Method for manufacturing fingerprint recognition module, fingerprint recognition module, and display device

Patent metadata

Field	Value
Publication number	US-11436856-B2
Application number	US-202016826196-A
Country	US
Kind code	B2
Filing date	Mar 21, 2020
Priority date	Sep 24, 2019
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.

First claim

What is claimed is:

1. A method for manufacturing a fingerprint recognition module, comprising:
providing a backplane;
forming a bonding terminal in a bonding area of the backplane;
forming a sensing electrode in a fingerprint recognition area of the backplane;
forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, wherein an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane;
performing polarization processing on the piezoelectric material layer; and
peeling off the insulation layer.

2. The method of claim 1 , wherein the forming the insulation layer cladding the binding terminal in the bonding area comprises:
forming an organic insulation layer cladding the bonding terminal in a coating manner, wherein a gap exists between the organic insulation layer and the sensing electrode.

3. The method of claim 2 , wherein a material of the organic insulation layer is polyimide.

4. The method of claim 3 , wherein the peeling off the insulation layer comprises:
peeling off the polyimide by using laser cutting.

5. The method of claim 1 , wherein the forming the insulation layer cladding the bonding terminal in the bonding area comprises:
forming an organic insulation layer cladding the bonding terminal in a coating manner, wherein the organic insulation layer is in contact with the sensing electrode.

6. The method of claim 5 , wherein a material of the organic insulation layer is photoresist.

7. The method of claim 6 , wherein the peeling off the insulation layer comprises:
peeling off the photoresist by using a stripper.

8. The method of claim 1 , wherein the piezoelectric material layer is formed in the fingerprint recognition area before the insulation layer cladding the bonding terminal is formed in the bonding area; or the piezoelectric material layer is formed in the fingerprint recognition area after the insulation layer cladding the bonding terminal is formed in the bonding area.

9. The method of claim 1 , wherein a thickness of the insulation layer on the bonding terminal is greater than 4 μm.

10. The method of claim 1 , wherein a polarization terminal is formed in a polarization area of the backplane, and while the polarization processing is performed on the piezoelectric material layer, the method further comprises: grounding the polarization terminal.

11. The method of claim 1 , wherein after the insulation layer is peeled off, the method further comprises:
forming a driving electrode on the piezoelectric material layer.

12. A fingerprint recognition module, wherein the fingerprint recognition module is manufactured by using the method of claim 1 .

13. A display device, comprising the fingerprint recognition module of claim 12 .

Assignees

• Boe Technology Group Co Ltd
• Beijing Boe Technology Dev Co Ltd

Inventors

• Liu Wenqu
• Yao Qi
• Zhang Feng
• Lv Zhijun
• Dong Liwen
• Song Xiaoxin
• Cui Zhao
• Meng Detian
• Wang Libo
• Chen Mingqi
• Wang Changzheng

Classifications

• H10N30/857

  Macromolecular compositions · CPC title

• B06B1/0688 Primary

  with foil-type piezoelectric elements, e.g. PVDF · CPC title

• G06V40/1306 Primary

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• Y10T29/42

  Piezoelectric device making · CPC title

• H01L41/193

  Electricity · mapped topic