Aluminum alloy substrate for magnetic disk, method for producing the same, and magnetic disk using aluminum alloy substrate for magnetic disk

US11423937B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11423937-B2
Application numberUS-201816644612-A
CountryUS
Kind codeB2
Filing dateMay 15, 2018
Priority dateSep 28, 2017
Publication dateAug 23, 2022
Grant dateAug 23, 2022

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

There are provided: an aluminum alloy substrate for a magnetic disk, the aluminum alloy substrate including an aluminum alloy including 0.4 to 3.0 mass % (hereinafter, “%”) of Fe, less than 0.10% of Si, less than 0.10% of Mg, and the balance of Al and unavoidable impurities, in which an Al—Fe-based intermetallic compound having a longest diameter of 2 μm or more and less than 3 μm is dispersed at a distribution density of 1000 particles/mm2 or more, and a Mg—Si-based intermetallic compound having a longest diameter of 1 μm or more is dispersed at a distribution density of 1 particle/mm2 or less; a method for producing the same; and a magnetic disk in which an electroless Ni—P plating treatment layer and a magnetic layer thereon are disposed on a surface of the aluminum alloy substrate for a magnetic disk.

First claim

Opening claim text (preview).

The invention claimed is: 1. An aluminum alloy substrate for a magnetic disk, the aluminum alloy substrate comprising an aluminum alloy comprising 0.4 to 3.0 mass % of Fe, less than 0.10 mass % of Si, less than 0.10 mass % of Mg, and a balance of Al and unavoidable impurities, wherein an Al—Fe-based intermetallic compound having a longest diameter of 2 μm or more and less than 3 μm is dispersed at a distribution density of 1000 particles/mm 2 or more, and a Mg—Si-based intermetallic compound having a longest diameter of 1 μm or more is dispersed at a distribution density of 1 particle/mm 2 or less. 2. The aluminum alloy substrate for a magnetic disk according to claim 1 , wherein the aluminum alloy further comprises one or more selected from a group consisting of 0.1 to 3.0 mass % of Mn, 0.1 to 3.0 mass % of Ni, 0.005 to 1.000 mass % of Cu, 0.01 to 1.00 mass % of Cr, and 0.01 to 1.00 mass % of Zr. 3. The aluminum alloy substrate for a magnetic disk according to claim 1 , wherein the aluminum alloy further comprises 0.005 to 1.000 mass % of Zn. 4. The aluminum alloy substrate for a magnetic disk according to claim 1 , wherein the aluminum alloy further comprises one or more selected from a group consisting of Ti, B, and V in a total content of 0.005 to 0.500 mass % or less. 5. The aluminum alloy substrate for a magnetic disk according to claim 1 , wherein a flatness is 30 μm or less. 6. The aluminum alloy substrate for a magnetic disk according to claim 1 , wherein a tensile strength is 90 MPa or more. 7. A magnetic disk wherein an electroless Ni—P plating treatment layer and a magnetic layer thereon are disposed on a surface of the aluminum alloy substrate for a magnetic disk according to claim 1 . 8. The aluminum alloy substrate for a magnetic disk according to claim 2 , wherein the aluminum alloy further comprises 0.005 to 1.000 mass % of Zn. 9. The aluminum alloy substrate for a magnetic disk according to claim 2 , wherein the aluminum alloy further comprises one or more selected from a group consisting of Ti, B, and V in a total content of 0.005 to 0.500 mass % or less. 10. The aluminum alloy substrate for a magnetic disk according to claim 3 , wherein the aluminum alloy further comprises one or more selected from a group consisting of Ti, B, and V in a total content of 0.005 to 0.500 mass % or less. 11. The aluminum alloy substrate for a magnetic disk according to claim 8 , wherein the aluminum alloy further comprises one or more selected from a group consisting of Ti, B, and V in a total content of 0.005 to 0.500 mass % or less. 12. A method for producing an aluminum alloy substrate for a magnetic disk according to claim 1 , the method comprising: a casting step of casting an ingot by using the aluminum alloy; a hot-rolling step of hot-rolling the ingot; a cold-rolling step of cold-rolling a hot-rolled sheet; a disk blank stamping step of stamping the cold-rolled sheet to have an annular shape; a pressurization annealing step of subjecting a stamped disk blank to pressurization annealing; and a cutting and grinding step of subjecting the disk blank subjected to the pressurization annealing, to cutting work and grinding work, wherein the ingot is hot-rolled at a rolling reduction of 40% or more in a temperature range of 250 to 450° C. in the hot-rolling step. 13. The method for producing an aluminum alloy substrate for a magnetic disk according to claim 12 , the method further comprising a homogenization heat treatment step of heat-treating the ingot at 280 to 620° C. for 0.5 to 60 hours between the casting step and the hot-rolling step. 14. The method for producing an aluminum alloy substrate for a magnetic disk according to claim 12 , the method further comprising an annealing treatment step of annealing the rolled sheet, the annealing treatment step being a batch annealing treatment step performed at 300 to 390° C. for 0.1 to 10 hours or a continuous annealing treatment step performed at 400 to 500° C. for 0 to 60 seconds, before or in the cold-rolling step.

Assignees

Inventors

Classifications

  • Disk carriers · CPC title

  • of aluminium or alloys based thereon · CPC title

  • Aluminium or titanium elemental or alloy substrates · CPC title

  • containing Fe metal or alloys (G11B5/70621 takes precedence) · CPC title

  • Composites or coated substrates · CPC title

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What does patent US11423937B2 cover?
There are provided: an aluminum alloy substrate for a magnetic disk, the aluminum alloy substrate including an aluminum alloy including 0.4 to 3.0 mass % (hereinafter, “%”) of Fe, less than 0.10% of Si, less than 0.10% of Mg, and the balance of Al and unavoidable impurities, in which an Al—Fe-based intermetallic compound having a longest diameter of 2 μm or more and less than 3 μm is dispersed …
Who is the assignee on this patent?
Uacj Corp, Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification G11B5/73913. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 23 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).