Light-emitting module structure

Patent metadata

Field	Value
Publication number	US-11422296-B2
Application number	US-202017134548-A
Country	US
Kind code	B2
Filing date	Dec 28, 2020
Priority date	Apr 19, 2018
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

First claim

What is claimed is:

1. A light-emitting module structure, comprising:
a substrate, wherein the substrate is an opaque substrate;
a plurality of light-emitting diodes disposed on the substrate;
a light-guiding layer covering the light-emitting diodes, wherein the light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and each of the recesses is between the light-emitting diodes; and
a plurality of scattering structures disposed on the substrate, wherein the plurality of scattering structures are covered by the light-guiding layer, and an upper surface of the plurality of scattering structures is lower than the plurality of recesses.

2. The light-emitting module structure of claim 1 , further comprising a plurality of crosstalk resistant structures disposed on the substrate, wherein each of the crosstalk resistant structures is between the light-emitting diodes.

3. The light-emitting module structure of claim 2 , wherein each of the scattering structures is arranged between two adjacent ones of the light-emitting diodes and disposed on two opposite sides of each of the crosstalk resistant structures.

4. The light-emitting module structure of claim 3 , further comprising a plurality of reflection structures disposed on the substrate, wherein each of the reflection structures is arranged between two adjacent ones of the light-emitting diodes and disposed on two opposite sides of each of the crosstalk resistant structures.

5. The light-emitting module structure of claim 2 , wherein the light-emitting diodes are arranged as a regular hexagon, and each of the crosstalk resistant structures is positioned at a center of the regular hexagon.

6. The light-emitting module structure of claim 2 , wherein the crosstalk resistant structures comprise a plurality of cones or a plurality of cylinders, and each of the crosstalk resistant structures has a height that is greater than or equal to a height of the light-emitting diodes.

7. The light-emitting module structure of claim 1 , further comprising at least one reflection structure disposed on a part of the upper surface of the light-guiding layer, wherein the reflection structure has a reflection surface immediately neighboring the upper surface, and the reflection surface is a scattering reflection surface or a mirror reflection surface.

8. The light-emitting module structure of claim 1 , wherein the recesses comprise a plurality of first V-shaped trenches extending along a first direction.

9. The light-emitting module structure of claim 8 , wherein the recesses further comprise a plurality of second V-shaped trenches extending along a second direction, the second direction is different from the first direction, the first V-shaped trenches intersect with the second V-shaped trenches to form a plurality of intersections.

10. The light-emitting module structure of claim 1 , further comprising a transparent glue layer on the upper surface of the light-guiding layer, wherein the transparent glue layer fills the recesses.

11. The light-emitting module structure of claim 10 , wherein the transparent glue layer in the recesses has a protruding glue accumulation portion.

12. The light-emitting module structure of claim 1 , wherein the substrate has at least one cavity, and at least one of the light-emitting diodes is correspondingly disposed in the at least one cavity, wherein the light-emitting diodes are chip size package light-emitting diodes.

Assignees

• Lextar Electronics Corp

Inventors

• Cai Pei-Song
• Lai Lung-Kuan
• Yeh Shih-Yu
• Chen Guan-Zhi
• Liu hong-zhi
• Chang Kuo-Yen
• Li Ching-Hua

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• G02B6/0021 Primary

  for housing at least a part of the light source, e.g. by forming holes or recesses · CPC title

• G02B6/0038 Primary

  Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide · CPC title

• G02B6/0083

  Details of electrical connections of light sources to drivers, circuit boards, or the like · CPC title

• G02B6/0018

  Redirecting means on the surface of the light guide · CPC title