Plated copper conductor structures for wireless charging system and manufacture thereof

Patent metadata

Field	Value
Publication number	US-11437851-B2
Application number	US-202017084556-A
Country	US
Kind code	B2
Filing date	Oct 29, 2020
Priority date	Feb 11, 2020
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.

First claim

What is claimed is:

1. A system for wirelessly transferring electrical energy from a source to a load, the system comprising a transmitter circuit configured to be energized by the source and electrically connected to a transmitter coil and a receiver circuit configured to drive the load and electrically connected to a receiver coil, the transmitter and receiver coils being configured to be inductively coupled, and wherein at least one of the transmitter coil and the receiver coil comprises a conductive structure situated on a first major surface of a substrate and having the form of a spiral conductor comprising a plurality of turns, the conductive structure comprising:
(a) a first layer of conductive ink adhered to the first major surface; and
(b) a second layer of electroplated copper situated onto the conductive ink of the first layer.

2. The system of claim 1 , wherein each of the transmitter coil and the receiver coil comprises a conductive structure situated on a first major surface of a substrate and having the form of a spiral conductor comprising a plurality of turns, each of the conductive structures comprising:
(a) a first layer of conductive ink adhered to the first major surface; and
(b) a second layer of electroplated copper situated onto the conductive ink of the first layer.

3. A transmitter comprising a transmitter module and a transmitter coil electrically connected thereto, the transmitter coil comprising a conductive structure, wherein the conductive structure is situated on an insulating surface having a first and second opposing major surfaces and the conductive structure has a preselected pattern and the conductive structure comprises:
(a) a first layer of conductive ink having the preselected pattern and adhered to the first major surface; and;
(b) a second layer of electroplated copper situated onto the conductive ink of the first layer;
and wherein the transmitter module is configured to be connected to a source and to energize the transmitter coil to produce an electromagnetic field, whereby electrical energy is wirelessly delivered from the source to a receiver comprising a receiver coil and receiver circuitry connected thereto, the receiver coil being inductively coupled to the transmitter coil and the receiver circuitry being configured to deliver the electrical energy to a load connected thereto.

4. The transmitter of claim 3 , wherein the conductive structure is situated on a first major surface of a substrate and has the form of a spiral conductor comprising a plurality of turns.

Assignees

• Dupont Electronics Inc

Inventors

• Blackman Gregory Scott
• Wu Wei

Classifications

• H01F27/2804 Primary

  Printed windings · CPC title

• H02J50/005

  Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices · CPC title

• H01F38/14 Primary

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• H02J50/10 Primary

  using inductive coupling · CPC title

• H01F5/003

  Printed circuit coils · CPC title