Light-emitting device and manufacturing method thereof

US11437427B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11437427-B2
Application numberUS-202016750227-A
CountryUS
Kind codeB2
Filing dateJan 23, 2020
Priority dateJan 24, 2019
Publication dateSep 6, 2022
Grant dateSep 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light-emitting device, includes a substrate, including an upper surface; a first light emitting unit and a second light emitting unit, formed on the upper surface, wherein each of the first light emitting unit and the second light emitting unit includes a lower semiconductor portion and an upper semiconductor portion; and a conductive structure electrically connecting the first light emitting unit and the second light emitting unit; wherein the lower semiconductor portion of the first light emitting unit includes a first sidewall and a first upper surface; and wherein the first side wall includes a first sub-side wall and a second sub-side wall, an obtuse angle is formed between the first sub-side wall and the first upper surface and another obtuse angle is formed between the second sub-side wall and the upper surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A light-emitting device, comprising: a substrate, comprising an upper surface; a first light-emitting unit and a second light-emitting unit, formed on the upper surface, wherein each of the first light-emitting unit and the second light-emitting unit comprises a lower semiconductor portion and an upper semiconductor portion; and a conductive structure electrically connecting the first light-emitting unit and the second light-emitting unit; wherein the lower semiconductor portion of the first light-emitting unit comprises a first side wall and a first upper surface; and wherein the first side wall comprises a first sub-side wall and a second sub-side wall, an obtuse angle is formed between the first sub-side wall and the first upper surface and another obtuse angle is formed between the second sub-side wall and the upper surface. 2. The light-emitting device according to claim 1 , wherein the first sub-side wall and the second sub-side wall are connected. 3. The light-emitting device according to claim 1 , wherein the lower semiconductor portion of the first light-emitting unit further comprises a second side wall facing the second light-emitting unit, and the conductive structure is formed on the second side wall and the second light-emitting unit; and wherein an acute angle is formed between the second side wall and the upper surface. 4. The light-emitting device according to claim 3 , wherein: the first light-emitting unit and the second light-emitting unit are adjacent; the first side wall faces the second light-emitting unit; each of the first side wall and the second side wall comprises a lower edge; and the lower edge of the second side wall is closer to the second light-emitting unit than the lower edge of the first side wall. 5. The light-emitting device according to claim 3 , wherein: the first light-emitting unit and the second light-emitting unit are adjacent; the first side wall faces the second light-emitting unit; each of the first side wall and the second side wall comprises an upper edge; and the upper edge of the second side wall is closer to the second light-emitting unit than the upper edge of the first side wall. 6. The light-emitting device according to claim 3 , wherein: the first light-emitting unit and the second light-emitting unit are adjacent; the first side wall faces the second light-emitting unit; each of the first side wall and the second side wall comprises an upper edge; and the upper edge of the first side wall and the upper edge of the second side wall are aligned. 7. The light-emitting device according to claim 3 , wherein the lower semiconductor portion of the first light-emitting unit further comprises a clamped surface between the first side wall and the second side wall, and the clamped surface substantially has a triangular shape with an edge connecting the upper surface. 8. The light-emitting device according to claim 3 , further comprising an insulator under the conductive structure. 9. The light-emitting device according to claim 8 , wherein the substrate comprises a plurality of patterned structures on the upper surface; and the patterned structures under the insulator and the patterned structures not under the insulator have different sizes and/or different shapes. 10. The light-emitting device according to claim 8 , wherein the insulator comprises middle portion on the second side wall and an extending portion on the upper semiconductor portion of the first light-emitting unit, and a width of the middle portion is greater than that of the extending portion. 11. The light-emitting device according to claim 3 , wherein in a top view, a length of the second side wall extending on an edge of the first light-emitting unit is equal to a length of the edge. 12. The light-emitting device according to claim 3 , wherein the conductive structure comprises a connection electrode on the second side wall and an extending electrode on the upper semiconductor portion of the first light-emitting unit. 13. The light-emitting device according to claim 1 , wherein the second sub-side wall is between the first sub-side wall and the substrate, and the second sub-side wall comprises a rugged surface with concaves and convexes. 14. The light-emitting device according to claim 13 , wherein the first sub-side wall is even. 15. A light-emitting device, comprising: a substrate, comprising an upper surface; a first light-emitting unit and a second light-emitting unit, formed on the upper surface, wherein each of the first light-emitting unit and the second light-emitting unit comprises a lower semiconductor portion and an upper semiconductor portion; and a conductive structure, electrically connecting the first light-emitting unit and the second light-emitting unit; wherein the lower semiconductor portion of the first light-emitting unit comprises a first side wall, adjacent to a periphery of the light-emitting device; wherein an included angle between the first side wall and the upper surface is an obtuse angle; and wherein in a side view, the first side wall has a parallelogram-like shape or a parallelogram shape with a pair of diagonal angles having a first acute angle and a second acute angle. 16. The light-emitting device of claim 15 , wherein the lower semiconductor portion of the first light-emitting unit further comprises a second side wall facing the second light-emitting unit; and an included angle between the second side wall and the upper surface is an acute angle. 17. The light-emitting device of claim 16 , wherein the conductive structure is formed on the second side wall. 18. The light-emitting device of claim 15 , wherein a difference between the first acute angle and the second acute angle is smaller than 40 degrees. 19. The light-emitting device of claim 15 , wherein the lower semiconductor portion of the second light-emitting unit comprises a third side wall adjacent to the periphery of the light-emitting device; wherein an obtuse angle is between the third side wall and the upper surface; and in a side view, the third side wall is a trapezoid. 20. The light-emitting device of claim 15 , wherein the first side wall comprises a first sub-side wall and a second sub-side wall connected to the first sub-side wall.

Assignees

Inventors

Classifications

  • Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title

  • Electricity · mapped topic

  • H01L27/153Primary

    Electricity · mapped topic

  • Electricity · mapped topic

  • Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

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What does patent US11437427B2 cover?
A light-emitting device, includes a substrate, including an upper surface; a first light emitting unit and a second light emitting unit, formed on the upper surface, wherein each of the first light emitting unit and the second light emitting unit includes a lower semiconductor portion and an upper semiconductor portion; and a conductive structure electrically connecting the first light emitting…
Who is the assignee on this patent?
Epistar Corp
What technology area does this patent fall under?
Primary CPC classification H01L27/153. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).