High frequency, surface mountable microstrip band pass filter

US11431069B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11431069-B2
Application numberUS-202016794320-A
CountryUS
Kind codeB2
Filing dateFeb 19, 2020
Priority dateFeb 28, 2019
Publication dateAug 30, 2022
Grant dateAug 30, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.

First claim

Opening claim text (preview).

What is claimed is: 1. A high frequency, stripline filter having a bottom surface for mounting to a mounting surface, the filter comprising: a monolithic base substrate having a top surface, a length in an X-direction, a width in a Y-direction that is perpendicular to the X-direction, and a thickness in a Z-direction that is perpendicular to each of the X-direction and Y-direction; a plurality of thin-film microstrips comprising a first thin-film microstrip and a second thin-film microstrip, each of the plurality of thin-film microstrips having a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms, the base portion being perpendicular each of first and second arms; and wherein the plurality of thin-film microstrips are formed over the top surface of the monolithic base substrate; a port exposed along the bottom surface of the filter; and a conductive path comprising a via formed in the monolithic base substrate, the conductive path electrically connecting the first thin-film microstrip with the port on the bottom surface of the filter, wherein the filter exhibits an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz, and wherein the filter exhibits a return loss that is less than about −20 dB at the frequency. 2. The filter of claim 1 , wherein the frequency is about 28 GHz. 3. The filter of claim 1 , wherein the filter exhibits an insertion loss response that is greater than −3.5 dB across a frequency range that ranges from about 27 GHz to about 29 GHz. 4. The filter of claim 1 , wherein the filter exhibits a return loss response that is less than about −10 dB from about 27 GHz to about 29 GHz. 5. The filter of claim 1 , wherein the conductive path has an effective length from the first arm of the thin-film microstrip to the port that ranges from about 95% to about 105% of λ/4, wherein λ is a wavelength that corresponds with a passband frequency propagating through the monolithic base substrate. 6. The filter of claim 1 , wherein the first arm of the first thin-film microstrip is elongated in the Y-direction, and wherein the conductive path comprises a top conductive strip that is elongated in the X-direction, the top conductive strip formed over the top surface of the monolithic base substrate and connected with each of the via and the first arm of the first thin-film microstrip. 7. The filter of claim 5 , wherein the conductive path comprises a bottom conductive strip connected with each of the via and the port. 8. The filter of claim 7 , wherein: the top conductive strip has a top conductive strip effective length in the X-direction between the arm of the first thin-film microstrip and the via; the bottom conductive strip has a bottom conductive strip effective length in the X-Y plane between the via and the port; the via has a via length in a Z-direction that is perpendicular to the X-Y plane; and the effective length of the conductive path is equal to a sum of the top conductive strip effective length, the bottom conductive strip effective length, and the via length. 9. The filter of claim 7 , wherein the bottom conductive strip is elongated in the Y-direction. 10. The filter of claim 9 , wherein the first thin-film microstrip has at least one rounded outer corner between the base portion of the first thin-film microstrip and at least one of the first arm or second arm of the first thin-film microstrip. 11. The filter of claim 9 , wherein at least one of the first arm or second arm of the first thin-film microstrip has a width that is less than about 200 microns. 12. The filter of claim 1 , wherein: the second arm of the first thin-film microstrip is elongated in the Y-direction; and the first arm of the second thin-film microstrip is elongated in the Y-direction and spaced apart by a first spacing distance from the first arm of the first thin-film microstrip in the X-direction by a first spacing distance that is less than about 150 microns. 13. The filter of claim 12 , wherein: the second arm of the second thin-film microstrip is elongated in the Y-direction; and the plurality of thin-film microstrips comprises a third thin-film microstrip, the first arm of the third thin-film microstrip being elongated in the Y-direction and spaced apart in the X-direction from the second arm of the second thin-film microstrip by a second spacing distance that is less than about 150 microns. 14. The filter of claim 13 , wherein a ratio of the second spacing distance is the first spacing distance ranges from about 1.1 to about 10. 15. The filter of claim 13 , wherein: the first arm of the second thin-film microstrip and the second arm of the first thin-film microstrip overlap in the Y-direction along a first overlapping length; the second arm of the second thin-film microstrip and the first arm of the third thin-film microstrip overlap in the Y-direction along a second overlapping length; and the second overlapping length ranges from about 75% to about 96% of the first overlapping length or ranges from about 104% to about 125% of the first overlapping length. 16. The filter of claim 1 , wherein the monolithic base substrate has a bottom surface opposite the top surface, and wherein the filter further comprises a ground plane formed over the bottom surface of the base substrate. 17. The filter of claim 16 , wherein: the ground plane has a perimeter in an X-Y plane that is parallel with the top surface of the monolithic base substrate; and at least one of the first thin-film microstrip or second thin-film microstrip is contained within the perimeter of the ground plane of in the X-Y plane. 18. The filter of claim 1 , further comprising a cover substrate formed over the top surface of the monolithic base substrate. 19. The filter of claim 1 , wherein the monolithic base substrate has a thickness of less than about 500 microns. 20. The filter of claim 1 , wherein the monolithic base substrate comprises a material having a dielectric constant that is less than about 30 as determined in accordance with ASTM D2520-13 at an operating temperature of 25° C. and frequency of 28 GHz. 21. The filter of claim 1 , wherein the monolithic base substrate comprises alumina. 22. The filter of claim 1 , wherein a length of the filter in the X-direction is less than about 5 mm, and a width of the filter in the Y-direction is less than about 3 mm. 23. The filter of claim 1 , wherein the thin-film microstrips have thicknesses in the Z-direction that range from about 0.3 micrometers to about 10 micrometers. 24. A high frequency, stripline filter having a bottom surface for mounting to a mounting surface, the filter comprising: a monolithic base substrate having a top surface, a length in an X-direction, a width in a Y-direction that is perpendicular to the X-direction, and a thickness in a Z-direction that is perpendicular to each of the X-direction and Y-direction; a plurality of thin-film microstrips comprising a first thin-film microstrip and a second thin-film microstrip, each of the plurality of thin-film microstrips having a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms, the base portion being perpendicular to the first and second arms, and wherein the plurality of thin-film microstrips are formed over the top surface of the monolithic base substrate; a port exposed along the bot

Assignees

Inventors

Classifications

  • H01P1/203Primary

    Strip line filters · CPC title

  • Hairpin resonators · CPC title

  • Microstriplines · CPC title

  • Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

  • Manufacturing frequency-selective devices (resonators H01P11/008) · CPC title

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What does patent US11431069B2 cover?
A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first ar…
Who is the assignee on this patent?
Avx Corp, Kyocera Avx Components Corp
What technology area does this patent fall under?
Primary CPC classification H01P1/203. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 30 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).