Flexible circuit card assembly with preformed undulations for surveillance system hinge assembly

Patent metadata

Field	Value
Publication number	US-11425814-B2
Application number	US-202117248666-A
Country	US
Kind code	B2
Filing date	Feb 2, 2021
Priority date	Apr 22, 2020
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

A hinge assembly configured for attachment to two objects is described herein. The hinge assembly includes: a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit board to bend at the region; and a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the two objects, wherein the flexible circuit board is configured to movably and electrically connect the two objects.

First claim

The invention claimed is:

1. A hinge assembly, configured for attachment to two objects, comprising:
a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit board to bend at the region, and wherein the at least one preformed undulation comprises:
a first concave region;
a second concave region; and
a first convex region between the first concave region and the second concave region, wherein the first concave region, the first convex region, and the second concave region form a wave profile in the region; and

a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to al attachment of the flexible circuit board to the two objects,
wherein the flexible circuit board is configured to movably and electrically connect the two objects.

2. The hinge assembly of claim 1 , wherein the at least one preformed undulation in the region forms a stress relief region in the flexible circuit board configured to reduce stress induced when bending the flexible circuit hoard.

3. The hinge assembly of claim 1 , wherein the at least one preformed undulation is located between at least one of the plurality of plated-through holes located near a first end of the hinge assembly and at least one of the plurality of plated-through holes located near a second end of the hinge assembly.

4. The hinge assembly of claim 1 , wherein the at least one preformed undulation is configured and arranged to allow flexibility at the region of the flexible circuit board including undulations rather than inducing high stresses at areas including the plurality of plated-through holes.

5. The hinge assembly of claim 1 , wherein the flexible circuit board includes a flexible base material and a conductive coating.

6. The hinge assembly of claim 1 , wherein the flexible circuit board includes at least two undulations.

7. A surveillance system for monitoring activity within an aircraft interior, said system comprising:
a viewing assembly disposed within the aircraft interior and structured to monitor at least a predetermined portion thereof;
a display assembly disposed within the aircraft interior and electrically connected to the viewing assembly, the display assembly including:
a display unit; and
the hinge assembly of claim 1 : and
a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the display unit and to a fixed component;

an activation assembly variably spaced at least in part from the viewing assembly and remotely operative to initiate observation of the aircraft interior; and
a control assembly interconnecting the viewing assembly, the display assembly and the activation assembly,
wherein the flexible circuit board is configured to movably and electrically connect the display unit to the control assembly.

8. The system of claim 7 , wherein the at least one preformed undulation in the region forms a stress relief region in the flexible circuit board configured to reduce stress induced when bending the flexible circuit board.

9. The system of claim 7 , Wherein the at least one preformed undulation is located between at least one of the plurality of plated-through holes located near a first end of the hinge assembly and at least one of the plurality of plated-through holes located near a second end of the hinge assembly.

10. The system of claim 7 , wherein the at least one preformed undulation is configured and arranged to allow flexibility at the region of the flexible circuit board including undulations rather than inducing high stresses at areas including the plurality of plated-through holes.

11. The system of claim 7 , wherein the flexible circuit board includes a flexible base material and a conductive coating.

12. The system of claim 7 , wherein the flexible circuit board includes at least two undulations.

13. A display assembly comprising:
a display unit; and
a hinge assembly including:
a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit hoard to bend at the region, and wherein the at least one preformed undulation comprises:
a first curved concave region;
a second curved concave region; and
a first curved convex region between the first curved concave region and the second curved concave region, wherein the first curved concave region, the first curved convex region, and the second curved concave region form a wave profile in the region; and
a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the display unit and to a fixed component,
wherein the flexible circuit board is configured to movably and electrically connect the display unit and the hinge assembly.

14. The display assembly of claim 13 , wherein the at least one preformed undulation in the region forms a stress relief region in the flexible circuit board configured to reduce stress induced when bending the flexible circuit board.

15. The display assembly of claim 13 , further comprising:
a rotatable component between the display unit and the hinge assembly and configured to allow the display unit to pivot with respect to the flexible circuit board and the fixed component.

16. The display assembly of claim 13 , wherein the flexible circuit board is configured to electrically connect the display unit, the hinge assembly and a remote computer processing unit.

17. The display assembly of claim 13 , wherein the at least one preformed undulation is located between at least one of the plurality of plated-through holes located near a first end of the hinge assembly and at least one of the plurality of plated-through holes located near a second end of the hinge assembly.

18. The display assembly of claim 13 , wherein the at least one preformed undulation is configured and arranged to allow flexibility at the region of the flexible circuit board including undulations rather than inducing high stresses at areas including the plurality of plated-through holes.

19. The display assembly of claim 13 , wherein the flexible circuit board includes a flexible base material and a conductive coating.

20. The display assembly of claim 13 , wherein the flexible circuit board includes at least two undulations.

Assignees

• Rosemount Aerospace Inc

Inventors

• Madhava Kirantu
• Srinivas Nouduri Phani
• Rao Ramesh Achutha

Classifications

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

• H05K2201/10128

  Display · CPC title

• H05K2201/09545

  Plated through-holes or blind vias without lands · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/057

  Shape retainable · CPC title