Coaxial cable utilizing plated carbon nanotube elements and method of manufacturing same

Patent metadata

Field	Value
Publication number	US-11424048-B2
Application number	US-201916449015-A
Country	US
Kind code	B2
Filing date	Jun 21, 2019
Priority date	Jun 28, 2018
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

First claim

What is claimed is:

1. A cable comprising:
at least one inner conductor;
an insulation layer surrounding the inner conductor;
an outer conductive layer including:
a carbon nanotube substrate having opposing face surfaces and edges;
a plurality of metal layers applied as continuous conductive layers over the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate;

the continuous conductive layers including a continuous layer of copper applied as a layer on the carbon nanotube substrate, and a continuous layer of silver applied as a layer on the carbon nanotube substrate, to form a conductive layer of silver and copper;
the metallized carbon nanotube substrate being wrapped to surround the insulation layer and center conductor for forming the outer conductive layer having the conductive layer of silver and copper as an outermost layer, the carbon nanotube substrate and the conductive layer of silver and copper as an innermost layer over the insulation layer;
the metallized carbon nanotube substrate being wrapped at a tension around the insulation layer and center conductor, the tension being proportional to the tensile strength of the metallized carbon nanotube substrate.

2. The cable of claim 1 wherein at least one of the metal layers of the continuous conductive layers is applied to the opposing face surfaces and edges of the carbon nanotube substrate through an electroplating process for forming the metallized carbon nanotube substrate.

3. The cable of claim 2 wherein the at least one of the metal layers is applied to the carbon nanotube substrate through a continuous electroplating process.

4. The cable of claim 1 wherein the inner conductor is at least one of a solid conductor or a stranded conductor.

5. The cable of claim 1 wherein the metallized carbon nanotube substrate is wrapped in an overlap fashion with the innermost conductive layer of silver and copper of a wrap overlapping the outermost layer of the silver and copper of another wrap of the metalized carbon nanotube substrate to surround the insulation layer and inner conductor for forming the outer conductive layer.

6. The cable of claim 5 wherein the wrapped outer conductive layer is wrapped to provide an overlap of 50 percent or above of the innermost conductive layer of the silver and copper overlapping the outermost layer of the silver and copper of the previous wrap of the metalized carbon nanotube substrate.

7. The cable of claim 1 wherein the wrapped outer conductive layer is wrapped at an angle in the range of 40-50 degrees.

8. The cable of claim 7 wherein the wrapped outer conductive layer is wrapped at an angle in the range of 42.5-47.5 degrees.

9. The cable of claim 1 wherein the outer conductive layer includes the layer of copper applied initially as a layer on the carbon nanotube substrate, and the layer of silver applied over the copper layer.

10. The cable of claim 9 wherein the outer conductive layer includes the layer of copper that has a thickness in the range of 30-150 micro-inches and the layer of silver that has a thickness in the range of 40-150 micro-inches.

11. The cable of claim 1 wherein at least one of the plurality of metal layers has a thickness in the range of 30-300 micro-inches.

12. The cable of claim 1 wherein the carbon nanotube substrate has a thickness in the range of 0.0010-0.0020 inches.

13. The cable of claim 1 wherein the carbon nanotube substrate has a width in the range of 0.300-0.500 inches.

14. A cable comprising:
at least one inner conductor;
an insulation layer surrounding the inner conductor;
an outer conductive layer surrounding the inner conductor and insulation layer and including:
at least a first metal layer, including a sublayer of copper and a sublayer of silver;
a carbon nanotube substrate with opposing face surfaces;
at least a second metal layer, including a sublayer of copper and a sublayer of silver;
the sublayers of copper and silver forming continuous conductive layers over each of the opposing face surfaces of the carbon nanotube substrate for capturing the carbon nanotube substrate between the first and second metal layers and forming a metalized carbon nanotube substrate;
the metallized carbon nanotube substrate being wrapped to surround the insulation layer and inner conductor for forming the outer conductive layer, the metallized carbon nanotube substrate being wrapped at a tension around the insulation layer and center conductor, the tension being proportional to the tensile strength of the metallized carbon nanotube substrate.

15. The cable of claim 14 wherein the carbon nanotube substrate includes edges, the edges of the carbon nanotube substrate including a metal layer, including a layer of copper and a layer of silver that couple with the first and second metal layers.

16. The cable of claim 15 wherein the layer of copper and silver applied to form the metalized carbon nanotube substrate includes the sublayer of copper applied initially as a layer on the carbon nanotube substrate, and the sublayer of silver applied over the copper layer.

17. The cable of claim 14 wherein at least one of the first and second metal layers has a thickness in the range of 30-300 micro-inches.

18. The cable of claim 14 wherein the carbon nanotube substrate has a thickness in the range of 0.0010-0.0020 inches.

Assignees

• Carlisle Interconnect Tech Inc

Inventors

• Garrett Natalie
• Souders Ronald A
• Pizzo Nicholas

Classifications

• C25D5/54

  Electroplating of non-metallic surfaces (C25D7/12 takes precedence) · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• H01B1/04

  mainly consisting of carbon-silicon compounds, carbon or silicon · CPC title

• H05K9/0098

  for shielding electrical cables · CPC title

• C25D7/06

  Wires; Strips; Foils · CPC title