Malonate and cyanoacrylate adhesives for joining dissimilar materials

US11434392B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11434392-B2
Application numberUS-201716332818-A
CountryUS
Kind codeB2
Filing dateSep 19, 2017
Priority dateSep 19, 2016
Publication dateSep 6, 2022
Grant dateSep 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for bonding a laminate structure comprising: providing a first and second substrate; locating an initiator onto a first surface of the first substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive; locating the polymerizable adhesive onto a first surface of the second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or a cyanoacrylate; contacting the first surface of the first substrate with the first surface of the second substrate so that the initiator causes polymerization of the adhesive. 2. The method of claim 1 , wherein the first substrate is a film layer. 3. The method of claim 2 , wherein the film layer is a polyvinyl fluoride film. 4. The method of claim 1 , wherein the adhesive is heat activated upon contact with the second substrate. 5. The method of claim 1 , including polymerizing the adhesive in less than 5 minutes, less than 3 minutes or even less than 1 minute after contacting the adhesive with the initiator. 6. The method of claim 1 , wherein the second substrate is selected from a veneer, particle board, honeycomb panel, white board, polymeric material, film, or combinations thereof. 7. The method of claim 1 , wherein the initiator is sodium benzoate. 8. The method of claim 1 , wherein the second substrate includes a phenoxy component. 9. The method of claim 1 , wherein the laminate structure can be heated after polymerization of the adhesive to remove the first substrate from the second substrate such that the adhesive remains in contact with only the first substrate and minimal adhesive residue remains on the second substrate. 10. The method of claim 1 , including removing the second substrate from the first substrate with substantially no adhesive residue remaining on the first substrate. 11. The method of claim 1 , including removing the second substrate from the first substrate by applying a stimulus to the adhesive. 12. The method of claim 1 , including removing the second substrate from the first substrate by applying heat, UV light, or a chemical substance to the adhesive. 13. The method of claim 6 , wherein one or more of the first or second surface is a panel of a transportation vehicle such as a bus, a train, a boat, or a plane. 14. The method of claim 1 , wherein one or more of the first or second surface receives advertising or decorative material. 15. The method of claim 1 , wherein the adhesive is a thermoplastic material. 16. The method of claim 15 , wherein upon separation of the first substrate from the second substrate, the adhesive remains in contact with only the second substrate and the first substrate is substantially free of any remaining adhesive. 17. The method of claim 1 , including a step of adding texture to one or more of the first and second substrate prior to contacting the first substrate to the second substrate. 18. A method for bonding a laminate structure comprising: providing a first and second substrate; locating a polymerizable adhesive onto a first surface of the second substrate, the adhesive including a monofunctional, difunctional or multifunctional methylene malonate or a cyanoacrylate; contacting the first surface of the first substrate with a first surface of the second substrate, wherein the material composition of the first substrate is reactive with and causes polymerization of the adhesive. 19. The method of claim 18 , wherein the polymerization of the adhesive allows for open time of at least about 5 minutes, at least about 15 minutes, at least about 30 minutes, or even at least about 60 minutes. 20. The method of claim 18 , wherein the second substrate is a film layer.

Assignees

Inventors

Classifications

  • characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure · CPC title

  • Homopolymers or copolymers of vinyl fluoride · CPC title

  • comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title

  • C09J5/04Primary

    involving separate application of adhesive ingredients to the different surfaces to be joined · CPC title

  • next to a fibrous or filamentary layer · CPC title

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Frequently asked questions

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What does patent US11434392B2 cover?
The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunction…
Who is the assignee on this patent?
Zephyros Inc
What technology area does this patent fall under?
Primary CPC classification C09J5/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).