng Cheng
• Cui Junguo
• Lu Shengli

Classifications

• H05K2201/1003

  Non-printed inductor · CPC title

• H02M3/158

  including plural semiconductor devices as final control devices for a single load · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H01F2017/067

  Core with two or more holes to lead through conductor · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title