Powder film forming method and powder film forming device

US11426760B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11426760-B2
Application numberUS-201816482409-A
CountryUS
Kind codeB2
Filing dateFeb 5, 2018
Priority dateFeb 3, 2017
Publication dateAug 30, 2022
Grant dateAug 30, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A powder film forming method includes the steps of: filling an opening with a powder, the opening being formed in a screen plate; and forming the powder film by generating an electric potential difference between the screen plate and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of forming a powder film, comprising the steps of: (a) filling an opening with a powder such that the powder is retained in the opening, the opening being formed in a powder filling member on a side facing a substrate, a shape of the opening corresponding to a shape of a powder film to be formed; and (b) forming the powder film by generating an electric potential difference between the powder filling member and the substrate so as to cause the powder retained in the opening to move to the substrate, wherein the powder filling member includes a porous body, and a covering part provided on one surface of the porous body; wherein the covering part has the opening; wherein, in the step (b), the covering part is provided on the side facing the substrate; and wherein filling the powder in the opening comprises providing the powder on the porous body from a side opposite to the opening causing the powder to pass through the porous body into the opening and retained in the opening. 2. The method according to claim 1 , wherein, in the step (a), the powder is rubbed by a rubbing body so as to fill the opening. 3. The method according to claim 1 , wherein, in the step (a), the powder is vibrated so as to fill the opening. 4. The method according to claim 1 , wherein, in the step (a), the powder to fill the opening is charged. 5. The method according to claim 4 , wherein, in the step (a), the powder, which is charged, is caused to fill the powder filling member by spraying with use of an electrostatic spray. 6. The method according to claim 1 , wherein, in the step (b), the powder is rubbed by a rubbing body so as to move to the substrate. 7. The method according to claim 1 , wherein, in the step (b), the powder is vibrated so as to move to the substrate. 8. The method according to claim 1 , further comprising covering the opening with a holding plate disposed on the side facing the substrate, the holding plate preventing the powder from falling out of the opening during filling of the opening. 9. A method of forming a powder film, comprising the steps of: (a) filling an opening with a powder by vibrating the powder such that the powder is retained in the opening, the opening being formed in a powder filling member on a side facing a substrate, a shape of the opening corresponding to a shape of the powder film to be formed; and (b) forming the powder film by causing the powder retained in the opening to move to the substrate, wherein the powder filling member includes a porous body, and a covering part provided on one surface of the porous body; wherein the covering part has the opening; wherein, in the step (b), the covering part is provided on the side facing the substrate; and wherein filling the powder in the opening comprises providing the powder on the porous body from a side opposite to the opening causing the powder to pass through the porous body into the opening and retained in the opening. 10. The method according to claim 9 , wherein, in the step (b), the powder is rubbed by a rubbing body so as to move to the substrate. 11. The method according to claim 9 , wherein, in the step (b), the powder is vibrated so as to move to the substrate. 12. A method of forming a powder film, comprising the steps of: (a) filling an opening with a powder, the opening being formed in a powder filling member on a side facing a substrate, a shape of the opening corresponding to a shape of a powder film to be formed, the opening being filled with the powder from a side opposite to a porous body of the powder filling member, the porous body facing the substrate; (b) inverting the powder filling member while the opening is being blocked with a holding plate so that the porous body faces away from the substrate; and (c) removing the holding plate from the opening and forming the powder film by generating an electric potential difference between the powder filling member and the substrate so as to cause the powder retained in the opening to move to the substrate.

Assignees

Inventors

Classifications

  • B05D1/06Primary

    Applying particulate materials · CPC title

  • by mechanical means · CPC title

  • flat · CPC title

  • B41M1/42Primary

    Printing without contact between forme and surface to be printed, e.g. by using electrostatic fields {(using a stencil or screen B41M1/125)} · CPC title

  • Screen printing machines · CPC title

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Frequently asked questions

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What does patent US11426760B2 cover?
A powder film forming method includes the steps of: filling an opening with a powder, the opening being formed in a screen plate; and forming the powder film by generating an electric potential difference between the screen plate and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.
Who is the assignee on this patent?
Hitachi Zosen Corp
What technology area does this patent fall under?
Primary CPC classification B05D1/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 30 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).