Deposition mask, mask member for deposition mask, method of manufacturing deposition mask, and method of manufacturing organic EL display apparatus

US11433484B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11433484-B2
Application numberUS-201616083524-A
CountryUS
Kind codeB2
Filing dateJul 22, 2016
Priority dateMar 10, 2016
Publication dateSep 6, 2022
Grant dateSep 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A deposition mask in which a resin film can be completely removed in opening portions, a method of manufacturing the deposition mask, and a mask member for the deposition mask are provided. A light irradiation source for laser light is disposed on one side of a resin film (11) and emits the laser light for forming a pattern of opening portions. A reflective film (30) is provided on another side of the resin film (11) and reflects light having a wavelength of the laser light emitted from the light irradiation source for the laser light. The laser light reflected by the reflective film (30) is used to form the patterns of the opening portion (11a) in the resin film (11).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a deposition mask, the deposition mask having a resin film in which a pattern of opening portions is formed, the method comprising: disposing a light irradiation source on one side of the resin film, the light irradiation source being adapted to emit laser light for forming the pattern of the opening portions; providing a reflective film on another side of the resin film, the reflective film being adapted to reflect the light having a wavelength of the laser light emitted from the light irradiation source for the laser light; using the laser light reflected by the reflective film to form the pattern of the opening portions in the resin film; and providing a close contact layer on a side of the resin film facing the reflective film, the close contact layer being in contact with the resin film; wherein the reflective film is in contact with the close contact layer. 2. The method of manufacturing a deposition mask according to claim 1 , wherein the close contact layer is formed of a material having a transmittance of 80% or more at the wavelength of the laser light. 3. The method of manufacturing a deposition mask according to claim 1 , further comprising; forming the reflective film on a process stage; forming the close contact layer on the reflective film; and bringing the resin film into contact with the close contact layer; and irradiating the resin film with the laser light from an opposite side of the resin film to the process stage; wherein the formation of the pattern of the opening portions is formed in the resin film. 4. The method of manufacturing a deposition mask according to claim 1 , further comprising; forming the close contact layer on a surface of the resin film; forming the reflective film on a surface of the close contact layer, the surface of the close contact layer being located on an opposite side to the resin film; fixing the reflective film side on a process stage; and irradiating the resin film with the laser light from an exposed surface side of the resin film; wherein the formation of the pattern of the opening portions is formed in the resin film. 5. The method of manufacturing a deposition mask according to claim 3 , further comprising: forming a metal support layer on the resin film; wherein the metal support layer is formed on a surface of the rein film opposite to the close contact layer so that the metal support layer is located to avoid the opening portions, the metal support layer supports the resin film. 6. The method of manufacturing a deposition mask according to claim 1 , further comprising: applying liquid resin to a metal foil and hardening the liquid resin to form the resin film; forming opening portions in the metal foil; forming a close contact layer on a surface of the resin film located on an opposite side to the metal foil; wherein forming the reflective film on a surface of the close contact layer located on an opposite side to the resin film; and irradiating the resin film with the laser light from a side facing the metal foil; wherein the formation of the pattern of the opening portions is formed in the resin film. 7. A method of producing an organic EL display apparatus by depositing organic layers on a device substrate, the method comprising: overlying and positioning, on the device substrate, the deposition mask manufactured by the method according to claim 1 , the device substrate being formed by forming a thin-film transistor (TFT) and a first electrode on a support substrate; forming an organic deposition layer on the device substrate by depositing an organic material; and forming a second electrode on the organic deposition layer. 8. The method of manufacturing a deposition mask according to claim 1 , wherein the reflective film is formed of dielectric multilayer films or at least one metal film selected from a group of an aluminum film, and a silver film, or a lamination of the metal film and the dielectric multilayer films. 9. The method of manufacturing a deposition mask according to claim 4 , further comprising: forming a metal support layer on the resin film; wherein the metal support layer is formed on a surface opposite to a surface in contact with the close contact layer so that the metal support layer is located to avoid the opening portions, the metal support layer supporting the resin film.

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What does patent US11433484B2 cover?
A deposition mask in which a resin film can be completely removed in opening portions, a method of manufacturing the deposition mask, and a mask member for the deposition mask are provided. A light irradiation source for laser light is disposed on one side of a resin film (11) and emits the laser light for forming a pattern of opening portions. A reflective film (30) is provided on another side…
Who is the assignee on this patent?
Hon Hai Prec Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C14/042. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).