Wireless communication technology, apparatuses, and methods

Patent metadata

Field	Value
Publication number	US-11424539-B2
Application number	US-201716472830-A
Country	US
Kind code	B2
Filing date	Dec 20, 2017
Priority date	Dec 21, 2016
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

First claim

The invention claimed is:

1. An apparatus for a mobile device, the apparatus comprising:
a printed circuit board (PCB) that comprises a first layer and a second layer;
an integrated circuit (IC) chip that comprises a top level and a bottom level, wherein the IC chip comprises a transceiver and the IC chip is connected to the first layer of the PCB;
an antenna array that comprises a plurality of antenna elements configured within the first layer of the PCB and fed by feed transmission lines coupled to the transceiver; and
an IC shield, separated from the antenna array, that covers the IC to shield the antenna array from interference generated by the IC, and is connected to the PCB, wherein the IC shield is configured to act as a reflector and a ground reference for the antenna array.

2. The apparatus of claim 1 , further comprising a clearance volume between the PCB and the antenna array to prevent at least one antenna element from contacting the PCB.

3. The apparatus of claim 1 , wherein the transmission feed lines comprise metal traces.

4. The apparatus of claim 1 , wherein the PCB comprises a mother board.

5. The apparatus of claim 1 , wherein the IC chip further comprises at least one power amplifier (PA).

6. The apparatus of claim 5 , wherein the IC chip further comprises at least one low noise amplifier (LNA).

Assignees

• Intel Corp

Inventors

• Alpman Erkan
• Amadjikpe Arnaud Lucres
• Asaf Omer
• Azadet Kameran
• Banin Rotem
• Baryakh Miroslav
• Bazov Anat
• Brenna Stefano
• Casper Bryan K
• Chakrabarti Anandaroop
• Chance Gregory
• Choudhury Debabani
• Cohen Emanuel
• Da Silva Claudio
• Dalmia Sidharth
• Daneshgar Asl Saeid
• Dasgupta Kaushik
• Datta Kunal
• Davis Brandon
• Degani Ofir
• Fahim Amr M
• Freiman Amit
• Genossar Michael
• Gerson Eran
• Goldberger Eyal
• Gordon Eshel
• Gordon Meir
• Hagn Josef
• Kang Shinwon
• Kao Te Yu
• Kogan Noam
• Komulainen Mikko S
• Kushnir Igal Yehuda
• Lahti Saku
• Lampinen Mikko M
• Landsberg Naftali
• Lee Wook Bong
• Levinger Run
• Molina Albert
• Montoya Moreno Resti
• Musah Tawfiq
• Narevsky Nathan G
• Nikopour Hosein
• Orhan Oner
• Palaskas Georgios
• Pellerano Stefano
• Pongratz Ron
• Ravi Ashoke
• Ravid Shmuel
• Sagazio Peter Andrew
• Sasoglu Eren
• Shakedd Lior
• Shor Gadi
• Singh Baljit
• Soffer Menashe
• Sover Ra'Anan
• Talwar Shilpa
• Tanzi Nebil
• Teplitsky Moshe
• Thakkar Chintan S
• Thakur Jayprakash
• Tsarfati Avi
• Tsfati Yossi
• Verhelst Marian
• Weisman Nir
• Yamada Shuhei
• Yepes Ana M
• Kitchin Duncan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title