Printed circuit board and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11439009-B2
Application number	US-202017118757-A
Country	US
Kind code	B2
Filing date	Dec 11, 2020
Priority date	Dec 11, 2019
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

Various embodiments relate to an apparatus. The apparatus may include: a first printed circuit board including a first ground layer having one or more openings formed therein and a wiring layer on which a signal wire is disposed; a second printed circuit board including a second ground layer having one or more openings formed therein; a first area and a third area in which the first printed circuit board and the second printed circuit board are connected to each other via an insulating layer; and a second area, which extends from the first area to the third area, and in which the first printed circuit board and the second printed circuit board are spaced apart from each other, with an air layer interposed therebetween. Various other embodiments may be possible.

First claim

What is claimed is:

1. An apparatus comprising:
a first printed circuit board comprising a first ground layer having a first one or more openings formed therein and a wiring layer on which a signal wire is disposed;
a second printed circuit board comprising a second ground layer having a second one or more openings formed therein;
insulating layers interposed between the first printed circuit board and the second printed circuit board, in a first area and a third area corresponding to side portions of the apparatus; and
at least one via electrically connecting the first printed circuit board and the second printed circuit board in the first area and the third area,
wherein the first printed circuit board and the second printed circuit board are spaced apart from each other to form an air layer, in a second area extending from the first area to the third area,
wherein the first ground layer extends from the first area, through the second area, to the third area along the first printed circuit board,
wherein the second ground layer extends from the first area, through the second area, to the third area along the second printed circuit board,
wherein the air layer separates the first printed circuit board and the second printed circuit board throughout the entire second area,
wherein the second one or more openings are formed in the second printed circuit board in the first area, the second area, and the third area of the apparatus,
wherein the at least one via is included in the first area and the third area among the first area, the second area, and the third area, and
wherein a portion of the apparatus corresponding to the second area is flexible.

2. The apparatus of claim 1 , wherein the first ground layer is formed as a ground of a first mesh pattern including the first one or more openings.

3. The apparatus of claim 2 , wherein, in the first mesh pattern, the first one or more openings, which have a same shape, are arranged at a predetermined interval along the signal wire.

4. The apparatus of claim 1 , wherein the second ground layer is formed as a ground of a second mesh pattern including the second one or more openings.

5. The apparatus of claim 4 , wherein, in the second mesh pattern, the second one or more openings, which have a same shape, are arranged at a predetermined interval along the signal wire.

6. The apparatus of claim 1 , wherein, in the first area or the third area of the printed circuit board, the at least one via penetrates the first printed circuit board, the second printed circuit board, and at least one of the insulating layers in the first area and the third area.

7. The apparatus of claim 6 , wherein the wiring layer further comprises a metal member, which comes into electrical contact with the one or more vias.

8. The apparatus of claim 1 , wherein the second area of the printed circuit board includes no via.

9. The apparatus of claim 1 , wherein the second area of the printed circuit board is more flexible than the first area or the third area of the printed circuit board.

10. An apparatus comprising:
a first printed circuit board comprising a wiring layer having a signal wire disposed thereon and disposed on a top surface of a first insulating layer, and a first ground layer disposed on a bottom surface of the first insulating layer;
a second printed circuit board comprising a second ground layer having one or more openings formed therein;
second insulating layers interposed between the first printed circuit board and the second printed circuit board, in a first area and a third area corresponding to side portions of the apparatus; and
one or more vias electrically connecting the first printed circuit board and the second printed circuit board in the first area and the third area,
wherein the first printed circuit board and the second printed circuit board are spaced apart from each other to form an air layer, in a second area extending from the first area to the third area,
wherein the first ground layer extends from the first area, through the second area, to the third area along the first printed circuit board,
wherein the second ground layer extends from the first area, through the second area, to the third area along the second printed circuit board,
wherein the air layer separates the first printed circuit board and the second printed circuit board throughout the entire second area,
wherein the one or more openings are formed in the second printed circuit board in the first area, the second area, and the third area of the apparatus,
wherein the one or more vias are included in the first area and the third area among the first area, the second area, and the third area, and
wherein a portion of the apparatus corresponding to the second area is flexible.

11. An electronic device comprising:
a communication circuit; and
a printed circuit board electrically connected to the communication circuit;
wherein the printed circuit board comprises:
a first printed circuit board comprising a first ground layer having a first one or more openings formed therein and a wiring layer on which a signal wire is disposed;
a second printed circuit board comprising a second ground layer having a second one or more openings formed therein;
insulating layers interposed between the first printed circuit board and the second printed circuit board, in a first area and a third area corresponding to side portions of the electronic device; and
one or more vias electrically connecting the first printed circuit board and the second printed circuit board in the first area and the third area;

wherein the first printed circuit board and the second printed circuit board are spaced apart from each other to form an air layer, in a second area extending from the first area to the third area,
wherein the first ground layer extends from the first area, through the second area, to the third area along the first printed circuit board,
wherein the second ground layer extends from the first area, through the second area, to the third area along the second printed circuit board,
wherein the air layer separates the first printed circuit board and the second printed circuit board throughout the entire second area,
wherein the second one or more openings are formed in the second printed circuit board in the first area, the second area, and the third area of the apparatus,
wherein the one or more vias are included in the first area and the third area among the first area, the second area, and the third area, and
wherein a portion of the apparatus corresponding to the second area is flexible.

12. The electronic device of claim 11 , wherein the second ground layer is formed as a ground of a mesh pattern including the second one or more openings.

13. The electronic device of claim 12 , wherein, in the mesh pattern, the second one or more openings, which have a same shape, are arranged at a predetermined interval along the signal wire.

14. The electronic device of claim 11 , wherein, in the first area or the third area of the printed circuit board, the at least one via penetrates the first printed circuit board, the second printed circuit board, and at least one of the insulating layers.

15. The electronic device of claim 11 , wherein the second area of the printed circuit board is more flexible than the first area or the third area of the printed circuit board.

16. The electronic device of claim 11 , further comprising:
a foldable housing comprising a first housing, a second housing, and a connector configured to connect the first housing and the second housing to each o

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Sungwon

Classifications

• H05K1/0218

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/147 Primary

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K1/0251 Primary

  related to vias or transitions between vias and transmission lines · CPC title

• H05K1/025

  Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20) · CPC title