Polyamide-imide film and method for producing same

Patent metadata

Field	Value
Publication number	US-11434335-B2
Application number	US-201816477664-A
Country	US
Kind code	B2
Filing date	Feb 6, 2018
Priority date	Feb 8, 2017
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.

First claim

The invention claimed is:

1. A polyamide-imide film, which comprises a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound, wherein the peak area in the vicinity of 2θ=23° is 65% or more based on the peak area in the vicinity of 2θ=15° when a base line is taken in the region between 2θ=8° and 32° in an XRD graph of the polyamide-imide film.

2. The polyamide-imide film of claim 1 , which has a modulus of 5.0 GPa or more based on a thickness of 50 μm.

3. The polyamide-imide film of claim 1 , which has a surface hardness of HB or higher.

4. The polyamide-imide film of claim 1 , which has a yellow index (YI) of 5 or less based on a thickness of 50 μm.

5. The polyamide-imide film of claim 1 , which has a haze of 2% or less based on a thickness of 50 μm.

6. The polyamide-imide film of claim 1 , which has a light transmittance measured at 550 nm of 85% or more based on a thickness of 50 μm.

7. The polyamide-imide film of claim 1 , wherein the aromatic dianhydride compound is composed of a compound having a fluorine-containing substituent.

8. The polyamide-imide film of claim 1 , wherein the aromatic diamine compound comprises 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFDB), and the aromatic dianhydride compound comprises 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6-FDA).

9. The polyamide-imide film of claim 1 , wherein the molar ratio of the aromatic diamine compound to the aromatic dianhydride compound is 10:2 to 10:4.

10. The polyamide-imide film of claim 1 , wherein the dicarbonyl compound comprises at least two dicarbonyl compounds different from each other.

11. The polyamide-imide film of claim 1 , wherein the dicarbonyl compound comprises terephthaloyl chloride (TPC), 1,1′-biphenyl-4,4′-dicarbonyl dichloride (BPDC), or a combination thereof.

Assignees

• Skc Co Ltd

Inventors

• Oh Dae Seong
• Jeong Dawoo
• Kim Sunhwan
• Lee Jin Woo
• Lim Dong Jin
• Oh Kyungeun

Classifications

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08J5/18 Primary

  Manufacture of films or sheets · CPC title

• C08G73/14 Primary

  Polyamide-imides · CPC title

• B29K2105/0094

  having particular viscosity · CPC title

• C08L2201/10

  Transparent films; Clear coatings; Transparent materials · CPC title